• 제목/요약/키워드: Adhesion time

검색결과 766건 처리시간 0.029초

직접블렌딩 기술과 접착제 조성이 고무복합체 물성에 미치는 영향 (Adhesion Properties of Rubber Composite with Direct Blending Technique and Adhesive Composition)

  • 이성재;장영욱;정경호
    • Elastomers and Composites
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    • 제34권3호
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    • pp.253-261
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    • 1999
  • 조성이 다른 접착제를 포함한 고무혼합물의 가교특성은 접착제 조성에서 탄닌이 많이 포함될수록 스코치 시간은 증가하였으며 경화속도는 다소 감소하는 것으로 보아 탄닌 분자의 크기와 형태 때문에 초기 가교반응을 지연시킴과 동시에 경화속도 역시 다소 지연됨을 알 수 있었다. 이들 고무혼합물의 인장물성 역시 탄닌이 많이 함유된 접착제를 고무에 혼합할수록 고무혼합물의 인장강도는 다소 감소하였다. 이는 탄닌이 많이 함유될수록 가교반응을 지연시켜 전체 고무혼합물의 가교도가 감소하기 때문일 것으로 사료되었다. 또한 접착제의 조성이 고무-섬유 접착에 미치는 영향을 보강코드로서 나일론 610 모노필라멘트를 사용하여 TCAT(Tire Cord Adhesion Test) 방법으로 조사하였다. 레소시놀-탄닌-포름알데히드-라텍스(RTFL) 접착제 조성에서 레소시놀 1 mole당 포름알데히드의 mole 비가 증가할수록 접착력은 증가하였고 대략 포름알데히드 5mole 이상에서 최적의 접착력을 나타냈다. 보강코드상의 접착제 수확량(DPU) 역시 최종 접착력에 영향을 미치지만, 나일론 610 모노필라멘트의 경우는 접착제 조성에 따른 DPU가 거의 일정하여 접착력의 차이는 접착제의 조성 중 탄닌의 거동 때문으로 해석될 수 있었다.

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수용성염에 의한 고무의 접착특성 및 기계적 강도 (A Study on Adhesion of Mechanical Properties of Rubber by Water-soluble salt)

  • 김성혜;전준하;엄기용
    • 접착 및 계면
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    • 제19권2호
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    • pp.55-59
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    • 2018
  • 본 연구는 신발의 겉창인 고무 접착공정에서 버핑, 산, 알칼리 프라이머 전처리 공정을 생략하여 공정의 간소화로 생산 효율을 높이기 위해 수용성염을 포함하는 고무에 대한 접착특성과 기계적 특성을 고찰하였다. 산성염, 염기성염, 중성염을 평가한 결과, 염기성염을 포함된 고무 성형물의 경우 수성 접착제에 대해 우수한 접착효과를 보였다. 이는 염기성염이 하이드로옥시염으로 존재함에 따라 고무표면이 친수화 되면서 수성접착제에 우수한 접착효과를 보였다. 이것은 접촉각 및 IR측정으로 확인할 수 있었다. 또한, 염기성염이 포함된 고무 성형물의 경우 가교밀도가 증가되어 마모 특성 및 경도는 증가하지만 가교시간을 지연시키는 요인으로 작용하였다.

HTPB계 추진제/라이너/내열재의 접착력 향상에 관한 연구 (A Study on Improvement of Adhesion HTPB Propellant/Liner/Insulation)

  • 박성준;송종권;박의용;노태호;최성한
    • 한국추진공학회지
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    • 제23권4호
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    • pp.92-97
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    • 2019
  • 추진제, 라이너 그리고 내열재간의 접착력을 향상시키기 위한 연구를 수행하였다. 내열재에 아무런 처리하지 않은(Bare) 상태보다는 피막처리제를 적용한 것이 접착력 향상에 유리하였다. 라이너 도포 두께가 증가할수록 내열재와 추진제간의 접착력이 향상되는 것을 확인하였으며, 라이너 경화는 24시간 경화 시간이 필요하며, 그 이상의 과경화는 접착력에 불리한 영향을 끼친다. 또한 결합제를 적용할 때가 적용하지 않을 때보다 접착력에 유리하다는 것을 알 수 있었으며, 결합제 함량이 증가할수 록 접착력도 상승하였다. 결합제 종류에 따른 접착력 변화는 HX-868이 HX-752보다 접착력이 소폭 향상되었다.

