• Title/Summary/Keyword: Air Dielectric Layer

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Improving the Light Extraction Efficiency of GRIN Coatings Pillar Light Emitting Diodes

  • Moe, War War;Aye, Mg;Hla, Tin Tin
    • Korean Journal of Materials Research
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    • v.32 no.6
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    • pp.293-300
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    • 2022
  • This study investigated a graded-refractive-index (GRIN) coating pattern capable of improving the light extraction efficiency of GaN light-emitting diodes (LEDs). The planar LEDs had total internal reflection thanks to the large difference in refractive index between the LED semiconductor and the surrounding medium (air). The main goal of this paper was to reduce the trapped light inside the LED by controlling the refractive index using various compositions of (TiO2)x(SiO2)1-x in GRIN LEDs consisting of five dielectric layers. Several types of multilayer LEDs were simulated and it was determined the transmittance value of the LEDs with many layers was greater than the LEDs with less layers. Then, the specific ranges of incident angles of the individual layers which depend on the refractive index were evaluated. According to theoretical calculations, the light extraction efficiency (LEE) of the five-layer GRIN is 25.29 %, 28.54 % and 30.22 %, respectively. Consequently, the five-layer GRIN LEDs patterned enhancement outcome LEE over the reference planar LEDs. The results suggest the increased light extraction efficiency is related to the loss of Fresnel transmission and the release of the light mode trapped inside the LED chip by the graded-refractive-index.

Analysis of the thermal management of a high power LED package with a heat pipe

  • Kim, Jong-Soo;Kim, Eun-Pil
    • Journal of Advanced Marine Engineering and Technology
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    • v.40 no.2
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    • pp.96-101
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    • 2016
  • The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

Construction Management Method for Asphalt Paving Using Ground Penetrating Radar and an Infrared Camera (지표투과레이더와 적외선카메라를 이용한 아스팔트 포장 시공 관리 방법)

  • Baek, Jongeun;Park, Hee Mun;Yoo, Pyung Jun;Im, Jae Kyu
    • International Journal of Highway Engineering
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    • v.17 no.6
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    • pp.1-9
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    • 2015
  • PURPOSES : The objective of this study is to propose a quality control and quality assurance method for use during asphalt pavement construction using non-destructive methods, such as ground penetrating radar (GPR) and an infrared (IR) camera. METHODS : A 1.0 GHz air-coupled GPR system was used to measure the thickness and in situ density of asphalt concrete overlay during the placement and compaction of the asphalt layer in two test construction sections. The in situ density of the asphalt layer was estimated based on the dielectric constant of the asphalt concrete, which was measured as the ratio of the amplitude of the surface reflection of the asphalt mat to that of a metal plate. In addition, an IR camera was used to monitor the surface temperature of the asphalt mat to ensure its uniformity, for both conventional asphalt concrete and fiber-reinforced asphalt (FRA) concrete. RESULTS : From the GPR test, the measured in situ air void of the asphalt concrete overlay gradually decreased from 12.6% at placement to 8.1% after five roller passes for conventional asphalt concrete, and from 10.7% to 5.9% for the FRA concrete. The thickness of the asphalt concrete overlay was reduced from 7.0 cm to 6.0 cm for the conventional material, and from 9.2 cm to 6.4 cm for the FRA concrete. From the IR camera measurements, the temperature differences in the asphalt mat ranged from $10^{\circ}C$ to $30^{\circ}C$ in the two test sections. CONCLUSIONS : During asphalt concrete construction, GPR and IR tests can be applicable for monitoring the changes in in situ density, thickness, and temperature differences of the overlay, which are the most important factors for quality control. For easier and more reliable quality control of asphalt overlay construction, it is better to use the thickness measurement from the GPR.

