• 제목/요약/키워드: Ag diffusion

검색결과 180건 처리시간 0.027초

Enhancement of light reflectance and thermal stability in Ag-Mg alloy contacts on p-type GaN

  • 송양희;손준호;김범준;정관호;이종람
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 춘계학술회의 초록집
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    • pp.18-20
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    • 2010
  • 수조구조의 InGaN LED 소자에 적용이 가능하며 높은 열적안정성을 갖는 저저항 고반사율 p형 오믹 전극을 개발하였다. Ag에 Mg을 첨가하여 p형 전극을 이용하여 $400^{\circ}C$, 공기중에서 1분간 열처리 후 $2.2\;{\times}\;10^{-5}\;{\Omega}cm^2$의 낮은 접촉 저항을 얻을 수 있었고, 460 nm 파장에서 82.6%의 높은 반사율을 획득할 수 있었다. 이는 Mg가 첨가됨에 따라 Ag가 고온에서 집괴되는 원인인 산소-공공 결합을 줄여줌으로써 높은 열적 안정성을 얻게 되었다. Ag를 열처리 할 경우, 외부에 존재하는 산소가 공공 자리에 들어간 후, 산소와 공공의 강한 인력에 의해 산소가 침입형 자리에 들어가서면서 두개의 공공과 강하게 bonding을 갖는 diffusion center가 많이 존재하게 된다. 하지만 Mg가 첨가되었을 경우, Oxygen affinity가 강한 Mg에 산소가 먼저 결합을 이루면서 산소-공공결합을 줄여주게 되어 높은 온도에서도 diffusion이 이루어지지 않고 높은 열적 안정성을 갖게 된다.

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Indium-silver alloy를 이용한 접합의 특성 (The characteristics of joints with In-Ag alloy)

  • 김재욱;김제윤;김상식;성만영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.256-258
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    • 2003
  • Two Si wafers are bonded with indium-silver alloy using diffusion bonding method. When silver and indium thin films are contacted, they diffuse into each other and form inter-metallic compounds like $AgIn_2$, $Ag_2In$, $Ag_3In$ etc. These compounds are determined by ratio of two metals. From phase diagram of Ag-In alloy, we can get the ratio of $Ag_2In$, that has high melting point about 700$^{\circ}C$, approximately 2:1. This ratio was made by controlling of film thickness. And bonding was executed by annealing and adding pressures at a time. The joint of these wafers had been observed by SEM. And we had also seen the EDS (Energy Dispersive Spectroscopy) data to analysis the component of samples.

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다공성 스테인리스 강 지지체의 표면개질에 따른 팔라듐-은 합금 수소 분리막의 수소 투과 선택도의 변화 (Effect of Surface Modification of the Porous Stainless Steel Support on Hydrogen Perm-selectivity of the Pd-Ag Alloy Hydrogen Separation Membranes)

  • 김낙천;김세홍;이진범;김현희;양지혜;김동원
    • 한국표면공학회지
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    • 제49권3호
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    • pp.286-300
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    • 2016
  • Pd-Ag alloy membranes have attracted a great deal of attention for their use in hydrogen purification and separation due to their high theoretical permeability, infinite selectivity and chemical compatibility with hydro-carbon containing gas streams. For commercial application, Pd-based membranes for hydrogen purification and separation need not only a high perm-selectivity but also a stable long-term durability. However, it has been difficult to fabricate thin, dense Pd-Ag alloy membranes on a porous stainless steel metal support with surface pores free and a stable diffusion barrier for preventing metallic diffusion from the porous stainless steel support. In this study, thin Pd-Ag alloy membranes were prepared by advanced Pd/Ag/Pd/Ag/Pd multi-layer sputter deposition on the modified porous stainless steel support using rough polishing/$ZrO_2$ powder filling and micro-polishing surface treatment, and following Ag up-filling heat treatment. Because the modified Pd-Ag alloy membranes using rough polishing/$ZrO_2$ powder filling method demonstrate high hydrogen permeability as well as diffusion barrier efficiency, it leads to the performance improvement in hydrogen perm-selectivity. Our membranes, therefore, are expected to be applicable to industrial fields for hydrogen purification and separation owing to enhanced functionality, durability and metal support/Pd alloy film integration.

