• Elastomers and Composites
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• v.29 no.2
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• pp.121-130
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• 1994

The physical properties of rubber blend between natural rubber(NR) and ethylene propylene diene terpolymer(EPDM) were investigated as a study of EPDM composite materials. For EPDM/NR blends, the effects of ethylene and diene contents in EPDM, blend ratio, dicumyl peroxide(DCP) curing system on the physical properties, interfacial adhesion force and dynamic crack growth etc. were studied. EPDM/NR blends loaded with carbon black were prepared by mechanical mixing and cured by plate heating cure press. Crosslinking density was measured by swelling method with toluene. The physical properties of all blends were measured with Instron, fatigue to failure(FTF), Demattia flex cracking tester(DMFC), scanning electron microscopy (SEM), etc. As the ethylene and diene contents in EPDM increased, the physical properties, such as dynamic crack growth, adhesion to other component were increased too. Interfacial adhesion force of EPDM/NR blends to dissimilar layer was improved by the use of optimum peroxide curing system.

• International Journal of Concrete Structures and Materials
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• v.2 no.1
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• pp.3-8
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• 2008

Polymer-cement composites are known repair materials. The aim of this work is to investigate the influence of various amount of dispersion of carboxylated styrene-butadience copolymer on the selected mechanical properties of polymer-cement concrete (PCC) and on its adhesion to ordinary concrete. The compressive, flexural and tensile strengths as well as frost resistance and fracture resistance of the composites are tested. Adhesion strength of PCC to ordinary concrete, as one of most important performance of good repair material is evaluated and analyzed using three test methods. The results obtained in standard pull-off test are compared with the two other tests. The first one, which is an adaptation of WST (wedge splitting test) characterizes crack propagation in the plane of bond created during repair. In the second test the resistance to shear is a measure of adhesion strength.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.177-179
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• 2011

The purpose of this study is to enhance an adhesion between substrate and Diamond-like Carbon (DLC) film. DLC has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion because of weak bonding between DLC film and the substrate. For improvement adhesion, a layer between DLC film and the substrate was prepared by dual post plasma. DLC film was deposited on nitrided layer by linear ion source. The composed compound layer between substrate and DLC film was investigated by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The synthesized bonding structure of DLC film was analyzed using a micro raman spectrometer. Mechanical properties were measured by nano-indentation. In order to clarify the mechanism for improvement in adhesive strength, it was observed by scratch test.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.2
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• pp.27-37
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• 1991

The adhesion strength of TiN films to substrate(STC 3) steel has been studied using the scratch adhesion test. Before deposition, the substrates were mechanically polished and TiN films were deposited at different substrate temperature($480^{\circ}C-540^{\circ}C$). The chemical properties of TiN films were investigated by RBS, and EDS, and the physical properties were investigated by micro-hardness tester, SEM, and X-ray diffractometer. According to results of this study, the adhesion strength of TiN films increase with increasing the deposition temperature. The roughness of the polished substrates surface were measured with a profilometer. It was observed that, as a general rule, the adhesion strength of deposited TiN films increase with decreasing the substrates surface roughness.

• Korean Journal of Materials Research
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• v.13 no.5
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• pp.338-342
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• 2003

Adhesion between Cu and low-k films has been investigated. Low-k films deposited using a mixture of hexamethyldisilane(HMDS) and Para-xylene had a dielectric constant as low as 2.7, showing the thermally stable properties up to $400^{\circ}C$. In this study, Ti glue layer, boron dopant, and $N_2$plasma treatment were used to improve adhesion property of between Cu and low-k films. Ti glue layer slightly improved adhesion property. After $N_2$plasma treatment, the adhesion property was significantly improved due to the increased roughness and the formation of new binding states between Ti and plasma-treated PPpX : HMDS. However, $300^{\circ}C$ annealing of $N_2$plasma treated sample caused the diffusion of Cu into the PPpX : HMDS, degrading the low-k properties. In the case of Cu(B)/Ti/PPpX : HMDS, the adhesion was remarkably increased. This enhanced adhesion was attributed to formation of Ti-boride at the Cu-Ti interface. It is because the formed Ti-boride prevented the diffusion of Cu into the PPpX : HMDS and the Cu-Ti reaction at the Ti interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Korean Journal of Metals and Materials
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• v.46 no.7
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• pp.464-470
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• 2008

