• International Journal of Highway Engineering
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• v.18 no.2
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• pp.29-36
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• 2016

PURPOSES: The objective of this study is to determine the milling temperature that minimizes the binder-induced damage to the aggregate; this is achieved by evaluating the temperature dependence of the viscosity of the asphalt binder, with the aim of developing an effective heating process for warm in-place recycling. METHODS : The validity of the indoor test was confirmed by conducting an internal heating test based on the on-site heating test. In addition, the adhesive power of the binder was measured at various temperatures ($30^{\circ}C$, $40^{\circ}C$, $50^{\circ}C$, $60^{\circ}C$, $70^{\circ}C$) via three types of measuring methods. RESULTS: The surface temperature spectrum of field test was slight different with that of laboratory test. But, the spectra of inner temperature between the field and the laboratory was almost similar. Also, the adhesion of the asphalt binder was measured from $30^{\circ}C$ to $70^{\circ}C$. The adhesion of the binder was significantly decreased from $60^{\circ}C$. Contrary to other temperature, the adhesion was slightly changed from $60^{\circ}C$ to $70^{\circ}C$. Also the inner temperature between two different heating methods was shown similar temperature spectra. CONCLUSIONS: The pavement heating temperature spectrum of hot in place recycling method was simulated by a laboratory test. Based on this study, the optimum temperature was $60^{\circ}C{\sim}70^{\circ}C$ for reducing aggregate damage during milling process. The susceptibility heating method developed in this study can be maintained the optimum inner temperature range.

• Korean Journal of Optics and Photonics
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• v.34 no.5
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• pp.185-191
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• 2023

We report the results of evaluating the hardness, flexibility, and adhesion between the protective layer and the stealth sheet after applying a protective layer to improve the practicality of the flexible stealth sheet. The result of the ISO 15184 pencil hardness test showed that the hardness increased from HB to 3H by three grades when a protective layer was applied. The flexibility evaluation was conducted by bending the material against cylinders of certain diameters and observing whether cracks occurred according to the ASTM D522 test method. The result showed that the minimum diameter was 0.125 inches. The adhesion was evaluated by using the ASTM D3359 test method, attaching and peeling off an adhesive strip to the protective layer and determining the proportion of the protective layer peeling off. The result was 5B, which is better than the military adhesion limit of 4B.

• The Journal of Korean Academy of Prosthodontics
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• v.49 no.3
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• pp.245-253
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• 2011

Purpose: The aim of this in vitro study was to estimate surface characteristic after peptide coating and investigate biological response of human mesenchymal stem cell to anodized titanium discs coated with RGD peptide by physical adhesion and chemical fixation. Materials and methods: Fluorescence isothiocyanate (FITC) modified RGD-peptide was coated on the anodized titanium discs (diameter 12 mm, height 3 mm) using two methods. One was physical adhesion method and the other was chemical fixation method. Physical adhesion was performed by dip and dry procedure, chemical fixation was performed by covalent bond via silanization. In this study, human mesenchymal stem cell was used for experiments. The experiments consisted of surface characteristic evaluation after peptide coating, analysis about cell adhesion, proliferation, differentiation, and mineralization. Obtained data are statistically treated using Kruskal-Wallis test and Bonferroni test was performed as post hoc test (P=.05). Results: The evaluation of FE-SEM images revealed no diffenrence at micro-surfaces between each groups. Total coating dose was higher at physical adhesion experimental group than at chemical fixation experimental group. In cell adhesion and proliferation, RGD peptide coating did not show a statistical significance compared with control group (P>.05). In cell differentiation and mineralization, physical adhesion method displayed significantly increased levels compared with control group and chemical fixation method (P<.05). Conclusion: RGD peptide coating seems to enhance osseointegration by effects on the response of human mesenchymal stem cell. Especially physical adhesion method showed more effective than chemical fixation method on response of human mesenchymal stem cell.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Journal of the Korean Society for Railway
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• v.8 no.4
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• pp.367-371
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• 2005

Pile foundations are utilized when soil is so weak that shallow foundations are not suitable or point load is concentrated in small area. Such soil can be formed by the land reclamation works which have extensively been executed along the coastal line of southern and western parts of the Korean Peninsula. The working load at pile is sometimes subjected to not only compression load but also lateral load sad uplift forces. But in most of the practice design, uplift capacity of pile foundation is not considered and estimation of uplift capacity is presumed on the compression skin friction. This study was carried out to determine that the effect of embedment ratio and loading rate on uplift adhesion factor of concrete pile driven in clay. Based on the test results, the critical embedment ratio is about 9. Adhesion factor is constant under the critical embedment ratio, and decreasing over the critical embedment ratio. Also, adhesion factor is increased with the loading rate is increased.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1744-1748
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• 2007

In this study, the Johnson-Kendall-Roberts (JKR) theory was combined with the instrumented indentation technique (IIT) to evaluate work of adhesion and modulus of elastomeric polymer. Indentation test was used to obtain the load-displacement data for contacts between Tungsten Carbide indenter and elastomeric polymer. And the JKR contact model, contrived to take viscoelastic effects of polymer into account, was applied to compensate the contact area and the elastic modulus which Hertzian contact model would underestimate and overestimate, respectively. Besides, we could obtain the thermodynamic work of adhesion by considering the surface energy in this contact model. In order to define the relation between JKR contact area and applied load without optical measuring of contact area, we used the relation between applied load and contact stiffness by examining the correlation between JKR contact area and stiffness through dimensional analysis with 14 kinds of elastomeric polymer. From this work, it could be demonstrated that the interfacial work of adhesion and elastic modulus of compliant polymer can be obtained from a simple instrumented indentation testing without area measurement, and provided as the main algorithm of compliant polymer characterization.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

• Journal of the Korean Home Economics Association
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• v.20 no.2
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• pp.45-51
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• 1982

Degree of separation and adhesion of dye and stain particles has been measured usually by the rate of reflection of light. However, it could be proved that the relation between the quantity of stain and the rate of reflection greatly varied with kinds of stain and states of adhesion. For this study, several pieces of cotton and polyester having different states of stain adhesion were prepared by staining them with two kinds of artificial stain different in color: Ferric Oxide and Ferric Oxynate. Every piece went through soilremoval test which employed two surfactants: Anionic LAS and Cationic M2-100. After the operation, relations between quantity of pre-soilremoval stain and rate of reflection were measured, as well as those between quantity of post-soilremoval stain and rate of reflection. Rate of reflection and quantity of stain were not proportional in measurement to the pieces stained with Ferric Oxide and Ferric Oxynate. The consequence was also the same with cotton and polyester. That held true of the fat-stained textile. With the same quantity of stain, rate of reflection varied according to the magnitude of stain particles, and the state of adhesion influenced the magnitude of stain particles a great deal.

• Journal of the Korean institute of surface engineering
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• v.39 no.6
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• pp.268-275
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• 2006

In this study, effect of sputtering on the plasma-nitriding substrate and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrZrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution, surface roughness. This in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrZrN coatings showed an approximately 1.4 times increase in the adhesion strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.