• Journal of Adhesion and Interface
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• 제12권1호
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• pp.26-33
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• 2011

Phosphoric acid treatments were conducted to improve the adhesion property of polyketone film to rubber. The effects of phosphoric acid treatments were characterized by using a contact angle analyzer and a XPS (X-ray photoelectron spectroscopy). Morphological changes were observed by using a scanning electron microscope (SEM) and an atomic force microscope (AFM) as the acid treatment condition varied in concentration and time. The contact angle was found to significantly decrease with the acid treatment. According to the XPS, increased wettability was attributed to the inclusion of oxygen containing groups such as hydroxyl, carbonyl and carboxyl by acid treatments. Cracks and pores were produced on the polyketone film surface and thus, roughness increased with the acid treatment. Interfacial adhesion strength between polyketone and natural rubber was largely improved by acid treatment due to the increased wettability and roughness of the polyketone surface. However, the higher level of acid treatment caused the degradation of the polyketone surface, and thus, its interfacial adhesion consequently decreased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제18권8호
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• pp.708-713
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• 2005

An alumina membrane with nano-sized pore array by anodic oxidation using the thin film aluminum deposited on silicon wafer was fabricated. It Is important that the sample prepared by metal deposition method has a flat aluminum surface and a good adhesion between the silicon wafer and the thin film aluminum. The oxidation time was controlled by observation of current variation. While the oxalic acid with 0.2 M was used for low voltage anodization under 100 V, the chromic acid with 0.1 M was used for high voltage anodization over 100 V. The nano-sized pores with diameter of $60\~120$ nm was obtained by low voltage anodization of $40\~80$ V and those of $200\~300$ nm was obtained by high voltage anodization of $140\~200$ V. The pore widening process was employed for obtaining the one-channel with flat surface because the pores of the alumina membrane prepared by the fixed voltage method shows the structure of two-channel with rough surface. Finally, the sample was immersed to the phosphoric acid with 0.1 M concentration to etching the barrier layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제19권10호
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• pp.889-893
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• 2006

Chemical mechanical polishing (CMP) achieves surface planrity through combined mechanical and chemical means. The role of slurry is very important in metal CMP. Slurry used in metal CMP normally consists of oxidizers, complexing agents, corrosion inhibitors and abrasives. This paper investigates the effects of citric acid as a complexing agent for Cu CMP with $H_2O_2$. In order to study chemical effects of citric acid, X-ray photoelectron spectroscopy (XPS) was peformed on Cu sample after etching test. XPS results reveal that CuO, $Cu(OH)_2$ layer decrease but $CU/CU_2O$ layer increase on Cu sample surface. To investigate nanomechanical properties of Cu sample surface, nanoindentation was performed on Cu sample. Results of nanoindentation indicate wear resistance of Cu surface decrease. According to decrease of wear resistance on Cu surface removal rate increases from $285\;{\AA}/min\;to\;8645\;{\AA}/min$ in Cu CMP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.120-122
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• 2005

An alumina membrane with nano-sized pore array by anodic oxidation using thin film aluminum deposited on silicon wafer was fabricated. It is important that the sample prepared by metal deposition method has a flat aluminum surface and a good adhesion between the silicon wafer and the thin film aluminum. The oxidation time was controlled by observation of current variation. While the oxalic acid with 0.2M was used for low voltage anodization under 100V, the chromic acid with 0.1M was used for high voltage anodization over 100V. The nano-sized pores with diameter of 60~120nm was obtained by low voltage anodization of 40~90V and those of 200~300nm was obtained by high voltage anodization of 120~160V. Finally, the sample was immersed to the phosphoric acid with 0.1M concentration to etching the barrier layer. The sample will be applied to electronic sensors, field emission display, and template for nano-structure.

