JSTS:Journal of Semiconductor Technology and Science

The Institute of Electronics and Information Engineers (대한전자공학회)
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Fabrication of Micro-inductor and Capacior For RF MEMS Applications

  • Cho, Bek-Hee (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Lee, Jae-Ho (School of Electrical Engineering and Computer Science, Kyungpook National University) ;
  • Bae, Young-Ho (School of Electronic Engineering, Uiduk University) ;
  • Cho, Chan-Sub (School of Electronic and Electrical Engineering, Sangju National University) ;
  • Lee, Jong-Hyun (School of Electrical Engineering and Computer Science, Kyungpook National University)
  • Published : 2002.06.01
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Abstract

In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS(microelectro-mechanical systems) application with high performance and various function. In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro-device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS application with high performance and various functions.

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References

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