• 대한치과보철학회지
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• 제31권3호
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• pp.423-446
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• 1993

Titanium and its alloys are finding increasing use in medical devices and dental implants. The strong selling point of titanium is its resistance to the highly corrosive body fluids in which an implant must survive. This corrosion resistance is due to a tenacious passive oxide or film which exists on the metal's surface and renders it passive. Potentiodynamic polarization measurement is one of the most commonly used electro-chemical methods that have been applied to measure corrosion rates. And the potentiodynamic polarization test supplies detailed information such as open circuit, rupture, and passivation potential. Furthermore, it indicates the passive range and sensitivity to pitting corrosion. This study was designed to compare the corrosion resistance of the commonly used dental implant materials such as CP Ti, Ti-6A1-4V, Co-Cr-Mo alloy, and 316L stainless steel. And the effects of galvanic couples between titanium and the dental alloys were assessed for their useful-ness-as. materials for superstructure. The working electrode is the specimen , the reference electrode is a saturated calomel electrode (SCE), and the counter electrode is made of carbon. In $N_2-saturated$ 0.9% NaCl solutions, the potential scanning was performed starting from -800mV (SCE) and the scan rate was 1 mV/sec. At least three different polarization measurements were carried out for each material on separate specimen. The galvanic corrosion measurements were conducted in the zero-shunt ammeter with an implant supraconstruction surface ratio of 1:1. The contact current density was recorded over a 24-hour period. The results were as follows : 1. In potential-time curve, all specimens became increasingly more noble after immersion in the test solution and reached between -70mV and 50mV (SCE) respectively after 12 hours. 2. The Ti and Ti alloy in the saline solution were most resistant to corrosion. They showed the typical passive behavior which was exhibited over the entire experimental range. Therefore no breakdown potentials were observed. 3. Comparing the rupture potentials, Ti and Ti alloy had the high(:st value (because their break-down potentials were not observed in this study potential range ) followed by Co-Cr-Mo alloy and stainless steel (316L). So , the corrosion resistance of titanium was cecellent, Co-Cr-Mo alloy slightly inferior and stainless steel (316L) much less. 4. The contact current density sinks faster than any other galvanic couple in the case of Ti/gold alloy. 5. Ag-Pd alloy coupled with Ti yielded high current density in the early stage. Furthermore, Ti became anodic. 6. Ti/Ni-Cr alloy showed a relatively high galvanic current and a tendency to increase.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.323-329
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• 2020

The cathodic hydrogen evolution ability of different pure metals and their long term galvanic corrosion behavior with pure Mg were investigated. The hydrogen evolution ability of pure Ti, Al, Sn and Zr is weak, while that of Fe, W, Cr, and Co is very strong. Initial polarization test could not completely reveal the cathodic behavior of the tested metals during long term corrosion. The cathodic hydrogen evolution ability may vary significantly in the long term galvanic tests for different metals, especially for Al whose cathodic current density reduced to 1/50 of the initial value. The anodic polarization shows that Al and Sn as alloying elements are supposed to provide relatively good passive effect for Mg alloy, while Ag can provide a slight passive effect and Zn has little passive effect.

• Journal of Welding and Joining
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• 제32권3호
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• 한국세라믹학회지
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• 제56권4호
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• pp.394-398
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• 2019

In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2000년도 High Temperature Superconductivity Vol.X
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• pp.248-251
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• 2000

The fabrication and characteristics of HTS race-track type field coil for generators was carried out. Field coils are composed of 3 pancake coils wound by 37-filamental Bi-2223/Ag-alloy tapes. The winding machine is horizontal type. The critical currents (I$_c$) of the superconducting tapes were measured with variation of bending strain and external magnetic fields. I$_c$ of both whole field coils and 3 pancake coils were measured as a function of temperature. At 77K under the self-field, I$_c$ of whole field coils was 12A, while in the case of middle pancake coil, I$_c$ was 15A. The distribution of magnetic field B was obtained, using 3-D FEM. Our simulation showed that maximums of B${\bot}$A in x-y plane were locally distributed in both the upper and the lower coils. In addition, the fabrication processes and the characteristics of field coil are described.

