• Title/Summary/Keyword: Aging Resistance

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Different oxidative burst patterns occur during host and nonhost resistance responses triggered by Xanthomonas campestris in pepper

  • Kwak, Youn-Sig;Han, Ki-Soo;Lee, Jung-Han;Lee, Kyung-Hee;Chung, Woo-Sik;Mysore, Kirankumar S.;Kwon, Young-Sang;Kim, Hee-Kyu;Bae, Dong-Won
    • Journal of Plant Biotechnology
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    • v.36 no.3
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    • pp.244-254
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    • 2009
  • The hypersensitive reaction (HR) is the most common plant defense reaction against pathogens. HR is produced during both host- and nonhost-incompatible interactions. Several reports suggest that similarities exist between host and nonhost resistances. We assayed the pattern of generation of reactive oxygen species (ROS) and scavenging enzyme activities during nonhost pathogen-plant interactions (Xanthomonas campestris pv. campestris/Capsicum annuum L.) and incompatible host pathogen-plant interactions (Xanthomonas campestris pv. vesicatoria race1/Capsicum annuum L.). Both ${O_2}^-\;and\;H_2O_2 $ accumulated much faster during nonhost resistance when compared to the host resistance. The scavenging enzyme activities of superoxide dismutase (SOD), catalase (CAT) and peroxidase (POX) were also different during the host- and nonhost-incompatible interactions. CAT activity was much higher during nonhost resistance, and several new isozymes of SOD and POX were detected during nonhost resistance when compared to the host resistance. Lipoxygenase (LOX) activity was higher in host resistance than nonhost resistance during the early stages of infection. Interestingly, the nitric oxide (NO) radical accumulated equal amounts during both host and nonhost resistance at early stages of infection. Further studies are needed to determine the specific pathways underlying these differences between host and nonhost resistance responses.

Accelerated Life Prediction of the Rubber for Combat Boots (전투화용 고무의 가속수명예측)

  • Yu, Gun-Sung;Lee, Nam-Rye;Yeo, Yong-Heon;Lee, Beom-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.12
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    • pp.8637-8642
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    • 2015
  • Typical aging for the rubber using the current military adhesive combat boots was spread with a regular aging caused by heat stress. In this study, the aging test of the rubber for combat boots was carried out and the reaction rate constant, k was calculated at aging temperature $60^{\circ}C$, $80^{\circ}C$ and $100^{\circ}C$, using the Arrhenius equation. The lifetime limit was assumed that the tensile strength of the product is reduced to 30%, the elongation is reduced to 50% and abrasion resistance ratio is 380%. ln($P/P_0$) and the lifetime was predicted with the consideration of the activation energy constant. According to the above, the lifetime of the rubber for combat boots with influenced by aging temperature was predicted. As the result, the estimate lifetime at $20^{\circ}C$ was confirmed more than 10 years.

Evaluation of Bonding Properties of Epoxy Solder Joints by High Temperature Aging Test (고온 시효 시험에 따른 Epoxy 솔더 접합부의 접합 특성 평가)

  • Kang, Min-Soo;Kim, Do-Seok;Shin, Young-Eui
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.1
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    • pp.6-12
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    • 2019
  • Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

Effect of Silica Particle Size and Aging Time on the Improvement of Mechanical Properties of Geopolymer-Fiber Composites (실리카의 입자 크기와 Aging 시간이 지오폴리머 섬유 복합체의 기계적 물성 향상에 미치는 효과)

  • Yoonjoo Lee;Seokhun Jang;Minkyeong Oh;Dong-Gen Shin;Doo Hyun Choi;Jieun Lee;Chang-Bin Oh
    • Korean Journal of Materials Research
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    • v.34 no.3
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    • pp.175-183
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    • 2024
  • Geopolymer, also known as alkali aluminum silicate, is used as a substitute for Portland cement, and it is also used as a binder because of its good adhesive properties and heat resistance. Since Davidovits developed Geopolymer matrix composites (GMCs) based on the binder properties of geopolymer, they have been utilized as flame exhaust ducts and aircraft fire protection materials. Geopolymer structures are formed through hydrolysis and dehydration reactions, and their physical properties can be influenced by reaction conditions such as concentration, reaction time, and temperature. The aim of this study is to examine the effects of silica size and aging time on the mechanical properties of composites. Commercial water glass and kaolin were used to synthesize geopolymers, and two types of silica powder were added to increase the silicon content. Using carbon fiber mats, a fiber-reinforced composite material was fabricated using the hand lay-up method. Spectroscopy was used to confirm polymerization, aging effects, and heat treatment, and composite materials were used to measure flexural strength. As a result, it was confirmed that the longer time aging and use of nano-sized silica particles were helpful in improving the mechanical properties of the geopolymer matrix composite.

Studies on the Aging Characteristics in Different Parts of Beeswax-treated Duplicates during Humidified Artificial Aging (습식 인공열화 시 밀랍본 복제품의 제책 부위별 열화특성)