• Journal of the korean academy of Pediatric Dentistry
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• 제44권3호
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• pp.358-364
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• 2017

For the purpose of convenience and reducing time, newer bonding agents have been developed for composite resin restoration. Recently developed one bottle bonding system including etching, primer and adhesive can make procedures simpler and less technique-sensitive than old generation adhesives. The aim of this study was comparing the shear bond strength of new dentin bonding agents to the 5th generation bonding agent which had an etching step. 78 premolar teeth were randomly divided into three groups which were treated with $Tetric^{(R)}$ N-Bond Universal (Ivoclar Vivadent, Liechtenstein), $GC^{(R)}$ G-Premio BOND (GC Co., Japan) without additional etching step and $3M^{TM}$ Single Bond2 (3M ESPE, USA) with an etching step following manufacturer's instructions. $Filtek^{TM}$ Z-350 (3M ESPE, USA) composite resin was applied and light cured over bonding agents. For shear bond strength evaluation, universal testing machine was used with a wedge technique. As a result, shear bond strength of one step bonding agents was lower than two step bonding agent and there were statistically significant differences between them (p < 0.05). In addition, within the result of two new bonding agents, $Tetric^{(R)}$ N-Bond Universal showed significantly higher shear bond strength than $GC^{(R)}$ G-Premio BOND (p < 0.05).

• Journal of the Korean Vacuum Society
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• 제19권2호
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• pp.114-120
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• 2010

Conventional surface texturing in crystalline silicon solar cell have been use wet texturing by Alkali or Acid solution. But conventional wet texturing has the serious issue of wafer breakage by large consumption of wafer in wet solution and can not obtain the reflectance below 10% in multi crystalline silicon. Therefore it is focusing on RIE texturing, one method of dry etching. We developed large scale plasma RIE (Reactive Ion Etching) equipment which can accommodate 144 wafers (125 mm) in tray in order to provide surface texturing on the silicon wafer surface. Reflectance was controllable from 3% to 20% in crystalline silicon depending on the texture shape and height. We have achieved excellent reflectance below 4% on the weighted average (300~1,100 nm) in multi crystalline silicon using plasma texturing with gas mixture ratio such as $SF_6$, $Cl_2$, and $O_2$. The texture shape and height on the silicon wafer surface have an effect on gas chemistry, etching time, RF frequency, and so on. Excellent conversion efficiency of 16.1% is obtained in multi crystalline silicon by RIE process. In order to know the influence of RF frequency with 2 MHz and 13.56 MHz, texturing shape and conversion efficiency are compared and discussed mutually using RIE technology.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• 제13권5호
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• pp.412-418
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• 2020

This paper produced an automatic fluid management system that can accurately control the specific gravity of etching solution(FeCl₃), and produced a SUS MASK applied to OLED. The target was set at 0.4 mm in diameter of the hole. As a result of this misconception, the etching speed increased when the specific gravity(S.G) value of FeCl₃ was changed from 1.43 to 1.49. And when the weight was 1.49, it was found that the vertical diameter was 0.405 mm, approaching the target. When pressure injection was varied from 2.0kg/cm2 to 3.5kg/cm2, the hole diameter at 3.0 kg/cm2 averaged 0.4mm, matching the target. The characteristics of the change in gravity were analyzed by applying the additive 1.2% and setting the weight at 1.430 by mixing HCl and H2O in FeCl₃ and fixing the injection pressure at 3.0 kg/cm2. When the weight changed from 1.460 to 1.469 the etching speed increased from 0.564 to 0.540. When the weight was 1.467, the hole diameter was measured at 0.4 mm and the target was reached.

• Restorative Dentistry and Endodontics
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• 제25권2호
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• pp.262-271
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• 2000