• 동굴
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• 제76호
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• pp.49-55
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• 2006

The submicron $YBa_2Cu_3O_x$ powder was prepared by the sol-gel method. The particle size is distributed from 0.2 to 1.0 ${\mu}m$, which benefits to eliminate the micro-cracks formed in the $YBa_2Cu_3O_x$ films deposited by electrophoresis. The powder was single phase of $YBa_2Cu_3O_x$ examined by X-ray diffraction. In the sol-gel process the citrate gel was formed from citric acid and nitrate solution of $Y_2O_3$, $Ba(NO_3)_2$ and CuO. When pH values were adjusted to 6.4-6.7, $Ba(NO_3)_2$ could be dissolved in the citrate solution completely. Appropriate evaporative temperature of the sol-gel formation is discussed. Acetone is used as electrophoreticsolution, in which some water and iodine (0.2 g/1) and polyethylene glycol (2 vol. %) are added. The concentrations of $YBa_2Cu_3O_x$ powders is 20g/l. The thickness of deposited film could be more than 50 ${\mu}m$ in 3 minutes of depositing time. The most EPD films could be 90K zero resistance and the Jc values were over 1000A/cm2 (0 H, 77 K).

• 한국표면공학회지
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• 제39권6호
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• pp.302-311
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• 2006

Nowadays the open-type lead-acid battery for vehicle use is being replaced with the sealed-type because it needs no maintenance and has a longer cycle life. Thus researches on this battery are being conducted very actively by many advanced battery companies. There is, however, a serious problem with the maintenance free(MF) battery that its cathode electrode has a limited cycle life due to a corrosion of grid. In this study, it was aimed to improve a corrosion resistance of the cathode grid which is commonly made of Pb-Ca alloy for a mechanical strength. For this purpose, various amounts of alloying elements such as Sn, Ag and Ba were added singly or together to the Pb-Ca alloys and investigated their corrosion behaviors. Batteries fabricated by using these alloys as cathode grids were subjected to life cycle test and their corrosion layers appeared at the interface between the grids and the active materials were carefully observed in order to clarify effects of alloying elements.

• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 한국초전도ㆍ저온공학회논문지
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• 제7권4호
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• pp.4-9
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• 2005

The degradation behavior of the critical current $(I_c)$ of Bi-2223 superconducting tapes under pressurized liquid nitrogen were investigated using a newly developed p-shaped sample holder which gives a series of bending strains to a sample. Three kinds of commercially available multi-filamentary Bi-2223 superconducting tapes were used. At atmospheric pressure, the Ie degradation behavior depended on the manufacturing process undergone by each tape. The tapes externally reinforced or densified by over pressure showed better bending strain tolerance than the Ag alloy-sheathed Bi-2223 tape. But these tapes showed a significant $I_c$ degradation when pressurized to 1 MPa in liquid nitrogen. For all samples, after depressurization to atmospheric pressure from 1 MPa, the Ie was completely recovered to its initial values at atmospheric pressure. When the samples were subjected to a thermal cycle wherein the tape was warmed up to room temperature after being depressurized from 1 MPa, it was found that the larger degradation of $I_c$ occurred at the regions where significant ballooning occurred, such as $0\%\;and\;0.2\%$. However, an improved ballooning damage tolerance was observed in the highly-densified tape.

• 대한치과기공학회지
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• 제22권1호
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• pp.69-78
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• 2000

The microstructure and corrosion behavior of commercially dental casting gold alloys were investigated to clarify the effect of burn-out temperature and cooling rate. In the case of water quenching after casting, only the αphase, which is typical dendritic microstructure of golda alloy, was detected. However, the precipitates along the grain boundary were detected only at the slow cooling rate and they increased inversely proportional to the burn-out temperature. This might be due to the time difference which solute atom could diffuse. EPMA and SEM results also demonstrated that the precipitate should be lamellar structure consisted of Ag rich phase(${\alpha}_1$) and Cu rich phase (${\alpha}_2$). In terms of corrosion, the galvanic coupling was formed due to the difference of composition between precipitates and matrix at the slow cooling rate. In the case of water quenching, the critical current density($i_p$) which indicate the degree of corrosion was lowest at $650^{\circ}C$ and below the burnout temperature, $i_p$ increased with it because of the effect of grain boundary segregation. But above the temperature, $i_p$ increased with it. This may be due to the strain field effect by residual thermal stress.