  • Choi, Kyoung-Hwa;Cho, Jung Hye;Kang, Yeong Seok;Yang, Eun Jung;Jeong, Hye Young
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.44 no.5
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    • pp.72-79
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    • 2012
  • In this study, to understand the aging factor and mechanism in different partitions of the beeswax-treated volumes, the duplicated beeswax-treated volume was artificially aged at $80^{\circ}C$ of temperature and 65% of relative humidity and then a physical and optical properties of an aged volumes was analyzed. Also, the degraded components of the beeswax samples isolated from different partitions of aged volumes was measured using a gas chromatography/mass spectroscopy (GC/MS). In results, the surface of beeswax-treated volume which is primarily affected by a main aging factors such as light, oxygen, moisture was more deteriorated than the inside of that volume. However, unlike inside of the book volume which was made from paper, the inside of beeswax-treated volume wax was also considerably deteriorated. The inside of the beeswax-treated volume is largely unaffected by the oxygen and humidity during aging due to the water repellency and the air permeation resistance of beeswax. Therefore, it is confirmed that aging factors and mechanisms in the inside of the volume are different from thats of the outside of the volume. This fact was also verified by the results of GC/MS analysis of an beeswax samples which was sampled from different partitions of aged volumes. As result as GC/MS analysis of the beeswax extracted from the outside of the aged volume, the low molecular compounds with a carbon length of $C_9-C_{20}$ (fatty acid, etc) were increased and the compounds with a carbon length of above $C_{34}$ (ester, etc) were also increased. But the compounds with a chain length of $C_{21}-C_{36}$ (hydrocarbon, alcohol, etc) were decreased. In case of the aged beeswax of inside, the low molecular compounds with a carbon length of $C_9-C_{20}$ (fatty acid, etc) and the compounds with a chain length of $C_{21}-C_{36}$ (hydrocarbon, alcohol, etc) were increased. While, the compounds with a carbon length of above $C_{34}$ (ester, etc) were decreased.

Expression, subcellular localization, and antioxidant role of mammalian methionine sulfoxide reductases in Saccharomyces cerevisiae

  • Kwak, Geun-Hee;Kim, Jae-Ryong;Kim, Hwa-Young
    • BMB Reports
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    • v.42 no.2
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    • pp.113-118
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    • 2009
  • Despite the growing body of evidence suggesting a role for MsrA in antioxidant defense, little is currently known regarding the function of MsrB in cellular protection against oxidative stress. In this study, we overexpressed the mammalian MsrB and MsrA genes in Saccharomyces cerevisiae and assessed their subcellular localization and antioxidant functions. We found that the mitochondrial MsrB3 protein (MsrB3B) was localized to the cytosol, but not to the mitochondria, of the yeast cells. The mitochondrial MsrB2 protein was detected in the mitochondria and, to a lesser extent, the cytosol of the yeast cells. In this study, we report the first evidence that MsrB3 overexpression in yeast cells protected them against $H_2O_2$-mediated cell death. Additionally, MsrB2 overexpression also provided yeast cells with resistance to oxidative stress, as did MsrA overexpression. Our results show that mammalian MsrB and MsrA proteins perform crucial functions in protection against oxidative stress in lower eukaryotic yeast cells.

Mechanical and Physical Property Changes of Cu-Ni-Si-Sn-Fe-P Copper Alloy System According to the Heat Treatment Conditions (열처리조건에 따른 Cu-Ni-Si-Sn-Fe-P 석출경화형 동합금계의 물성변화 특성)

  • Kim, Seung-Ho;Yum, Young-Jin
    • Journal of the Korean Society for Heat Treatment
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    • v.26 no.5
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    • pp.225-232
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    • 2013
  • The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical conductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn-0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector.

Aging Analysis and Reconductoring of Overhead Conductors for Radial Distribution Systems Using Genetic Algorithm

  • Legha, Mahdi Mozaffari;Mohammadi, Mohammad
    • Journal of Electrical Engineering and Technology
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    • v.9 no.6
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    • pp.2042-2048
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    • 2014
  • In medium voltage electrical distribution networks, reforming the loss reduction is important, and in line with this, the issue of system engineering and use of proper equipment Expansion of distribution systems results in higher system losses and poor voltage regulation. Therefore, an efficient and effective distribution system has become more important. So, proper selection of conductors in the distribution system is crucial as it determines the current density and the resistance of the line. Evaluation of aging conductors for losses and costs imposed in addition to the careful planning of technical and economic networks can be identified in the network design. In this paper the use of imperialist competitive algorithm; genetic algorithm; is proposed to optimal branch conductor selection and reconstruction in radial distribution systems planning. The objective is to minimize the overall cost of annual energy losses and depreciation on the cost of conductors to improve productivity given the maximum current carrying capacity and acceptable voltage levels. Simulations are carried out on 69-bus radial distribution network using genetic algorithm approaches to show the accuracy as well as the efficiency of the proposed solution technique.

Intergranular Corrosion of 316L Stainless Steel by Aging and UNSM (Ultrasonic Nano-crystal Surface Modification) treatment (시효열처리 및 UNSM 처리에 따른 316L 스테인리스강의 입계부식거동)

  • Lee, J.H.;Kim, Y.S.
    • Corrosion Science and Technology
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    • v.14 no.6
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    • pp.313-324
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    • 2015
  • Austenitic stainless steels have been widely used in many engineering fields because of their high corrosion resistance and good mechanical properties. However, welding or aging treatment may induce intergranular corrosion, stress corrosion cracking, pitting, etc. Since these types of corrosion are closely related to the formation of chromium carbide in grain boundaries, the alloys are controlled using methods such as lowering the carbon content, solution heat treatment, alloying of stabilization elements, and grain boundary engineering. This work focused on the effects of aging and UNSM (Ultrasonic Nano-crystal Surface Modification) on the intergranular corrosion of commercial 316L stainless steel and the results are discussed on the basis of the sensitization by chromium carbide formation and carbon segregation, residual stress, grain refinement, and grain boundary engineering.

Effects of Electrodeposition condition on the fracture characteristics of 80Sn-20Pb electrodeposits aged at 15$0^{\circ}C$ (15$0^{\circ}C$에서 시효처리한 80Sn-20Pb 합금 도금층의 파괴특성에 전착조건이 미치는 영향)

  • 김정한;서민석;권혁상
    • Journal of the Korean institute of surface engineering
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    • v.27 no.5
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    • pp.292-302
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    • 1994
  • Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

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