Dielectric Waveguide Filters Design Embedded in PCB Substrates using Via Fence at Millimeter-Wave (밀리미터파 대역에서 Via Fence를 이용한 PCB 기판용 유전체 도파관 필터 설계)

  • 김봉수;이재욱;김광선;강민수;송명선
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.15 no.1
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    • pp.73-80
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    • 2004
  • In this paper, the implementation and embedding method of the existing air-filled waveguide-filters at millimeter-wave on general PCB substrate is introduced by systematically inserting the vias inside waveguide and mathematically manipulating the simple equations obtained ken the classical circular-post waveguide filter design. All the metal structures placed vertically such as side wall fur perfect ground plane and circular-post for signal control in the air-filled WR-22 waveguide are replaced with several types of via for constructing the bandpass-filter. Side wall and poles inside waveguide are realized by placing a series array of via and tuning the via diameter. The lengths of x, y, z axis are reduced in proportion to root square of employed substrate dielectric constant and especially the length of z axis can be more reduced due to the characteristics of the wave propagation. Because the mass production on PCB is possible without fabricating a large-scaled metal waveguide of WR-22 as input/output ports at millimeter-wave regime, the manufacturing cost is reduced considerably. Finally, when using multilayer process like LTCC for small-sized module, it is one of advantages to use only one layer f3r the filter fabrication. To evaluate the validity of this novel technique, order-3 Chebyshev BPF(Bandpass-Filter) centered at 40 GHz-band with a 2.5 % FBW (Fractional Bandwidth) were used. The employed substrate has relative dielectric constant of 2.2 and thickness of 10 mil of Rogers RT/Duroid 5880. Accroding to design and measurement results, a good performance of insertion loss of 2 ㏈ and return loss of -30 ㏈ is achieved at full input/output ports.

Stabilizing Properties of SiOF Film with Low Dielectric Constant by $N_2O$ Plasma Annealing ($N_2O$ 플라즈마 열처리에 의한 저유전율 SiOF 박막의 물성 안정화)

  • Kim, Yoon-Hae;Lee, Seok-Kiu;Kim, Sun-Oo;Kim, Hyeong-Joon
    • Korean Journal of Materials Research
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    • v.8 no.4
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    • pp.317-322
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    • 1998
  • The stabilization of low dielectric constant SiOF films prepared by conventional PECVD using TEOS and $C_2F_6$ was evaluated by the $N_2O$-plasma post-deposition annealing. Properties of SiOF film became unstable when it was air-exposed or heat-treated. Water absorption of SiOF films was increased as F content was increased due to the for¬mation of F -Si- F bonds. Also F content of SiOF films decreased after heat treatment. $N_2O$-plasma post-deposition annealing was proved to be effective on stabilizing SiOF films. which was mainly due to the formation of thin SiON layer near the top surface of films. However. the value of dielectric constant was greatly increased again when $N_2O$-plasma post-deposition annealing was done for a long time. To stabilize the SiOF films without an increase of dielec¬tric constant by $N_2O$- plasma post-deposition annealing. the annealing time should be kept the minimum value. to which stabilizing effects against air environment and heat treatment were preserved.

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Fabrication of Thick Silicon Dioxide Air-Bridge and Coplanar Waveguide for RF Application Using Complex Oxidation Process and MEMS Technology (복합 산화법과 MEMS 기술을 이용한 RF용 두꺼운 산화막 에어 브리지 및 공면 전송선의 제조)

  • Kim, Kook-Jin;Park, Jeong-Yong;Lee, Dong-In;Lee, Bong-Hee;Bae, Yong-Hok;Lee, Jong-Hyun;Park, Se-Il
    • Journal of Sensor Science and Technology
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    • v.11 no.3
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    • pp.163-170
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    • 2002
  • This paper proposes a $10\;{\mu}m$ thick oxide air-bridge structure which can be used as a substrate for RF circuits. The structure was fabricated by anodic reaction, complex oxidation and micromachining technology using TMAH etching. High quality films were obtained by combining low temperature thermal oxidation ($500^{\circ}C$, 1 hr at $H_2O/O_2$) and rapid thermal oxidation (RTO) process ($1050^{\circ}C$, 2 min). This structure is mechanically stable because of thick oxide layer up to $10\;{\mu}m$ and is expected to solve the problem of high dielectric loss of silicon substrate in RF region. The properties of the transmission line formed on the oxidized porous silicon (OPS) air-bridge were investigated and compared with those of the transmission line formed on the OPS layers. The insertion loss of coplanar waveguide (CPW) on OPS air-bridge was (about 2dB) lower than that of CPW on OPS layers. Also, the return loss of CPW on OPS air-bridge was less than about -20 dB at measured frequency region for 2.2 mm. Therefore, this technology is very promising for extending the use of CMOS circuitry to higher RF frequencies.

