• 대한기계학회논문집A
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• 제27권8호
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• pp.1398-1408
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• 2003

Tensile and LCF(low cycle fatigue) tests were carried out in air at wide temperature range 20$^{\circ}C$-750$^{\circ}C$ and strain rates of 1${\times}$10$\^$-4//s-1${\times}$10$\^$-2/ to ascertain the influence of strain rate on tensile and LCF properties of prior cold worked 316L stainless steel, especially focused on the DSA(dynamic strain aging) regime. Dynamic strain aging induced the change of tensile properties such as strength and ductility in the temperature region 250$^{\circ}C$-600$^{\circ}C$ and this temperature region well coincided with the negative strain rate sensitivity regime. Cyclic stress response at all test conditions was characterized by the initial hardening during a few cycles, followed by gradual softening until final failure. Temperature and strain rate dependence on cyclic softening behavior appears to result from the change of the cyclic plastic deformation mechanism and DSA effect. The DSA regimes between tensile and LCF loading conditions in terms of the negative strain rate sensitivity were well consistent with each other. The drastic reduction in fatigue resistance at elevated temperature was observed, and it was attributed to the effects of oxidation, creep and dynamic strain aging or interactions among them. Especially, in the DSA regime, dynamic strain aging accelerated the reduction of fatigue resistance by enhancing crack initiation and propagation.

• 동의생리병리학회지
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• 제27권3호
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• pp.331-335
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• 2013

This study investigated the relationship between drinking and health factors including vaso-aging degree, stress index, stress resistance, fatigue and activity of autonomic nerve system etc. The subjects were 20,925 persons who had received health examination by Korean Medicine and submitted questionnaires about drinking history, for 8 months from March to November. The vaso-aging degree were measured by APG (Accelerated Photoplethysmograph). The stress index and resistance, fatigue and activity of autonomic nerve system were measured by HRV (Heart Rate Variability). We analyzed the relationship between drinking and various variables by chi-square test with SPSS ver. 19.0. Regarding the relationship between drinking and vaso-aging degree, there was significant differences(p<0.05). But regarding the relationship between drinking and the other factors, there were no statistically differences. This study suggests that the vaso-aging degree is affected by drinking alcohol.

• 대한한의진단학회지
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• 제16권3호
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• pp.11-22
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• 2012

Objectives: The aim of this study was to elucidate the relationship between pulse types measured by pulse analyzer and several factors including smoking, drinking alcohol, exercises etc. Methods: The subjects were 71 persons who were tested by oriental health examination. A self-reported questionnaire was used to gather age, smoking, drinking alcohol, exercise state and gender. The pulse types were measured by DMP 1000. The index of stress and fatigue were measured by SA 3000. We analyzed the frequency of pulse types according to gender, ages, smoking, drinking alcohol etc by chi-square test with SPSS ver. 19.0. Results: In the main pulse types, there were significant differences according to age(p<0.05) and marginal differences according to drinking alcohol(p<0.1). In the secondary pulse types, there were marginal differences according to exercise, ages. But there was no significant differences according to gender, smoking, body mass index (BMI), accelerated photoplethysmography (APG) feature, stress and fatigue. Conclusions: This study suggests that the pulse types are affected by drinking alcohol, ages, exercise.

• Elastomers and Composites
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• 제53권4호
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• pp.220-225
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• 2018

Resilient pads play a major role in reducing the impact of loads on a rail in a rail-fastening system, which is essentially used for a concrete track. Although a compression set test is commonly used to measure the durability of a resilient pad, the static spring constant is often observed to be different from the fatigue test. In this study, a modified compression set test method was proposed to monitor the variations in the compression set and static spring constant of a resilient pad with respect to temperature and time. In addition, the life of the resilient pad was predicted by performing an acceleration test based on the Arrhenius equation.