The purpose of this study was to estimate shear bond strength according to difference in Targis surface treatment and storage condition. 140 non-carious extracted human molars and Targis D210(Ivoclar, Liechtenstein) were used in the present study and were divided into 7 experimental groups respectively according to surface treatment of Targis. Group 1 ; No treatment, Group 2 ; $50{\mu}m$ aluminium oxide blasting, Group 3 ; 4% HF etching for 3 minutes, Group 4 ; 4% HF etching after blasting, Group 5 ; silane treatment after blasting, Group 6 ; silane treatment after 4% HF etching, Group 7 ; silane treatment after blasting and 4% HF etching. In Each group, one half of 20 specimens was stored in distilled water at $37^{\circ}C$ for 24 hours and the other half was stored at atmosphere for 24 hours respectively. Dentin surface was etched with 10% $H_3PO_4$ for 15 seconds and luting cement(Variolink II, Vivadent, Liechtenstein) was applied by manufacturer's recommendation. Shear bond strength for each group was then measured. To examine the failure patterns after shear bond test and to observe the change after surface treatment of Targis. Specimens were fabricated and observed under the SEM. Statistical analysis was performed by One Way ANOVA test and t-test. The results were as follows ; 1. The shear bond strength of the groups stored in water significantly lower than that of groups stored at atmosphere (P<0.05). 2. There was no significant difference in shear bond strength in groups stored in water (P>0.05). 3. The shear bond strength without surface treatment of Targis were lowest among all experimental groups in atmosphere condition(P<0.05). 4. There was no significant difference in bond strength between groups using the silane or not(P>0.05). 5. The groups treated by blasting, hydrofluoric acid and silane sequentially showed highest bond strength than that of other groups in atmosphere condition, but there was no significant difference(P>0.05). 6 The proportions of the specimens showing the mixed fracture failure were 20% in HF etching group and blasting + HF group, 40% in blasting + HF + silane group in atmosphere condition. All the specimens stored in water showed adhesive fracture failure.

• The korean journal of orthodontics
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• 제22권1호
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• pp.43-65
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• 1992

Bonding orthodontic adhesive resins to glazed porcelain surface is not attainable. The aim of this investigation was to examine, in vitro, the effect of three methods of porcelain surface pretreatment on the shear bond strength of orthodontic adhesives, and to compare the shear strength of orthodontic bracket bonding to porcelain surface by the best results that to human enamel. Porcelain disks ($Ceramco^{(TM)}$ and $Vita^{(TM)}$) baked in the laboratory were roughened by sandpapers, #320, #600, #800, #1000 and #1200, and were pretreated with silane and dried at the various temperatures, room temperature, $50^{\circ}C$, $70^{\circ}C$ and $90^{\circ}C$, and were etched by 3% hydrofluoric acid solution for 1, 3, 5, 7, and 9 minutes, orthodontic adhesives (System $1+^{(TM)}$ and $Unite^{(TM)}$) were applied on them, and shear bond strengths were measured by Instron. The best results of pretreatment of each method were determined by the shear bond strengths. Again, porcelain disks were pretreated by the determined best results and human enamel were etched by 37% hydrofluoric acid solution, orthodontic brackets were bonded on them by the orthodontic adhesives, and the shear bond strengths were measured and compared between them. 1. Roughening porcelain surfaces with coarse sandpaper (#300) showed higher shear bond strength than that with finer sandpapers, but it $(22.44Kgf/cm^2)$ was distinguishably low compared to that from etched human enamel $(144.11Kgf/cm^2)$. 2. There were disparities in shear bond strengths upon the orthodontic resins, which was presumably related to the contents of fillers in orthodontic adhesive resins. Also there were disparities in shear bond strength upon the porcelains which had different composition. 3. Silane enhanced the shear bond strength of orthodontic resins to porcelain surfaces ($25.20Kgf/cm^2$ at $50^{\circ}C$), which was markedly low compared to that from etched human enamel. 4. Etched porcelain surface with 3% hydrofluoric acid solution for 1 to 9 minutes showed no difference in shear bonding strength of orthodontic adhesive resins. Shear bond strength from etched porcelain $(97.43-120.72Kgf/cm^2)$ were as high as clinically available, but low compared to that from etched human enamel. 5. Roughening with #300 sandpaper and etching by 3% hydrofluoric acid followed silane application on porcelain surface showed lower shear bond strength than etched human enamel, but were as high as clinically useful. 6. The results suggest that etching porcelain surface by 3% hydrofluoric acid solution might provide comparatively high shear bond strength as much as clinically favorable.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 한국조명전기설비학회 2002년도 학술대회논문집
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• pp.207-211
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• 2002

Anodizing film was prepared by anodic oxidation of pure aluminum(purity > 99.50) using DC power supply for constant current mode in an electrolytic solution of surface of sulfuric acid. Effects of pre-treatment process such as chemical polishing, acid cleaning, alkali etching before anodic oxidation, were studied to microstructures and surface morphologies. A roughness on surface of anodizing film had to be decreased for amorphous phase by anodic oxidation. A roughness on surface of anodizing film decrease as annealing temperature increased in chemical polishing.