• Title/Summary/Keyword: Adhesion improvement

검색결과 378건 처리시간 0.028초

폴리머 모르타르를 이용한 콘크리트관 라이닝의 접착에 관한 연구 (A Study on the Adhesion of Concrete Pipe Lining Using Polymer Mortar)

  • 정학용;조영국;소양섭
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 1997년도 가을 학술발표회 논문집
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    • pp.357-362
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    • 1997
  • The purpose of this study is to evaluate the adhesion of concrete pipe lining using polymer mortar. The polymer mortars with various mix proportions are prepared, and tested for flexural and compressive strengths, adhesion in tension, and the aspects of lining surface and workability are evaluated. Form the test results, it is apparent that the appropriate polymer mortars of lining to concrete pipe can be produced. The flexural and compressive strengths of polymer mortar for lining are affected by type of resin, and aggregates content, and water content at the surface of concrete pipe is important factor for improvement in adhesion of polymer mortar. It is obvious that the economical polymer mortars having an excellent cost performance ration can be produced through this study.

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Thickness Characteristics and Improved Surface Adhesion of a Polypyrrole Actuator by Analysis of Polymerization Process

  • Ryu Jaewook;Jung Senghwan;Lee Seung-Ki;Kim Byungkyu
    • Journal of Mechanical Science and Technology
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    • 제19권10호
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    • pp.1910-1918
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    • 2005
  • Characterizing electrochemical polymerization of polypyrrole film on a substrate depends on many parameters. Among them, potential difference and cumulative charges play important role. The level of potential difference affects the quality of the polypyrrole. On the contrary, cumulative charge affects the thickness of the polypyrrole. The substrate surface is adjusted physically and chemically by treating with sandblasting and the addition of thiol for surface adhesion improvement. Experimental results show that the sandblasted and thiol treated substrate provides better. adhesion than non-sandblasted and non-thiol treated substrate.

플라스틱 BGA 패키지의 아르곤 가스 플라즈마 처리 효과 (Effect of Ar Gas Plasma Treatment of Plastic Ball Grid Array Package)

  • 신영의;김경섭
    • 한국전기전자재료학회논문지
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    • 제13권10호
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    • pp.805-811
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    • 2000
  • Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

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Preparation and Characterization of Anionic Emulsified Asphalt with Enhanced Adhesion Properties

  • Lee, Eun-Kyoung
    • Elastomers and Composites
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    • 제50권4호
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    • pp.304-313
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    • 2015
  • In this study, the anionic emulsified asphalt was prepared by dispersing asphalt particles evenly into water with combination of anionic and nonionic surfactants. Effects of NaOH and $CaCl_2$ on the phase stability of the emulsified asphalt were also investigated through zeta potential value and rheology behavior; the emulsified asphalt added with NaOH and $CaCl_2$ showed higher zeta potential value than that the asphalt with addition of only anionic and nonionic surfactants. In addition, with regard to shear thinning behaviors, it was found that pH of the emulsified anionic asphalt and $Ca^{2+}$, counter ion, affected the phase stability. SBR (styrene-butadiene-rubber) latex, EPD (water dispersed Epoxy), PU (polyurethane) and RI-10S, SBS (styrene-butadiene-styrene)-based property improvement additive, were used and studied to enhance the adhesion properties with the aggregates. RI-10S, however, was found to be only compatible with the anionic emulsified asphalt; the coating rate, adhesion and compression strength were increased with the RI-10S content.

Simultaneous Improvement of Formaldehyde Emission and Adhesion of Medium-Density Fiberboard Bonded with Low-Molar Ratio Urea-Formaldehyde Resins Modified with Nanoclay

  • WIBOWO, Eko Setio;LUBIS, Muhammad Adly Rahandi;PARK, Byung-Dae
    • Journal of the Korean Wood Science and Technology
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    • 제49권5호
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    • pp.453-461
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    • 2021
  • In wood-based composite panels, low-molar ratio (LMR) urea-formaldehyde (UF) resins usually result in reduced formaldehyde emission (FE) at the expense of poor adhesion. However, the FE and adhesion of medium-density fiberboard (MDF) bonded with LMR UF resins were both improved in this study. The modified LMR UF resins with transition metal ion-modified bentonite (TMI-BNT) nanoclay simultaneously improved the FE and adhesion of MDF panels. The modified LMR UF resins with 5% TMI-BNT resulted in a 37.1% FE reduction and 102.6% increase in the internal bonding (IB) strength of MDF panels. Furthermore, thickness swelling and water absorption also significantly decreased to 13.0% and 24.9%, respectively. These results imply that TMI-BNT modification of LMR UF resins could enhance the formation of a three-dimensional network rather than crystalline domains, resulting in improved cohesion.