• 한국자동차공학회논문집
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• 제14권1호
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• pp.159-166
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• 2006

Chassis system has a large influence on ride quality, stability and NVH performance of a car. To improve the performance and reduce cost, the development of chassis modular assemblies is emphasized. To develop chassis corner modules, it is necessary to predict the performance of full vehicle motion such as ride, handling performance, NVH characteristics and durability of modules. In this paper, full vehicle test is performed to acquire the road load data of chassis corner module of passenger car. 3-axis simulator modeling are carried out to simulate reaction force analysis and fatigue analysis of new developed modules. Also, real simulator tests to validate performance of new developed modules are performed. We had developed the accelerated durability test procedure of KATECH PG and it is used to test chassis corner modules at laboratory and simulate durability performance. All these results have been provided to module and parts company and make an important role to develop chassis corner modules.

• 한국신뢰성학회지:신뢰성응용연구
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• 제17권2호
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• pp.143-149
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• 2017

Purpose: In recent years, weight reduction for improving fuel efficiency of the vehicle and cost reduction have been developed. The structure of suspension link is widely used as a single plate press structure which can reduce process and weight compared to existing pipe welding method. However, it was found that the lifetime of a single plate press structure is determined by initial defects that occurred during initial manufacturing rather than fatigue damage caused by driving. Methods: I research the mechanism of failure phenomenon of the single plate press assist arm of rear wheel. In addition, I investigate durability effect parameters to determine the link lifetime in inserting bush into single plate press process through durability test. Conclusion: I discover significant durability effect parameter in inserting bush into single plate press process. It is expected that the durability can be improved by suggesting a bush inserting process inspection guide for similar suspension link like single plate press structure.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Smart Structures and Systems
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• 제12권2호
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• pp.97-119
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• 2013

This paper presents numerical and experimental results on the use of guided waves for structural health monitoring (SHM) of crack growth during a fatigue test in a thick steel plate used for civil engineering application. Numerical simulation, analytical modeling, and experimental tests are used to prove that piezoelectric wafer active sensor (PWAS) can perform active SHM using guided wave pitch-catch method and passive SHM using acoustic emission (AE). AE simulation was performed with the multi-physic FEM (MP-FEM) approach. The MP-FEM approach permits that the output variables to be expressed directly in electric terms while the two-ways electromechanical conversion is done internally in the MP-FEM formulation. The AE event was simulated as a pulse of defined duration and amplitude. The electrical signal measured at a PWAS receiver was simulated. Experimental tests were performed with PWAS transducers acting as passive receivers of AE signals. An AE source was simulated using 0.5-mm pencil lead breaks. The PWAS transducers were able to pick up AE signal with good strength. Subsequently, PWAS transducers and traditional AE transducer were applied to a 12.7-mm CT specimen subjected to accelerated fatigue testing. Active sensing in pitch catch mode on the CT specimen was applied between the PWAS transducers pairs. Damage indexes were calculated and correlated with actual crack growth. The paper finishes with conclusions and suggestions for further work.

• 한국건설순환자원학회논문집
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• 제9권4호
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• pp.633-641
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• 2021

본 연구에서는 철강산업 부산물인 제강슬래그 및 폐아스팔트 콘크리트포장 파쇄물인 순환골재를 사용하여 아스팔트 혼합물용 천연골재를 대체 가능성을 파악하고 제강슬래그를 활용한 아스팔트 혼합물의 공용성 평가를 수행하였다. 일반 WC-2와 Slag WC-2(R)에 대한 평가는 동일한 조건으로 수행하였으며, 수행기관은 국가 공인시험기관(KTR) 및 한국도로학회로 각 기관의 연구용역을 통해 평가되었다. 동적안정도, 동탄성계수, 피로균열 시험결과 슬래그 아스팔트 혼합물이 일반 아스팔트 혼합물에 비해 각각 140%, 저온·고온 487·350%, Low·Middle·High Stress Level 32·325·900% 증가하는 것으로 조사되었다. 함부르크 휠 트래킹 시험결과 두 가지 혼합물의 수분저항성이 우수한 것으로 조사되었으나, 슬래그 아스팔트 혼합물 시험결과에 변곡점이 없고 변위발생량이 낮아 일반 혼합물 대비 우수한 것으로 조사되었다. 장기공용성 평가(APT) 결과 슬래그 아스팔트 혼합물에서 소성변형 발생량이 6.5% 적게 발생하였으며, 표층, 기층 및 하부층의 압축량을 분석한 결과 슬래그 포장도로의 표층 소성변형 저항성이 45% 높게 조사되었다.