Metallic nanostructures have great potential for bio-chemical sensor applications due to the excitation of localized surface plasmon and its sensitive response to environmental change. Unlike the commonly explored absorption-based sensing, the optical scattering provides single particle detection scheme. For the localized surface plasmon resonance spectroscopy, the metallic nanostructures with controlled shape and size have been usually fabricated on adhesion-layer pre-coated transparent glass substrates. In this study, we calculated the optical scattering properties of plasmonic Au nanodisc using a discrete dipole approximation method and analyzed the effect of adhesion layer on them. Our result also indicates that there is a trade-off between the surface plasmon damping and the capability of supporting nanostructures in determining the optimal thickness of adhesion layer. Marginal thickness of Ti adhesion layer for supporting Au nanostructures fabricated on a silica glass substrate was experimentally analyzed by an adhesion strength test using a nano-indentation technique.

• Polymer(Korea)
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• v.39 no.2
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• pp.281-286
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• 2015

UV-cured acrylic copolymer pressure sensitive adhesive (PSA) having different amounts of crosslinking agents were prepared and adhesion properties were investigated. 0.01 wt% of MMT clay was dispersed in 2-ethylhexyl acrylate (2-EHA)/acrylic acid (AA) monomer mixture containing 0, 0.05, 0.1 and 0.3 wt% 1,6-hexandiol diacrylate (HDDA) for crosslinking. It was investigated that the curing behavior and surface chemistry of PSAs were merely affected by the presence of MMT clays. On the other hand, adhesive properties were influenced by the MMT addition; a cohesive failure was restrained due to improved molecular elasticity even in uncrosslinked acrylic PSAs. However, it was also appeared that combination of 0.3 wt% crosslinking agent and MMT loading might result in the damage of adhesion properties of PSAs possibly due to the lack of chain flexibility. In our studies, it is suggested that the 2-EHA/AA PSAs incorporating 0.01 wt% of MMT and crosslinked with 0.05 wt% of HDDA exhibited the balanced adhesion properties without severe cohesive failure during strip.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.2 s.17
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• pp.100-108
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• 2004

Nitramine-polymer composites suffer from a problem known as dewetting. Dewetting adversely affects the performance and the sensitivity characteristics of an explosive composition. Voids, which are generated between explosive particles and binder on dewetting, act as initiation sites. For a PBXs as well as propellants, where good adhesion and mechanical properties are of great importance, dewetting therefore must be prevented by strong adhesion between the filler and the binder. The surface energy of materials is measured by Wilhelmy plate and wicking method. The interfacial energy between the filler and the binder is calculated from the disperse phase and the polar phase of surface energy. Time dependent compressive properties of composite explosives have been determined by stress-strain curves obtained at different strain rates and temperatures. The interfacial state of the PBX was observed through SEM. It was found from the result that the interface between the explosive and the binder becomes better adhesion with decreasing interfacial tension and increasing work of adhesion. The result clearly shows that the castable PBX has good adhesion more than the pressable PBX.

• Korean Chemical Engineering Research
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• v.50 no.1
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• pp.6-10
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• 2012

The main objective of this work was studying the influence of paraffin oil(PO) on the adhesion properties at low temperature in styrene-butadiene-styrene(SBS) copolymer and crumb rubber(CR) modified asphalt. The temperature susceptibility of SBS/CR asphalt and PO/SBS/CR/asphalt blends were measured by penetration and softening point. Adhesion properties at low temperature and dispersion of modifiers in PO/SBS/CR/asphalt blends were evaluated by universal test machine and florescence microscopy, respectively. The adhesion properties of PO/SBS/CR/asphalt blends at low temperature increased in the proportion of SBS contents with both 5 and 10 wt % of paraffin oil. Results showed that the maximum tensile adhesion strength and toughness energy at $-20^{\circ}C$ were obtained when PO and SBS contents were 10 wt % and 6 wt %, respectively. The addition of PO is effective for enhancing the flexibility of SBS/CR/asphalt blends and leads to the increase of toughness at low temperature.