• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2001.02a
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• pp.145-148
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• 2001

Bi-2223/Ag HTS tapes fabricated by PIT process are used to make the power transmission cable, motor, fault current limiter, transformer etc. But some problems are still remained as like bubbling, sausaging to got the high Jc. In this study. we carried out the experiment to prevent bubbling in the HTS tape. The bubbling mainly occurred when HTS tape was heat-treating. Therefore, additional vacuum annealing at 400 ~ $600^{\circ}C$and slowly ramp-up sintering method were used to decrease the bubbling. slowly ramp-up sintering was more effective to decrease the bubbling than the vacuum annealing, but Jc was also decreased after heat treatment. Optimum ramp-up sintering schedule was searched to get the high critical current and prevent bubbling at same time.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• Journal of Powder Materials
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• v.29 no.1
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• pp.41-46
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• 2022

In this study, we report the microstructure and characteristics of Ag-SnO₂-Bi₂O₃ contact materials using a controlled milling process with a subsequent compaction process. Using magnetic pulsed compaction (MPC), the milled Ag-SnO₂-Bi₂O₃ powders have been consolidated into bulk samples. The effects of the compaction conditions on the microstructure and characteristics have been investigated in detail. The nanoscale SnO₂ phase and microscale Bi2O3 phase are well-distributed homogeneously in the Ag matrix after the consolidation process. The successful consolidation of Ag-SnO₂-Bi₂O₃ contact materials was achieved by an MPC process with subsequent atmospheric sintering, after which the hardness and electrical conductivity of the Ag-SnO₂-Bi₂O₃ contact materials were found to be 62-75 HV and 52-63% IACS, respectively, which is related to the interfacial stability between the Ag matrix, the SnO₂ phase, and the Bi₂O₃ phase.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.105-106
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• 2012

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.5
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• pp.439-444
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• 2022

Laser-induced plasmonic sintering of metal nanoparticles (NPs) is a promising technology to fabricate flexible conducting electrodes, since it provides instantaneous, simple, and scalable manufacturing strategies without requiring costly facilities and complex processes. However, the metal NPs are quite expensive because complicated synthesis procedures are needed to achieve long-term reliability with regard to chemical deterioration and NP aggregation. Herein, we report laser-induced Ag NP self-generation and sequential sintering process based on low-cost Ag organometallic material for demonstrating high-quality microelectrodes. Upon the irradiation of laser with 532 nm wavelength, pre-baked Ag organometallic film coated on a transparent polyimide substrate was transformed into a high-performance Ag conductor (resistivity of 2.2 × 10^-4 Ω·cm). To verify the practical usefulness of the technology, we successfully demonstrated a wearable transparent heater by using Ag-mesh transparent electrodes, which exhibited a high transmittance of 80% and low sheet resistance of 7 Ω/square.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.71-76
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• 2017

The electrical behavior and flexibility of the screen printed Ag circuits were investigated with infrared radiation sintering times and sintering temperatures. Electrical resistivity and radio frequency characteristics were evaluated by using the 4 point probe measurement and the network analyzer by using cascade's probe system, respectively. Electrical resistivity and radio frequency characteristics means that the direct current resistance and signal transmission properties of the printed Ag circuit. Flexibility of the screen printed Ag circuit was evaluated by measuring of electrical behavior during IPC sliding test. Failure mode of the Ag printed circuits was observed by using field emission scanning electron microscope and optical microscope. Electrical resistivity of the Ag circuits screen printed on Pl substrate was rapidly decreased with increasing sintering temperature and durations. The lowest electrical resistivity of Ag printed circuit was up to $3.8{\mu}{\Omega}{\cdot}cm$ at $250^{\circ}C$ for 45 min. The crack length arisen within the printed Ag circuit after $10{\times}10^4$ sliding numbers was 10 times longer than that of after $2.5{\times}10^4$ sliding numbers. Measured insertion loss and calculated insertion loss were in good agreements each other. Insertion loss of the printed Ag circuit was increased with increasing the number of sliding cycle.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.2
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• pp.119-124
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• 2013

In this study, the two-dimensional transient temperature of printed Ag nanoparticle ink during continuous wave laser sintering was calculated. Ag nanoparticle ink was printed on a glass substrate by inkjet printing. Then, a 532-nm continuous wave laser with different laser intensities was irradiated on the printed Ag nanoparticle ink for 60 s. During laser irradiation, the in-situ specific resistance of the sintered ink was measured. To obtain the transient temperature of the sintered ink during the laser sintering process, a two-dimensional transient heat conduction equation was derived by applying the Wiedemann-Franz law. It was found that the specific resistance of the sintered ink decreased with an increase in the sintering temperature of the printed ink.

• Journal of the Korean Ceramic Society
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• v.44 no.4 s.299
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• pp.208-213
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• 2007

Alumina/silver ($Al_2O_3/Ag$) nanocomposites with Ag content up to 9 vol% were prepared from nanopowder by soaking method using ${\gamma}-Al_2O_3$ of needle type and spark plasma sintering (SPS). The mechanical properties of specimens were investigated three-point flexural strength and toughness as a function of the Ag contents. The maximum flexural strength of the alumina/silver nanocomposite was 850 MPa for the 1 vol% composite, and also higher than monolith alumina as about 800 MPa at 3, 5, and 7 vol% Ag contents. Fracture toughness by single edged V-notch beam (SEVNB) was $4.05MPa{\cdot}m^{1/2}$ for the 3 vol% composite and maintained about $4.00MPa{\cdot}m^{1/2}$ at 5, and 7 vol% Ag content. Microstructure of fracture surface for each fracture specimens was observed. Due to the inhibition effect of alumina grain growth, the average grain size of nanocomposites depends on the content of Ag nano particles. The fracture morphology of nanocomposite with dislocation (sub-grain boundary) by silver nano-particles of second phases in the alumina matrix also showed transgranular fracture-mode compare with intergranular of monolith alumina. Thermal conductivity of specimens at room temperature was about 40 W/mK for the 1 vol% Ag content.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.95-96
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• 2012