• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.158-161
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• 2003

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5% acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Korean Chemical Engineering Research
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• 제48권5호
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• pp.561-567
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• 2010

Isophrone diisocyanate, poly(tetramethylene glycol)과 dimethylol propionic acid로부터 제조된, polyurethane 부분중합체의 미반응 NCO기를 aminopropyl triethoxysilane으로 capping시켜 silylated waterborne polyurethane을 합성하였다. 연이어 이것을 colloidal silica와 혼합하여 silylated waterborne polyurethane/silica nanocomposite를 제조하였다. 동적빛 산란법에 의해 측정된 nanocomposite 입자의 평균 크기는 silica 함유량과 무관하게 거의 일정한 수치를 나타내었다. 그러나 제조된 nanocomposite의 열적안정성은 순수한 waterborne polyurethane보다 우수하였다.

• 공업화학
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• 제17권4호
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• pp.386-390
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• 2006

콜로이드형 실리카는 화학적으로 안정한 무기소재로 비표면적과 표면물성이 우수하여 산업적으로 다양한 용도로 사용하고 있다. 본 연구에서는 sodium silicate로부터 이온교환방법 및 산-중화법을 이용하여 colloidal silica를 제조하고 입자성장인자인 온도, pH, 농도와 aging time을 조절하여 크기를 조정하는 방법을 조사하여 균일한 크기분포를 가진 colloidal silica를 제조하였다. 실리카 졸의 크기와 모양은 TEM 및 dynamic scattering method를 이용하여 측정하였다. 또한 콜로이드의 입자크기에 따른 제타 전위값의 변화, 겔화현상과 그 유변학적 특성을 연구하였다.

• 한국재료학회지
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• 제16권12호
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• pp.731-738
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• 2006

It is seriously considered using Al CMP (chemical mechanical planarization) process for the next generation 45 nm Al wiring process. Al CMP is known that it has a possibility of reducing process time and steps comparing with conventional RIE (reactive ion etching) method. Also, it is more cost effective than Cu CMP and better electrical conductivity than W via process. In this study, we investigated 4 different kinds of slurries based on abrasives for reducing scratches which contributed to make defects in Al CMP. The abrasives used in this experiment were alumina, fumed silica, alkaline colloidal silica, and acidic colloidal silica. Al CMP process was conducted as functions of abrasive contents, $H_3PO_4$ contents and pressures to find out the optimized parameters and conditions. Al removal rates were slowed over 2 wt% of slurry contents in all types of slurries. The removal rates of alumina and fumed silica slurries were increased by phosphoric acid but acidic colloidal slurry was slightly increased at 2 vol% and soon decreased. The excessive addition of phosphoric acid affected the particle size distributions and increased scratches. Polishing pressure increased not only the removal rate but also the surface scratches. Acidic colloidal silica slurry showed the highest removal rate and the lowest roughness values among the 4 different slurry types.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.154-157
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• 2004

산성 colloidal silica(CS) 1034A, HSA와 TMOS, MTMS 실란 간의 졸겔반응조건이 코팅도막의 특성에 미치는 영향을 조사하기 위하여 1034A CS계에 대해서는 1단계로 실란들을 첨가하고 동일한 MTMS에 대해 CS/TMOS의 함량비, 반응시간을 달리하여 졸을 합성하였다. HSA계에 대해서는 2단계로 분리하여 TMOS, MTMS 실란을 첨가하는데 실란 첨가순서와 실란 함량비, 반응시간을 달리하여 졸을 합성하였다. 합성된 졸은 slide glass에 함침 코팅한 후 $300^{\circ}C$에서 경화시킨 도막의 특성들을 조사하였다. 1034A CS계는 CS/TMOS의 비가 70/30일 때 50/50인 경우보다 반응시간에 따라서 표면조도가 우수하여 접촉각에 영향을 덜 주므로 효과적인 균일 반응상으로 진행되었다. HSA CS계는 1단계로 MTMS를 먼저 첨가하고 MTMS/TMOS 비를 25/75로 첨가하면 반응시간에 따라서 표면조도 거칠기에 크게 영향 받지 않고 접촉각을 안정화시킬 수 있다.

• 펄프종이기술
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• 제32권1호
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• pp.33-40
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• 2000

The effectiveness of silica-based microgels prepared through the reaction of sulfuric acid and sodium silicate as a component of Compozil system has been evaluated . Silica based microgels with better performance in retention and drainage than a commercial colloidal silica sol have been successfully prepared. Silica gels with the highest charge density were obtained when product pH was controlled to 9. And highly charged silica-based microgels showed greater retention and freeness performance than a commerical product. In particular the difference in retention, turbidity , and freeness between these microgels and a commercial product was eminent at low addition rate. The effects of reaction conditions including reaction temperature, process water quality and feeing rate on product efficiency in improving retention and drainage were also investigated and discussed.

• 대한기계학회논문집A
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• 제38권9호
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• pp.1037-1041
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• 2014

반도체 연마용 슬러리를 이온교환법, 가압방법 및 다단계 주입방법으로 제조하여 입자 크기와 형상에 따른 화학적 기계적 연마에 미치는 영향을 연구하였다. 이온교환법을 이용하여 구형의 콜로이달실리카를 크기별로 입자로 제조하였다. 이렇게 제조한 구형의 실리카를 다시 가압방법을 이용해 입자간의 결합을 유도해 비구형의 형상을 가진 콜로이달 실리카를 제조하였고, 이온교환법과 가압방법의 특징을 살려 실리식산을 다단계로 주입하여 입자 표면과 실리식산의 반응으로, 2~3 개의 입자가 결합한 형상의 콜로이달 실리카를 제조하였다. 이렇게 제조한 입자를 CMP 에 적용하여 콜로이달 실리카의 입자 형상에 따른 연마율을 기존의 상용 슬러리와 비교하였다. pH 가 높을수록 연마율은 높아졌고, 입자가 결합한 비구형의 콜로이달 실리카는 가장 높은 연마율과 양호한 비균일도를 나타내었다.

• 한국전기전자재료학회논문지
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• 제20권1호
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• pp.74-79
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• 2007

Most studies on copper Chemical Mechanical Planarization (CMP) have focused on material removal and its mechanisms. Although many studies have been conducted on the mechanism of Cu CMP, a study on uniformity in Cu CMP is still unknown. Since the aim of CMP is global and local planarization, the approach to various factors related to uniformity in Cu CMP is essential to elucidate the Cu CMP mechanism as well. The main purpose of the experiment reported here was to investigate and mechanically analyze the roles of slurry components in the formation of the uniformity in Cu CMP. In this paper, Cu CMP was performed using citric acid($C_{6}H_{8}O_{7}$), hydrogen peroxide($H_{2}O_{2}$), colloidal silica, and benzotriazole($BTA,\;C_{6}H_{4}N_{3}H$) as a complexing agent, an oxidizer, an abrasive, and a corrosion inhibitor, respectively. All the results of this study showed that within-wafer non-uniformity(WIWNU) of Cu CMP could be controlled by the contents of slurry components.

• 펄프종이기술
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• 제35권5호
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• pp.1-9
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• 2003

Effectiveness of the microparticle retention systems in improving drainage, retention, formation has been recognized for many years. In this study the effectiveness of crosslinked cationic corn starches and silica-based microgels as components of Compozil system has been evaluated. It was shown that improvements in retention and strength could be achieved by employing crosslinked cationic corn starches especially at high conductivity. Silica-based microgels with better performance in retention and drainage than a commercial colloidal silica sol have been made through a reaction of sulfuric acid and sodium silicate solutions.