• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.12B
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• pp.1491-1497
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• 2009

Existing methods to measure are based on ToA (Timer of Arrival), RSS (Received Signal Strength), AoA(Angle of Arrival) and other methods. In this paper, we propose a compensation of ToA and RSS methods to measure more precisely the distance of nodes. The comparison experiments with the traditional ToA method show that the average error value of proposed method is reduced 30%. We believe that this proposal can improve location estimation of sensor nodes in wireless sensor networks.

• Journal of electromagnetic engineering and science
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• v.15 no.4
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• pp.232-238
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• 2015

This work describes the development of a D-band (110-170 GHz) signal source based on a SiGe BiCMOS technology. This D-band signal source consists of a V-band (50-75 GHz) oscillator, a V-band amplifier, and a D-band frequency doubler. The V-band signal from the oscillator is amplified for power boost, and then the frequency is doubled for D-band signal generation. The V-band oscillator showed an output power of 2.7 dBm at 67.3 GHz. Including a buffer stage, it had a DC power consumption of 145 mW. The peak gain of the V-band amplifier was 10.9 dB, which was achieved at 64.0 GHz and consumed 110 mW of DC power. The active frequency doubler consumed 60 mW for D-band signal generation. The integrated D-band source exhibited a measured output oscillation frequency of 133.2 GHz with an output power of 3.1 dBm and a phase noise of -107.2 dBc/Hz at 10 MHz offset. The chip size is $900{\times}1,890{\mu}m^2$, including RF and DC pads.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.276.2-278
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• 2000

In a recent years, a number of approaches have been studied, including passive, active, and hybrid mode-locking of semi-conductor lasers for short pulse generation and research has been devoted to achieve low timing-jitter operation since the timing jitter is unfavorable for system applications. Among the methods of mode locking, passive mode locking does not need external rf drives, and therefore the operation and fabrication procedures are simplified. In spite of these attractive advantages of passive mode-locked laser, it has critical drawbacks such as large timing jitter and the difficulty in synchronization with external circuits. Their inherent large timing jitter value was shown to be suppressed to certain levels by means of hybrid mode-locking technique$^{(1)}$ , where the saturable absorber section was modulated by an external signal with the cavity round trip frequency. Furthermore, the subharmonic mode-locking (SHML) technique alleviates the restrictions of high speed driving electronics. It has been demonstrated experimentally$^{(1)}$ that the hybrid subharmonic mode-locking technique has lead to significant reduction of the timing jitter. (omitted)

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.3
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• pp.647-653
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• 2005

According to the design concept of microwave front-end, a low noise amplifier block using HBT cascode topology is proposed to provide high gain and low noise figure with low bias current. We has implemented MMIC-LNA with a modified configuration using inductors to show low noise at the emitter and base of cascoded HBT-MMIC amplifier. The measured performance of the designed MMIC-LNA at 3.7GHz are a gain of 19dB, noise figure of 2.7dB and image rejection of 35dBc using a supply of 3mA and 2.7V. We can convinced that cascoded amplifier block to fulfill a high gain, low noise and image rejection if microwave front-end receiver is designed by cascode MMEC-LNA with the active image rejection filter.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.277-285
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• 2007

In this paper, we outline the research issues that we are pursuing towards building of location aware environments for mainly ubiquitous healthcare applications. Such location aware application can provide what is happening in this space. To locate an object, such as patient or elderly person, the active ceiling-mounted reference beacons were placed throughout the building. Reference beacons periodically publish location information on RF and ultrasonic signals to allow application running on mobile or static nodes to study and determine their physical location. Once object-carried passive listener receives the information, it subsequently determines it's location from reference beacons. The cost of the system was reduced while the accuracy in our experiments was fairly good and fine grained between 7 and 12 cm for location awareness in indoor environments by using only the sensor nodes and wireless sensor network technology. Passive architecture used here provides the security of the user privacy while at the server the privacy was secured by providing the authentication using Geopriv approach. This information from sensor nodes is further forwarded to base station where further computation is performed to determine the current position of object.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.34-35
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• 2006

Transparent ZnO thin film transistor (TFT) is fabricated on the glass substrates. The device consists of a high mobility intrinsic ZnO as a semiconductor active channel, Ga doped ZnO (GZO) as an electrode, $HfO_2$ as a gate insulator. GZO and $HfO_2$ layers are prepared by using a pulsed laser deposition and intrinsic ZnO layers are fabricated by using an rf-magnetron sputtering, respectively. The transparent TFT is highly transparent (> 87 %) and exhibits n-channel, enhancement mode behavior with a field-effect mobility as large as $11.7\;cm^2/Vs$ and a drain current on-to-off ratio of about $10^5$.

• Journal of IKEEE
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• v.17 no.2
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• pp.176-181
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• 2013

This paper presents a CMOS impulse radio ultra-wideband (IR-UWB) receiver implemented using IBM 0.13um CMOS technology for inner/inter-chip wireless interconnection. The IR-UWB receiver is based on the non-coherent architecture which removes the complexity of RF architecture (such as DLL or PLL) and reduces power consumption. The receiver consists of three blocks: a low noise amplifier (LNA) with active balun, a correlator, and a comparator. Simulation results show the die area of the IR-UWB receiver of 0.2mm2, a power gain (S21) of 12.5dB, a noise figure (NF) of 3.05dB, an input return loss (S11) of less than -16.5dB, a conversion gain of 18dB, a NFDSB of 22. The receiver exhibits a third order intercept point (IIP3) of -1.3dBm and consumes 22.9mW of power on the 1.4V power supply.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2163-2165
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• 2005

A pulsed laser ablation deposition (PLAD) technique has been used for producing fine particle as well as thin film at relatively low substrate temperatures. However, in order to manufacture and evaluate such materials in detail, motions of plume particles generated by laser ablation have to be understood and interactions between the particles by ablation and gas plasma have to be clarified. Therefore, this paper was focused on the understanding of plume motion in laser ablation assisted by Ar plasma at 50(mTorr). Two-dimensional hybrid model consisting of fluid and particle models was developed and three kinds of plume particles which are carbon atom (C), ion $(C^+)$ and electron were considered in the calculation of particle method It was obtained that ablated $C^+$ was electrically captured in Ar plasmas by strong electric field (E). The difference between motions of the ablated electrons and $C^+$ made E strong and the collisional processes active.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.228-231
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• 2013

This paper proposes a new method that reduces RCS(rader cross section) of the aluminum plate using a oscillation system composed of a VGA(variable gain amplifier) and a phase shifter. Once the oscillation system receives the external-RF signal through a probe on aluminum plate, it makes an amplified signal with a specific phase to cancel the signal reflected from the aluminum plate. The signal transmitted from the oscillation system has the same amplitude and out of phase with the reflected signal. And it can be controlled by the VGA and the phase shifter in the oscillation system. In order to validate the performance of the proposed oscillation system, FEM simulator was used and we measured how much an amplitude of the signal reflected from the aluminum plate rotated in phi direction is reduced in an anechoic chamber.