A Circular Micro-Strip Patch Antenna Using a PBG (광 밴드 갭(Photonic Band Gap) 구조를 응용한 원형 마이크로스트립 패치 안테나)

  • Lee Bong-Geol;Jung Chun-Suk;Woo Jong-Woon;Ahn Sang-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.11 s.102
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    • pp.1067-1074
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    • 2005
  • Studied antenna's basic structure was circular micro-strip patch antenna. Bandwidth was broaden and back-radiation pattern was decreased because studied antenna had PBG on a ground for improvement in its defect which is skin-effects. And character of antenna according to different shape of PBG was observed. Finally, air-gap whose dielectric constant is lower than substrates was added between substrates sc respond frequency was higher despite small size antenna.

Thick Film Type duster in Mg2SiO4/Glass composite ceramics for Anion Generation (Mg2SiO4/Glass Composite계 세라믹스를 이용한 음이온 발생용 후막형 클러스터)

  • Yeo, Dong-Hun;Shin, Hyo-Soon;Hong, Youn-Woo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.2
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    • pp.118-123
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    • 2010
  • The eco-friendly technologies have been extended as matter of international concern due to various diseases and syndromes according to an environmental pollution. In this study, we have manufactured a ceramic cluster with thick film type for anion generation equipment which is maximized anion but minimized ozone contents generated. To develop the formulation of ceramic cluster, we conducted the $Mg_2SiO_4$ powders doped with 10 vol% glass frits as Na-Zn-B-O system and sintered at $1050^{\circ}C$ for 2 hours in air for starting materials and investigated the matching properties between the Ag-Pd electrode and the starting materials. The sintered sample for the composition of cluster has 6.7 of dielectric constant and 32 kV/mm of withstand voltage. The yield of anions was measured according to an electrode pattering, discharge gap between electrode, and thickness of electrode protective layer in the cluster of thick film type. We have manufactured the ceramic clusters with optimized thick film structure that have an anion over a hundred particles and the ozone of 0.6 ppb generated.

Studies on Fabrication of Novel Micromachined SIR. Bandpass Filter Using DAMLs (DAML 구조를 이용한 새로운 형태의 SIR대역 통과 여파기의 설계 및 제작)

  • Baek Tae-Jong;Ko Baek-Seok;Kim Sung-Chan;Lim Byeong-Ok;An Dan;Kim Soon=Koo;Shin Dong-Hoon;Rhee Jin-Koo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.7 s.98
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    • pp.760-767
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    • 2005
  • In this paper, we proposed a new type SIR bandpass filter using DAMLs. This filter is consisted of 2 layers with MEMS resonator layer and CPW feed line. DAMLs ring resonator is elevated with $10{\mu}m$ height from GaAs substrate. Using MEMS processing, we are able to realize SIR bandpass filter easily. Furthermore it is useful to integrate on conventional MMICs because it has CPW interfaces and ring resonator is isolated from substrate by air-gap. We optimized and measured the results that $S_{21}$ attenuation at rejected band is over 15 dB, insertion loss is inside the limit of 3 dB, and relative bandwidth is about $10\%$ at 60 GHz.

Improvement of Attenuation Characteristics for Multiple Coupled Line Structure on the Specific Lossy Media (특정 손실 매질위의 다중 결합선로에 대한 손실특성 개선)

  • Kim, Yoon-Suk;Kim, Min-Su
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.48 no.12
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    • pp.35-41
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    • 2011
  • In this paper, an analysis for a new substrate shielding symmetric coupled MIS structure consisting of grounded crossbar at the interface between Si and SiO2 layer using the Finite-Difference Time-Domain(FDTD) method is presented. In order to reduce the substrate effects on the transmission line characteristics, a shielding structure consisting of grounded crossbar lines over time-domain signal has been examined. Parameters of symmetric coupled MIS transmission line with various gaps between crossbars for even- and odd-mode are investigated as the functions of frequency, and the extracted distributed frequency-dependent transmission line parameters and corresponding equivalent circuit parameters as well as quality factor for the new MIS crossbar embedded structure are also presented. It is shown that the quality factor of the symmetric coupled transmission line can be improved without significant change in the characteristic impedance and effective dielectric constant.