Ag/에폭시간 계면 접착력 향상을 위한 전해 실란 처리 (Electrolytic silane deposition to improve the interfacial adhesion Ag and epoxy substrate)

  • 공원효;박광렬;류호준;배인섭;강성일;최승회
    • 한국표면공학회지
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    • 제56권1호
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    • pp.77-83
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    • 2023
  • The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

HTPB계 추진제/라이너/내열재의 접착력 향상에 관한 연구 (A Study on Improvement of Adhesion HTPB Propellant/Liner/Insulation)

  • 박성준;송종권;박의용;노태호;최성한
    • 한국추진공학회지
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    • 제23권4호
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    • pp.92-97
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    • 2019
  • 추진제, 라이너 그리고 내열재간의 접착력을 향상시키기 위한 연구를 수행하였다. 내열재에 아무런 처리하지 않은(Bare) 상태보다는 피막처리제를 적용한 것이 접착력 향상에 유리하였다. 라이너 도포 두께가 증가할수록 내열재와 추진제간의 접착력이 향상되는 것을 확인하였으며, 라이너 경화는 24시간 경화 시간이 필요하며, 그 이상의 과경화는 접착력에 불리한 영향을 끼친다. 또한 결합제를 적용할 때가 적용하지 않을 때보다 접착력에 유리하다는 것을 알 수 있었으며, 결합제 함량이 증가할수 록 접착력도 상승하였다. 결합제 종류에 따른 접착력 변화는 HX-868이 HX-752보다 접착력이 소폭 향상되었다.

표면처리에 의한 왕겨분말-폴리프로필렌 바이오복합재의 계면 접착력 향상 (Improvement of Interfacial Adhesion for Surface treated Rice Husk Flour-Filled Polypropylene Bio-Composites)

  • 이병호;김희수;최성우;김현중
    • Journal of the Korean Wood Science and Technology
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    • 제34권3호
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    • pp.38-45
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    • 2006
  • 본 연구의 목적은 왕겨분말을 NaOH와 acetic acid 처리를 통하여 왕겨분말-폴리프로필렌(PP) 바이오복합재의 계면 결합을 증가시키는 것이다. 처리하지 않은 왕겨분말, NaOH와 acetic acid 처리된 왕겨분말을 충전제로 사용하여 바이오복합재를 제조한 후 왕겨분말의 처리에 대한 효과를 조사하였다. NaOH와 acetic acid 처리된 왕겨분말이 충전된 바이오복합재의 인장강도가 처리하지 않은 왕겨분말이 충전된 바이오복합재보다 증가하였다. NaOH와 acetic acid로 처리 전후의 왕겨분말 표면은 scanning electron microscopy (SEM)의 사진으로 명확하게 관찰할 수 있었다. SEM을 이용하여 측정한 결과 왕겨분말 표면의 이물질이 제거된 것을 발견 할 수 있었다. NaOH와 acetic acid 처리된 왕겨분말의 화학적 구조는 fourier transform infrared (FTIR)을 이용하여 분석하였다. 처리하지 않은 왕겨분말, NaOH와 acetic acid로 처리된 왕겨분말의 결정화구조 및 결정화도는 wide-angle X-ray scattering (WAXS)을 이용하여 분석하였다.

코로나 처리를 이용한 신발용 나일론 직물의 접착력 향상 (Improvement of Adhesion of Footwear Nylon Fabric by Corona Treatment)

  • 이재호
    • 접착 및 계면
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    • 제7권3호
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    • pp.26-33
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    • 2006
  • 나일론 직물들이 전류세기 5, 10, 15, 20 A, 공급속도 5, 10, 15 m/min로 코로나 처리되었다. 나일론 직물의 표면변화를 X-ray 회절장치, 주사전자현미경(SEM)과 X-ray 광전자분석기(ESCALAB)로 확인하였다. 또한 물리적 성질의 변화를 인장 인열강도, 접착 및 습윤강도를 통하여 측정하였다. 접착에 사용된 접착제는 열경화성 반응형 폴리우레탄 핫 멜트 접착제이다. 대기압에서 코로나 방전처리에 의해 나일론 직물에 관능기들이 도입되어졌고, 그 결과 접착력은 향상되었다. 코로나 처리된 나일론 직물의 접착강도는 전류 세기가 증가할수록, 공급속도가 감소할수록 증가하였다.

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리드프레임/EMC 계면의 파괴 인성치 (Fracture Toughness of Leadframe/EMC Interface)

  • 이호영;유진
    • 한국표면공학회지
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    • 제32권6호
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    • pp.647-657
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    • 1999
  • Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

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