한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제56권1호
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  • Pages.77-83
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  • 2023
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
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Ag/에폭시간 계면 접착력 향상을 위한 전해 실란 처리

Electrolytic silane deposition to improve the interfacial adhesion Ag and epoxy substrate

  • 투고 : 2023.01.11
  • 심사 : 2023.01.31
  • 발행 : 2023.02.28
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초록

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

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참고문헌

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