• Title/Summary/Keyword: Ag annealing

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Microstructure and Electrical Conductivity of Cu-16 at % Ag Microcomposite (Cu-16 at % Ag 미세복합재료의 미세구조와 전도도)

  • Im, Mun-Su;An, Jang-Ho;Hong, Sun-Ik
    • Korean Journal of Materials Research
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    • v.9 no.6
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    • pp.569-576
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    • 1999
  • In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

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Effect of PCB Surface Finishs on Intermetallic Compound Growth Kinetics of Sn-3.0Ag-0.5Cu Solder Bump (Sn-3.0Ag-0.5Cu 솔더범프의 금속간화합물 성장거동에 미치는 PCB 표면처리의 영향)

  • Jeong, Myeong-Hyeok;Kim, Jae-Myeong;Yoo, Se-Hoon;Lee, Chang-Woo;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.1
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    • pp.81-88
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    • 2010
  • Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow.

Rapid Thermal Annealing 열처리 온도에 따른 유기태양전지용Nb:$TiO_2$/Ag/Nb:$TiO_2$ 다층 투명전극의 전기적, 광학적, 구조적 및 표면 특성 연구

  • Park, Ho-Gyun;Park, Yong-Seok;Jeong, Jin-A;Choe, Gwang-Hyeok;Na, Seok-In;Kim, Han-Gi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.197-197
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    • 2010
  • 본 연구에서는 RF/DC dual 마그네트론 스퍼터 시스템을 이용하여 Glass 기판 상에 유기태양전지용 Nb-doped $TiO_2$ (NTO)/Ag/NTO 다층 투명전극을 성막하고 이 다층 투명전극을 $200^{\circ}C{\sim}700^{\circ}C$ 온도 범위에서 급속 열처리 (Rapid Thermal Annealing ; RTA)를 통하여 전기적, 광학적, 구조적 및 표면의 특성 변화를 연구하였다. Hall effect measurement, UV-Vis spectrometer, FESEM 분석을 통하여 다층투명전극의 전기적, 광학적, 표면분석을 하였고 Synchrotron 분석을 통하여 온도에 따른 구조변화를 분석하였다. 상온에서 성막된 다층투명전극은 30nm 두께의 NTO 박막 사이에 얇은 9nm의 얇은 Ag 층을 삽입한 구조로써 10ohm/square 이하의 매우 낮은 면저항과 ${\sim}10^{-5}\;ohm-cm$ 의 비저항, Anti-reflection 효과에 의해 85% 이상의 높은 광투과성을 나타내었다. RTA 온도가 증가함에 따라 전기적, 광학적 특성은 약간 향상되었고 비정질 구조를 유지함을 알 수 있었다. 그러나 높은 온도범위에서는 비정질 구조에서 Anatase 상으로 결정구조가 변화함을 알 수 있었고 전기적, 광학적 특성이 감소됨을 알 수 있었다. NTO/Ag/NTO 다층 투명전극을 유기태양전의 Anode로 적용하여 특성을 비교한 결과 RTA 온도가 증가함에 따라 유기태양전지의 효율 또한 증가하였고 최적화된 온도 조건에서 2.49% 의 높은 효율을 얻을 수 있었다. 이를 통해 우수한 특성을 나타내는 NTO/Ag/NTO 다층투명전극이 기존의 디스플레이 및 태양전지 등의 투명전극 재료로 주로 사용되어 온 ITO (Indium Tin Oxide) 를 대체 할 수 있는 재료로써의 가능성을 제시하였다.

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A Study on the E-textiles Dip-Coated with Electrically Conductive Hybrid Nano-Structures

  • Lee, Euna;Kim, Jongjun
    • Journal of Fashion Business
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    • v.21 no.6
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    • pp.16-30
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    • 2017
  • Currently, e-textile market is rapidly expanding and the emerging area of e-textiles requires electrically conductive threads for diverse applications, including wearable innovative e-textiles that can transmit/receive and display data with a variety of functions. This study introduces hybrid nano-structures which may help increase the conductivity of the textile threads for use in wearable and flexible smart apparels. For this aim, Ag was selected as a conductive material, and yarn treatment was implemented where silver nanowire (AgNW) and graphene flake (GF) hybrid structures overcome the limitations of the AgNW alone. The yarn treatment includes several treatment conditions, e.g., annealing temperature, annealing time, binder material such as polyurethane (PU), coating time, in order to search for the optimum method to form stable conductive nano-scale composite materials as thin film on the surface of textile yarns. Treatedyarns showed improved electrical resistance readings. The functionality of the spandex yarn as a stretchable conductive thread was also demonstrated. When the yarn specimens were treated with colloid of AgNW/GF, relatively good electrical conductivity value was obtained. During the extension and recovery cycles of the treated yarns, the initial resistance values did not deteriorate significantly, since the network of nanowire structure with the support of GF and polyurethane stayed flexible and stable. Through this research, it was found that when one-dimensional structure of AgNW and two-dimensional structure of GF were mixed as colloids and treated on the surface of textile yarns, flexible and stretchable electrical conductor could be formed.