친수 및 소수처리 PET직물의 고형오구의 세척성 (Detergency of Particulate Soil of PET Fabric Finished with Hydrophilic and Hydrophobic Chemicals)

  • 강인숙
    • 한국의류학회지
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    • 제36권11호
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    • pp.1237-1245
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    • 2012
  • The effect of hydrophilicity and hydrophobicity of PET fabric on the detergency of particulate soil were investigated as functions of the concentration of hydrophilic and hydrophobic chemicals, surfactant concentration, ionic strength, adhesion and removal time, and pH. The detergency of the particulate soil was determined by the adhesion of particles to and their removal from fabric, the PET fabric and ${\alpha}-Fe_2O_3$ were used as textile materials and for the model of particulate soil, respectively. The hydrophilic and hydrophobic finish for PET fabric was treated with a polyester, silicone and fluorine organic compound of resin respectively. The adhesion of particulate soil to fabric treated with hydrophobic chemicals were slightly higher but its removal from fabric treated with hydrophobic chemicals was largely higher than fabric treated with a hydrophilic chemical regardless of solution conditions such as the concentration of hydrophilic and hydrophobic chemicals, surfactant concentration, ionic strength, adhesion and removal time, and pH. Therefore, hydrophobic treatment for fabric had a more positive effect than the hydrophilic treatment on the detergency of particulate soil.

접촉 역학적 접근에 의한 점탄성/탄성, 점탄성/점탄성 재료간의 접합 에너지 측정 (A Measurement of Adhesion Energy between Viscoelastic/Elastic, Viscoelastic/Viscoelastic Materials Using Contact Mechanics Approach)

  • 이찬;엄윤용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1030-1035
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    • 2003
  • The nanoimprint lithography technology makes higher density of semiconductor device and larger capacity of storage media. In this technology the induced damage while detaching polymer pattern from mold should be minimized. In order to analyze the problem, the basic knowledge of adhesion between the polymer and the mold is required. In this study a contact experiment of polyisobutylene specimen with spherical steel tip and polyisobutylene bead tip was conducted using nano indenter. During the contact experiment with various loading rate under load control the contact behavior of viscoelastic material was measured, i.e., the load and displacement between the tip and the specimen were measured. The data was analyzed by HBK model to obtain the stress intensity factor of contact edge and the contact radius as a function of time. Also the adhesion energies between steel/polyisobutylene and polyisobutylene/polyisobutylene were obtained employing the analysis of the crack of viscoelastic material by Schapery.

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부착력과 임피던스를 이용한 에폭시 도장재 열화 특성에 관한 실험적 평가 (Experimental Evaluation on Degradation Characteristics of Epoxy Coating by Using Adhesion Force and Impedance)

  • 나환선;김노유;권기주;송영철
    • 한국구조물진단유지관리공학회 논문집
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    • 제7권2호
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    • pp.149-157
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    • 2003
  • The purpose of this paper is to quantitatively investigate aging state of epoxy coating on containment structure at nuclear power plant. In order to evaluate an physical bonding of the epoxy coating, adhesion test was performed on a degraded epoxy coating on concrete specimens fabricated by accelerated aging experiment. In addition, impedance data by ultrasonic test were measured to compare with adhesion data. From almost 50 % of the specimens, aging phenomena of epoxy coating such as pin hole, blistering was discovered. To improve reliability on quality degradation of epoxy, co-relation between two kinds of different data was analyzed. By tracing co-related these data, it was possible to figure out physical state of as-built epoxy coating. The possibility to develop new methodology of time - dependent aging state on epoxy coating was found and discussed.

플라스틱 BGA 패키지의 아르곤 가스 플라즈마 처리 효과 (Effect of Ar Gas Plasma Treatment of Plastic Ball Grid Array Package)

  • 신영의;김경섭
    • 한국전기전자재료학회논문지
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    • 제13권10호
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    • pp.805-811
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    • 2000
  • Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

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Influence of Surface Treatment of Polyimide Film on Adhesion Enhancement between Polyimide and Metal Films

  • Park, Soo-Jin;Lee, Eun-Jung;Kwon, Soo-Han
    • Bulletin of the Korean Chemical Society
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    • 제28권2호
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    • pp.188-192
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    • 2007
  • In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

Influence of processing parameters for adhesion strength of TiAlN films prepared by Arc Ion Plating

  • 주윤곤;;조동율;윤재홍
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2007년도 추계학술대회 논문집
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    • pp.136-137
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    • 2007
  • Wear resistant TiAlN thin film has been widely deposited on the surface of cutting and forming tools by using Arc Ion Plating. TiAlN films are deposited by the processes designed by the Taguchi L18 experimental design. The L18 experimental design is applied to achieve surface properties and adhesion. The deposition parameters are working pressure, substrate temperature, bias voltage, arc power and pre-sputtering bias voltage and time. The most influential parameters on surface properties and adhesion are substrate bias voltage, working nitrogen pressure and arc power. The optimal coating processes are obtained for surface properties and adhesion.

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Determination of the Failure Paths of Leadframe/EMC Joints

  • Lee, H.Y.;Kim, S.R.
    • 한국표면공학회지
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    • 제33권4호
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    • pp.241-250
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    • 2000
  • Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

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