Electrochemical Immunosensor Using a Gas Diffusion Layer as an Immobilization Matrix

  • Kim, Yong-Tae;Oh, Kyu-Ha;Kim, Joo-Ho;Kang, Hee-Gyoo;Choi, Jin-Sub
    • Bulletin of the Korean Chemical Society
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    • 제32권6호
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    • pp.1975-1979
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    • 2011
  • The modification of a gas diffusion layer (GDL), a vital component in polymer electrolyte fuel cells, is described here for use in the electrochemical detection of antibody-antigen biosensors. Compared to other substrates (gold foil and graphite), mouse anti-rHBsAg monoclonal antibody immobilized on gold-coated GDL (G-GDL) detected analytes of goat anti-mouse IgG antibody-ALP using a relatively low potential (-0.0021 V vs. Ag/AgCl 3 M NaCl), indicating that undesired by-reactions during electrochemical sensing should be avoided with G-GDL. The dependency of the signal against the concentration of analytes was observed, demonstrating the possibility of quantitative electrochemical biosensors based on G-GDL substrates. When a sandwich method was employed, target antigens of rHBsAg with a concentration as low as 500 ng/mL were clearly measured. The detection limit of rHBsAg was significantly improved to 10 ng/mL when higher concentrations of the 4-aminophenylphosphate monosodium salt (APP) acting on substrates were used for generating a redox-active product. Additionally, it was shown that a BSA blocking layer was essential in improving the detection limit in the G-GDL biosensor.

Programmable Metallization Cell 응용을 위한 Ag-doped 칼코게나이드 박막의 전기적 저항 변화 특성 (Properties on Electrical Resistance Change of Ag-doped Chalcogenide Thin Films Application for Programmable Metallization Cell)

  • 최혁;구상모;조원주;이영희;정홍배
    • 한국전기전자재료학회논문지
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    • 제20권12호
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    • pp.1022-1026
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    • 2007
  • We have demonstrated new functionalities of Ag doped chalcogenide glasses based on their capabilities as solid electrolytes. Formation of such amorphous systems by the introduction of silver via photo-induced diffusion in thin chalcogenide films is considered. The influence of silver on the properties of the newly formed materials is regarded in terms of diffusion kinetics and Ag saturation is related to the composition of the hosting material. Silver saturated chalcogenide glasses have been used in the formation of solid electrolyte which is the active medium in programmable metallization cell (PMC) devices. In this paper, we investigated electrical and optical properties of Ag-doped chalcogenide thin film on changed thickness of Ag and chalcogenide thin films, which is concerned at Ag-doping effect of PMC cell. As a result, when thickness of Ag and chalcogenide thin film was 30 nm and 50 nm respectively, device have excellent characteristics.

Programmable Metallization Cell(PMC) 소자에서 Ag와 칼코게나이드 박막의 두께에 따른 전기적 광학적 특성 (Electrical and Optical Properties on Thickness of Ag and Chalcogenide Thin Films at Programmable Metallization Cell Device)

  • 최혁;정홍배
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.24-24
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    • 2007
  • We have demonstrated new functionalities of Ag doped chalcogenide glasses based on their capabilities as solid electrolytes. Formation of such amorphous systems by the introduction of silver via photo-induced diffusion in thin chalcogenide films is considered. The influence of silver on the properties of the newly formed materials is regarded in terms of diffusion kinetics and Ag saturation is related to the composition of the hosting material. Silver saturated chalcogenide glasses have been used in the formation of solid electrolyte which is the active medium in programmable metallization cell (PMC) devices. In this paper, we investigated electrical and optical properties of Ag-doped chalcogenide thin film on changed thickness of Ag and chalcogenide thin films, which is concerned at Ag-doping effect of PMC cell. As a result, when thickness of Ag and chalcogenide thin film was 30nm and 50nm respectively, device have excellent characteristics.

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Transfer Matrix를 사용하여 예측한 $TiO_2$/Ag/$TiO_2$ 박막의 광학적 성질 및 스퍼터 증착된 박막과의 특성 비교 (Prediction of the optical properties of $TiO_2$/Ag/$TiO_2$ films using transfer matrix and comparisions with real transmittance measured on the sputter-deposited films)