Enhancement of Photoluminescence by Ag Localized Surface Plasmon Resonance for Ultraviolet Detection

  • Lyu, Yanlei;Ruan, Jun;Zhao, Mingwei;Hong, Ruijin;Lin, Hui;Zhang, Dawei;Tao, Chunxian
    • Current Optics and Photonics
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    • v.5 no.1
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    • pp.1-7
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    • 2021
  • For higher sensitivity in ultraviolet (UV) and even vacuum ultraviolet (VUV) detection of silicon-based sensors, a sandwich-structured film sensor based on Ag Localized Surface Plasmon Resonance (LSPR) was designed and fabricated. This film sensor was composed of a Ag nanoparticles (NPs) layer, SiO2 buffer and fluorescence layer by physical vapour deposition and thermal annealing. By tuning the annealing temperature and adding the SiO2 layer, the resonance absorption wavelength of Ag NPs matched with the emission wavelength of the fluorescence layer. Due to the strong plasmon resonance coupling and electromagnetic field formed on the surface of Ag NPs, the radiative recombination rate of the luminescent materials and the number of fluorescent molecules in the excited state increased. Therefore, the fluorescent emission intensity of the sandwich-structured film sensor was 1.10-1.58 times at 120-200 nm and 2.17-2.93 times at 240-360 nm that of the single-layer film sensor. A feasible method is provided for improving the detection performance of UV and VUV detectors.

Formation of Size-controllable Ag Nanoparticles on Si Substrate by Annealing (크기 조절이 가능한 은 나노입자 형성을 위한 박막의 열처리 효과)

  • Lee, Sang Hoon;Lee, Tae Il;Moon, Kyeong-Ju;Myoung, Jae Min
    • Korean Journal of Materials Research
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    • v.23 no.7
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    • pp.379-384
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    • 2013
  • In order to produce size-controllable Ag nanoparticles and a nanomesh-patterned Si substrate, we introduce a rapid thermal annealing(RTA) method and a metal assisted chemical etching(MCE) process. Ag nanoparticles were self-organized from a thin Ag film on a Si substrate through the RTA process. The mean diameter of the nanoparticles was modulated by changing the thickness of the Ag film. Furthermore, we controlled the surface energy of the Si substrate by changing the Ar or $H_2$ ambient gas during the RTA process, and the modified surface energy was evaluated through water contact angle test. A smaller mean diameter of Ag nanoparticles was obtained under $H_2$ gas at RTA, compared to that under Ar, from the same thickness of Ag thin film. This result was observed by SEM and summarized by statistical analysis. The mechanism of this result was determined by the surface energy change caused by the chemical reaction between the Si substrate and $H_2$. The change of the surface energy affected on uniformity in the MCE process using Ag nanoparticles as catalyst. The nanoparticles formed under ambient Ar, having high surface energy, randomly moved in the lateral direction on the substrate even though the etching solution consisting of 10 % HF and 0.12 % $H_2O_2$ was cooled down to $-20^{\circ}C$ to minimize thermal energy, which could act as the driving force of movement. On the other hand, the nanoparticles thermally treated under ambient $H_2$ had low surface energy as the surface of the Si substrate reacted with $H_2$. That's why the Ag nanoparticles could keep their pattern and vertically etch the Si substrate during MCE.

Effect of thermo-mechanical treatment on fabrication of Ag tapes for YBCO coated conductor (차세대 선재 기판용 Ag 테이프의 제조공정에서 가공 열처리가 집합조직에 미치는 영향)

  • Lee, N.J.;Oh, S.S.;Park, C.;Song, K.J.;Ha, D.W.;Kwon, Y.K.;Ryu, K.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.04a
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    • pp.46-49
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    • 2002
  • The aim of this paper is to investigate the influence of various deformation ratio on texture of Ag tapes that can be used as a RE-$Ba_2Cu_3O_{7-{\delta}}$ coated conductor tapes without any buffer layer. We fabricated as-rolled Ag substrate with various deformation ratio per step. Thickness and total deformation ratio of Ag tapes were $100{\mu}m$ and >98%, respectively. And as-rolled Ag substrate was annealed at $750^{\circ}C$ for 30min. The as-rolled and recrystallization textures were measured using x-ray pole figures and orientation distribution function (ODF) analysis. With the increase of rolling ratio from 5 to 20%, deformation texture are changed from {1l0}<311> to {1l0}<112>, {032}<100>, {051}<211>. After recrystallization by annealing, main texture was observed to {013}<100> under present condition.

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The fine structure and physical properties of Nylon6/AgO bicomponent fiber on drawing and annealing (Nylon6 / AgO복합섬유의 연신 및 열처리에 따른 미세구조와 물성)

  • 김동환;이선희;정호규;조현혹
    • Proceedings of the Korean Fiber Society Conference
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    • 2003.04a
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    • pp.239-242
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    • 2003
  • 고분자 물질은 여러 가지 물질과 복합체를 형성하여 물리적 성질을 향상시켜왔다. 특히 유ㆍ무기물질의 복합체는 의류용, 산업용 차원에서 관심이 증대되고 있으며, 유ㆍ무기 입자가 첨가된 고분자 복합소재는 고분자 매트릭스에 기계적, 열적 특성을 향상시킬 뿐만 아니라 이들의 다양한 기능성을 부여할 수 있다.[1] 최근 수 십 년 동안 자연 오염문제로 인하여 섬유분야에서도 항균 처리가 관심이 증대되고 있다. (중략)

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