Acknowledgement
이 연구는 금오공과대학교 학술연구비로 지원되었음 (2019104167).
References
- M. Mardonova and Y. Choi, Energies, 11, 547 (2018). [DOI: https://doi.org/10.3390/en11030547]
- S. G. Kwon, S. Back, J. E. Park, and B. Kang, J. Mater. Chem. C., 6, 7759 (2018). [DOI: https://doi.org/10.1039/c8tc01915k]
- Y. Xia, K. Sun, and J. Ouyang, Adv. Mater., 24, 2436 (2012). [DOI: https://doi.org/10.1002/adma.201104795]
- T. H. Im, D. Y. Park, H. K. Lee, J. H. Park, C. K. Jeong, D. J. Joe, and K. J. Lee, Part. Part. Syst. Charact., 34, 1 (2017). [DOI: https://doi.org/10.1002/ppsc.201600429]
- M. H. Chung, S. Kim, D. Yoo, and J. H. Kim, Appl. Chem. Eng., 25, 242 (2014). [DOI: https://doi.org/10.14478/ace.2014.1013]
- H. Kim, S. Yang, K. Noh, and S. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 414 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.7.414]
- Y. S. Jo and G. E. Jang, J. Korean Inst. Electr. Electron. Mater. Eng., 31, 408 (2018). [DOI: https://doi.org/10.4313/JKEM.2018.31.6.408]
- P. G. Jamkhande, N. W. Ghule, A. H. Bamer, and M. G. Kalaskar, J. Drug Deliv. Sci. Technol., 53, 101174 (2019). [DOI: https://doi.org/10.1016/j.jddst.2019.101174]
- H. J. Ni, J. G. Liu, Z. H. Wang, and S. Y. Yang, J. Ind. Eng. Chem., 28, 16 (2015). [DOI: https://doi.org/10.1016/j.jiec.015.03.013]
- B. Kang, S. Ko, J. Kim, and M. Yang, Opt. Express., 19, 2573 (2011). [DOI: https://doi.org/10.1364/oe.19.002573]
- Z. Cai, X. Zeng, and J. Liu, J. Electron. Mater., 40, 301 (2011). [DOI: https://doi.org/10.1007/s11664-010-1418-7]
- X. Li, H. Li, J. Liu, X. Qi, and X. Zeng, Appl. Surf. Sci., 233, 51 (2004). [DOI: https://doi.org/10.1016/j.apsusc.2004.03.208]
- S. Latha, M. Shilpa, N. Parushuram, and Y. Sangappa, Proc. AIP Conference Proceedings (AIP Publishing LLC, 2020) p. 020192. [DOI: https://doi.org/10.1063/5.0001143]
- J. H. Park, S. Jeong, E. J. Lee, S. S. Lee, J. Y. Seok, M. Yang, Y. Choi, and B. Kang, Chem. Mater., 28, 4151 (2016). [DOI: https://doi.org/10.1021/acs.chemmater.6b00013]
- M. Knoerr, S. Kraft, and A. Schletz, Proc. 2010 12th Electron. Packag. Technol. Conf. (IEEE, 2010) p. 56. [DOI: https://doi.org/10.1109/EPTC.2010.5702605]
- S. Son, J. E. Park, J. Lee, M. Yang, and B. Kang, Sci. Rep., 6, 1 (2016). [DOI: https://doi.org/10.1038/srep34629]
- Y. H. Yoon, J. W. Song, D. Kim, J. Kim, J. K. Park, S. K. Oh, and C. S. Han, Adv. Mater., 19, 4284 (2007). [DOI: https://doi.org/10.1002/adma.200701173]
- H. E. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 34, 221 (2021). [DOI: https://doi.org/10.4313/JKEM.2021.34.4.221]