• Title/Summary/Keyword: Air-inductors

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Fabrication of Micromachined On-chip High Ratio Air Core Solenoid Inductor (MEMS에 의한 On-chip 고종횡비 Air Core Solenoid 인덕터의 제작)

  • Lee Jeong-Bong;Kim Kyung-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.8
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    • pp.780-784
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    • 2006
  • We present high aspect ratio air-core solenoid inductors with $100{\mu}m\;and\;200{\mu}m$ tall via structures on Pyrex wafer. The effect of various parameters such as different number of turns, via heights, pitch distance between turns on inductor's radio frequency (RF) characteristics have been studied. The highest Q factor we obtained from various solenoid inductors is 72.8 at 9.7 GHz, which was produced by a 3-turn inductor.

Studies on Air-bridge fabrication using thermal evaporation method and its aplication (열적 증착법을 이용한 air-bridge 제작과 그 응용에 관한 연구)

  • 이일형;김성수;윤관기;김상명;이진구
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.12
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    • pp.53-58
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    • 1996
  • In this paper, a simple fabrication technique of an air-bridge for interconnection of isolated electrodes of microwave active and passive devices and MMIC's is proposed. The proposed air-bridge proceses are mainly combinations of thermal evaporation, positive photoresist and image reversal processes for easy lift-off of up to 2.0 .mu.m thick metal. According to the resutls of air-birdge processes, it is confirmed that air-gap and thickness of theair-bridge are about 3.5.mu.m, and 2.0.mu.m, respectively. And it is also possible to make the fine air-bridge with widths of 5~60.mu.m and post-intervals of 25~200.mu.m withot collapse. finally, GaAs power MESFET's and rectangular spiral inductors are fabricatd and measured in order to confirm of feasibility of the proposed air-bridge processes. The MAG of the fabricated power MESFET's is 10dB at 10GHz, and the inductance of the (200.mu. * 6 turns) rectangular spiral inductors 4.5 nH inX-band.

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Implementation of High-Q Bondwire Inductors on Silicon RFIC (RFIC를 위한 실리콘 기판에서의 고품질 본드와이어 인덕터 구현)

  • 최근영;송병욱;김성진;이해영
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.39 no.12
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    • pp.559-565
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    • 2002
  • Today, because a quality factor of the inductor fabricated on silicon substrate for RFIC is under 12, the realization of inductor haying high-Q is essential. In this paper, two inductors having improved Q-factor are proposed and fabricated using a bondwire on silicon substrate. Also for the PGS is applied to the same inductors, four inductors are fabricated finally The bondwire Inductors have the relatively low conductor loss due to wide cross-section area and they can reduce the parastic capacitance very much because they are located in the air. Simulation and measurement results show that the proposed inductors have much more improved Q-factor, 15, than a conventional spiral inductor at 1.5 GHz. Because of the use of an automatic bonding machine, we can fabricate the high - Q inductors very easily, repeatedly.

VPI Varnishing Technology Effects on Frequency Characteristics of an Air Core Inductor Used in LISN Circuit Application

  • Kanzi, Khalil;Kanzi, Majid;Nafissi, Hamidreza
    • Journal of international Conference on Electrical Machines and Systems
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    • v.2 no.1
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    • pp.57-64
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    • 2013
  • The functional characteristic of LISN circuit, which is used for measurements of conductive noise in mains power line, is basically related to frequency characteristics of passive elements like inductors used in the circuit as well as the frequency response of inductors is highly related to the resins used in the varnishing process. The significant problem in determination of an inductor's frequency characteristic is the intrinsic resistance, inductance and parasitic capacitance. In this triplet, the parasitic capacitance is the major limiting factor of inductor's frequency range. This capacitance depends on inductor design parameters and materials filling the spaces of coil like resin and its coherency after curing process. In this paper, two similar inductors were designed and built. The first inductor was not varnished while the second one was varnished with VPI technology. VPI, or Vacuum, Pressure, Impregnation technology is one of the most reliable methods performing good insulating conditions for electrical circuits and windings based on resins. The measured results show that implying varnishing technology does not significantly affect the frequency response. However, due to mechanical solidity aspects and improved environmental protection, it is better to varnish the inductors.

Impedance Properties of Thin Film Inductors by Fabricated Wet Etching Method (습식 식각법으로 제조된 박막 인덕터의 임피턴스 특성)

  • 김현식;송재성;오영우
    • Electrical & Electronic Materials
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    • v.10 no.8
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    • pp.813-818
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    • 1997
  • In this study the thin film air core and magnetic core inductors consisting of planar coil and/or CoNbZr amorphous magnetic layers on a Si substrate were fabricated as spiral type by using rf magnetron sputtering and wet etching methods. The etchant solution was achieved by iron chloride solution(17.5 mol%) mixed with HF (20 mol%) during 150 sec which etched Cu films and CoNbZr/Cu/CoNbZr multi-layer films. They were about 10${\mu}{\textrm}{m}$ of thickness and 10$\times$10 mm$^2$of size. The properties of thin film magnetic core inductor were 400 nH of Q value at 10 MHz and the resonance frequency was about 300 MHz.

