• Proceedings of the Korean Institute of Building Construction Conference
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• 2011.05a
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• pp.111-114
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• 2011

Waterprooping Method with sheet need to study technology and multilateral verification considering the arctic conditions as low temperature and humidity, which is the result only considered of material aspects without environmental condition in construction But there are no measures up until now. To solve this problem by using high frequency induction heating method developed waterproof sheets, cold (5 ℃ or less) can be applied in a more stable environment, water-resistant materials and construction methods were studied for development. The results of the test showed that high frequency induction heating method is effective for usability in low temperature condition and securement of proper quality than existing Waterprooping Method with sheet need.

• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.361-370
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• 2017

Through the use of finite element analysis and acoustic emission techniques we have evaluated the interfacial failure of a carbon fiber reinforced polymer (CFRP) repair patch on a notched aluminum substrate. The repair of cracks is a very common and widely used practice in the aeronautics field to extend the life of cracked sheet metal panels. The process consists of adhesively bonding a patch that encompasses the notched site to provide additional strength, thereby increasing life and avoiding costly replacements. The mechanical strength of the bonded joint relies mainly on the bonding of the adhesive to the plate and patch stiffness. Stress concentrations at crack tips promote disbonding of the composite patch from the substrate, consequently reducing the bonded area, which makes this a critical aspect of repair effectiveness. In this paper we examine patch disbonding by calculating the influence of notch tip stress on disbond area and verify computational results with acoustic emission (AE) measurements obtained from specimens subjected to uniaxial tension. The FE results showed that disbonding first occurs between the patch and the substrate close to free edge of the patch followed by failure around the tip of the notch, both highest stress regions. Experimental results revealed that cement adhesion at the aluminum interface was the limiting factor in patch performance. The patch did not appear to strengthen the aluminum substrate when measured by stress-strain due to early stage disbonding. Analysis of the AE signals provided insight to the disbond locations and progression at the metal-adhesive interface. Crack growth from the notch in the aluminum was not observed until the stress reached a critical level, an instant before final fracture, which was unaffected by the patch due to early stage disbonding. The FE model was further utilized to study the effects of patch fiber orientation and increased adhesive strength. The model revealed that the effectiveness of patch repairs is strongly dependent upon the combined interactions of adhesive bond strength and fiber orientation.

• Journal of Conservation Science
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• v.34 no.3
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• pp.157-166
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• 2018

In this study, gelatin binding ability was increased by adding cross linking agent to improve adhesive characteristic of animal glue. Animal glue added genipin measured gel strength and viscosity, the structural analysis, the color retention degree, elution degree, and rupture strength. And the water resistance and ultraviolet light resistance with the addition of genipin were compared. As a result of the study, the gel strength and viscosity increased with the amount of genipin. As a result of the structural analysis, in gelatin, the absorption peak of the triple structure of collagen structurally stabilized was observed. As a result of the color retention degree, the film was observed because of the lowered brightness. The amount of elution glue was increased with addition of genipin at $50^{\circ}C$ distilled water condition and rupture strength has increased with the amount of genipin. In the water resistance and light fastness, there was no appearance before and after deterioration due to the addition of genipin. Based on the results of this study, it confirmed the adhesive characteristics of animal glue added genipin and examined the experimental method applicable for animal glue. After the addition of genipin, flexibility, re-solving, adhesive force, and curing speed, which are unique characteristics of glue, can be improved without disappearing, so it is expected that it will be applicable to production of animal glue and conservation of cultural heritage when homogeneous glue is secured.

• Journal of the korean academy of Pediatric Dentistry
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• v.35 no.2
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• pp.216-224
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• 2008

The purpose of this study was to evaluate the effectiveness of fissurotomy and double application time of acidic primer of self-etching adhesive system of acid treatment on enamel surfaces for prevention of microleakage of pit and fissure sealants. The microleakage of pit and fissure sealants was evaluated by measuring the penetration depth of methylene blue solution. Specimens were divided by 4 groups according to the method of treatment. Group I: 35% phosphoric acid etching, 20 seconds. Group II: Priming with self-etching primer, 20 seconds. Group III: Priming with self-etching primer, 40 seconds. Group IV: Priming with self-etching primer, 20 seconds, after fissurotomy. The etched pattern produced on enamel was observed using a scanning electron microscope. Obtained data were analysed statistically using Kruscal-Wallis test followed by Mann-Whitney test for comparison of groups. The results are as follows: 1. Microleakage scores of group IV priming with self-etching primer 20 seconds after fissurotomy was the lowest. 2. Microleakage scores between group II and group III were not shown significant difference. 3. Enamel for 20 seconds etching with 35% phosphoric acid was observed the most effective etching pattern. And the etching pattern on the fissure enamel with self-etching adhesive 20 seconds after fissurotomy was more prominent than group II, III only using self-etching primer.

• Restorative Dentistry and Endodontics
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• v.36 no.5
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• pp.385-396
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• 2011

Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

• Journal of Adhesion and Interface
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• v.16 no.2
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• pp.69-75
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• 2015

Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.49-55
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• 2016

In this study, we designed an environment friendly, water-based adhesive using the acrylic emulsion method as a replacement for solvent-based adhesives, which are most commonly used in layered laminates for flexible food packaging. We designed adhesives with different combinations of anionic, non-ionic, and phosphoric ester surfactants, and with different concentrations of chain transfer agent (CTA). We also examined the effect of the degree of cross-linking by synthesizing and comparing 8 test group adhesives with different types of functional monomers. Additionally, we synthesized 2 other test group pressure-sensitive adhesives (PSA) using styrene/alpha-methyl styrene/acrylic acid (SAA) semipolymer dispersing agents (with molecular weights of 13,000 g/mol and 8,600 g/mol, respectively) to replace the conventional surfactants. We evaluated whether the 10 test group pressure-sensitive adhesives met the basic physical property criteria required for flexible food packaging by carrying out a physical analysis of their glass transition temperature (Tg), particle size, adhesion, and molecular weight. In our test, 2 test group adhesives manufactured with the combination of anionic and non-ionic surfactants, CTA concentration of 0.2%, and functional monomers of hydroxyethyl acrylate (HEA) and glycidyl methacrylate (GMA) demonstrated molecular weight and flexibility suitable for flexible packaging, with low adhesiveness and small particle size.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Restorative Dentistry and Endodontics
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• v.34 no.5
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• pp.397-405
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• 2009

This study compared the effect of an activator, intermediate bonding resin and low-viscosity flowable resin on the microtensile bond strength of a self-curing composite resin used with two-step total etching adhesives. Twenty extracted permanent molars were used. The teeth were assigned randomly to nine groups (n=10) according to the adhesive system and application of additional methods (activator, intermediate adhesive, flowable resin). The bonding agents and additional applications of each group were applied to the dentin surfaces. Self-curing composite resin buildups were made for each tooth to form a core, 5mm in height. The restored teeth were then stored in distilled water at room temperature for 24h before sectioning. The microtensile bond strength of all specimens was examined. The data was analyzed statistically by one-way ANOVA and a Scheffe's test. The application of an intermediate bonding resin (Optibond FL adhesive) and low-viscosity flowable resin (Tetric N-flow) produced higher bond strength than that with the activator in all groups. Regardless of the method selected, Optibond solo plus produced the lowest ${\mu}TBS$ to dentin. The failure modes of the tested dentin bonding agents were mostly adhesive failure but there were some cases showed cohesive failure in the resin.