  • 김진일;김진현;김영환;오태성
    • 한국재료학회지
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    • 제5권1호
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    • pp.140-148
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    • 1995
  • Transfer matrix를 사용하여 $TiO_{2}$ 및 Ag 단일 박막과 $TiO_{2}/Ag/TiO_{2}$ 다층 박막의 두계에 따른 투과도 특성을 예측하였으며, 이를 실제 스퍼터 증착하여 제조한 박막의 광학 특성과 비교하였다. $TiO_{2}$ 및 Ag 박막에서는 복소굴절률을 사용하므로써 실제 증착박막에서 측정된 특성과 근접한 투과도 곡선의 예측이 가능하였다. $TiO_{2}/Ag/TiO_{2}$ 3층 박막의 광학 특성은 Ag의 $TiO_{2}$층으로의 확산 및 응집에 의해 transfer matrix로 예측한 투과도 특성과 전혀 다른 거동을 나타내었다. 그러나 4nm 및 6nm 두계의 Ti 박막을 확산방지층으로 증착한 Ti$O_{2}$/Ti/Ag/Ti/Ti$O_{2}$ 구조의 5층 박막에서는 transfer matrix를 사용하여 예측한 $TiO_{2}/Ag/TiO_{2}$ 3층 박막의 투과도 곡선과 유사한 광학 특성을 얻을 수 있었다.

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저온 Cu/Ag-Ag/Cu 본딩에서의 Ag 나노막 효과 (Effect of Ag Nanolayer in Low Temperature Cu/Ag-Ag/Cu Bonding)

  • 김윤호;박승민;김사라은경
    • 마이크로전자및패키징학회지
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    • 제28권2호
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    • pp.59-64
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    • 2021
  • 차세대 반도체 기술은 이종소자 집적화(heterogeneous integration)를 이용한 시스템-인-패키징(system-inpackage, SIP) 기술로 발전하고 있고, 저온 Cu 본딩은 SIP 구조의 성능 향상과 미세 피치 배선을 위해서 매우 중요한 기술이라 하겠다. 본 연구에서는 porous한 Ag 나노막을 이용하여 Cu 표면의 산화 방지 효과와 저온 Cu 본딩의 가능성을 조사하였다. 100℃에서 200℃의 저온 영역에서 Ag가 Cu로 확산되는 것보다 Cu가 Ag로 확산되는 것이 빠르게 관찰되었고, 이는 저온에서 Ag를 이용한 Cu간의 고상 확산 본딩이 가능함을 나타내었다. 따라서 Ag 나노막을 이용한 Cu 본딩을 200℃에서 진행하였고, 본딩 계면의 전단 강도는 23.27 MPa로 측정되었다.

Uniform Ag Thin Film Growth on an Sb-terminated Si(111) Surface

  • Park, Kang-Ho;Ha, Jeong-Sook;Lee, El-Hang
    • ETRI Journal
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    • 제19권2호
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    • pp.71-81
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    • 1997
  • We report on the room-temperature-growth of highly uniform and ultrathin Ag films on Sb-terminated Si(111) surfaces, as evidenced from a scanning tunneling microscopy (STM) study in an UHV system. With predeposition of one monolayer (ML) of Sb, uniform growth of Ag islands was observed at room temperature. The Sb layer suppresses the surface diffusion of Ag atoms on Si surface and increases the Ag island density, and then the increased island density is believed to cause coalescence of Ag islands before the beginning of multilayer growth in higher coverages, resulting in the growth of atomically flat and uniform islands on the Sb surfactant layer.

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Microstructure and electrical properties of high power laser thermal annealing on inkjet printed Ag films

  • Yoon, Yo-Han;Yi, Seol-Min;Yim, Jung-Ryoul;Lee, Ji-Hoon;Joo, Young-Chang
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.36.2-36.2
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    • 2009
  • In this work, the high power CW Nd:YAG laser has been used for thermal treatment of inkjet printed Ag films-involving eliminating organic additives (dispersant, binder, and organic solvent) of Ag ink and annealing Ag nanoparticles. By optimizing laser parameters, such as laser power and defocusing value, the laser energy can totally be converted to heat energy, which is used to thermal treatment of inkjet printed Ag films. This results in controlling the microstructures and the resistivity of films. We investigated the thermal diffusion mechanisms during laser annealing and the resulting microstructures. The impact of high power laser annealing on microstructures and electrical characteristic of inkjet printed Ag films is compared to those of the films annealed by a conventional furnace annealing. Focused ion beam (FIB) channeling image shows that the laser annealed Ag films have large columnar grains and dense structure (void free), while furnace annealed films have tiny grains and exhibit void formation. Due to these microstructural characteristics of laser annealed films, it has better electrical property (low resistivity) compared to furnace annealed samples.

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