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Fabrication of Micro-inductor and Capacior For RF MEMS Applications

  • Cho, Bek-Hee;Lee, Jae-Ho;Bae, Young-Ho;Cho, Chan-Sub;Lee, Jong-Hyun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.2
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    • pp.102-110
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    • 2002
  • In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS(microelectro-mechanical systems) application with high performance and various function. In this paper, we present the fabrication of tunable capacitors and 3-dimensional inductors. This work was related to fabricated 3-dimensional device for need of micro-device in developing new intelligence age. This device was fabricated by electroplating used electroplating PR and high-vacuum evaporation of metal. Fabricated micro-inductor is consisted of air-bridge on electroplating rod and electroplated core. Micro-capacitor is consisted of thin metal membrane and electroplated core. Electroplating material is used Cu metal solvent. Air-gap between metal-layers function as almost perfect isolation layer. The most advantage of our micro-inductor and micro-capacitor compared to present device is a possibility that can fabricate on RF MEMS application with high performance and various functions.

A study on the Empirical Design of EMI Filters for Power Supply Noise Reduction in Electronic Devices (전자기기의 전원 노이즈 저감을 위한 EMI 필터 경험적 설계에 관한 연구)

  • Yun-Min Lee;Jin-Seob, Shin
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.23 no.4
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    • pp.59-64
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    • 2023
  • In this paper, It is proposed through the empirical design of a Conducted EMI filter for noise reduction of power used in electronic devices. For the proposed structure, A-type, B-type, C-type, and D-type structures were designed, and conductive noise reduction was confirmed by using an LC network with various X-capacitors, Y-capacitors, and Air-inductors. 10 [μH] was used for L1 and L2, and 4.7 [nF] was used for C1 and C2. L3 for common mode used 13[μH], and C5, C6, C7 were designed using 10[nF]. The measured insertion loss values of the designed EMI filter were -74.4[dB] at 3.2MHz, -75.4[dB] at 4MHz, and -75.3[dB] at 13.56MHz. Therefore, the proposed EMI filter will be able to reduce power supply noise used in various electronic devices.

A Study on the Fabrication and High Frequency Characteristics of Close type Magnetic Planar Inductor (폐자로형 평면 인덕터의 제조 및 고주파 특성에 관한 연구)

  • 이창호;신동훈;남승의;김형준
    • Journal of the Korean Magnetics Society
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    • v.8 no.4
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    • pp.241-248
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    • 1998
  • In accordance with tendency to miniaturization and high frequency operation of electronic products, extensive efforts of miniaturizing magnetic devices such as inductors, transformers and magnetic sensors are being made. In order to study on fabrication and characteristic of micro-magnetic devices, we carried out two sets of experiments. One is to develop a magnetic film that is suitable for high frequency operation, and the other is to develop the fabrication processes for realizing the micro-coil with meander shape. Magnetic films were composed of FeTa(N,C) fabricated by DC magnetron sputtering system. Their microstructures were nanocrystalline structure and magnetic properties showed Bs:13~17 kG, Hc:0.1~0.2 Oe and $\mu$':2000~4000. Cu coil pattern fabricated by selective electroplating process showed good electrical conductivity. In the case of air core inductors, inductance (L) of 50 nH, resonance frequency $(f_R)$ of 700 MHz, and quality factor (Q) of 30 at 200 MHz could be obtained. In the case of close type magnetic inductors, inductance (L) of 150 nH, resonance frequency $(f_R)$ of 100 MHz, and quality factor (Q) of 4 at 10~30 MHz could be obtained.

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Power Loss Calculation of High Frequency Transformers

  • Choi Geun-Soo;Yoon Shin-Yong;Baek Soo-Hyun;Kim Yong
    • Journal of Electrical Engineering and Technology
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    • v.1 no.3
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    • pp.338-342
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    • 2006
  • This paper analyzed the power loss of transformers considering the magnetic component. For this, each winding strategy and the effect of air gap between the ferrite core have been an important variable for optimal parameter calculation. Inductors are very well known design rules to devise, but the performance of the flyback converter as a function of transformer winding strategy has not been fully developed. The transformer analysis tool used was PExpert. The influence of the insulator thickness, effect of the air gap, how the window height and variation of the capacitive value effects the coil and insulator materials are some of parameters that have been analyzed in this work. The parameter analysis is calculated to a high frequency of 48[kHz]. Therefore, the final goal of this paper was to calculate and adjust the parameters according to the method of winding array and air gap minimizing the power loss.

Coupled Inductor Design Method for 2-Phase Interleaved Boost Converters

  • Liang, Dong;Shin, Hwi-Beom
    • Journal of Power Electronics
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    • v.19 no.2
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    • pp.344-352
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    • 2019
  • To achieve high efficiency and reliability, multiphase interleaved converters with coupled inductors have been widely applied. In this paper, a coupled inductor design method for 2-phase interleaved boost converters is presented. A new area product equation is derived to select the proper core size. The wire size, number of turns and air gap length are also determined by using the proposed coupled inductor design method. Finally, the validity of the proposed coupled inductor design method is confirmed by simulation and experimental results obtained from a design example.