• 정보보호학회논문지
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• 제24권6호
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• pp.1065-1078
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• 2014

IPSec 기반의 VPN에서는 데이터의 암호화 안전성 및 성능을 고려하였을 때 대칭키 기반의 AES 알고리즘의 성능이 가장 우수하다고 할 수 있다. 하지만 IPSec 기반 VPN에서 AES 알고리즘을 사용할 때 VPN의 성능은Cavium Networks사의 OCTEON Card 시리즈 같은 고가의 하드웨어 암호화 가속화 카드를 사용해도 동일한 하드웨어를 사용하는 방화벽의 절반의 성능도 내지 못하는 것을 알 수 있다. 2008년 인텔에서는 인텔 CPU에서 AES 알고리즘의 성능을 향상시키기 위해 AES-NI 7개의 명령어 집합을 발표하였다. 본 논문에서는 인텔 CPU의 AES-NI 7개의 명령어 집합을 사용 할 경우 IPSec 기반 VPN에서 실제로 성능이 얼마나 향상되는 지 검증 한다.

• 한국진공학회지
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• 제2권2호
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• pp.145-151
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• 1993

본 연구에서는 표면 분석 장비에 필요한 초고진공 용기를 설계 제작하였으며, LEED optics를 이용한 AES와 LEED 제어 장비를 설계하여 제작하였다. 제작된 일련의 장비들을 이용하여 LEED optics의 전자에너지 분해능을 측정하고, Pt(111) 표면에 증착된 Ni의 성장양식을 단분자층과 단분자층의 형성모델을 가정하여 증착된 Ni의 두께를 Auger signal의 비로부터 구하였다.

• 한국환경보건학회지
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• 제31권1호
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• pp.73-78
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• 2005

A determination method of trace Ni(II) and Zn(II) in aqueous solution was studied and developed by adsorbing on titanium dioxide. For this purpose, several conditions were optimized such as the pH of sample solution, adsorption time, the types and concentration acid, and desorption time. The titanium dioxide was added in sample solution which was pH adjusted. Then, the sample solution was stirred for 5 minutes. This mixture was stored in room temperature for 30 minutes to allow adsorption. After filtering and washing the titanium dioxide, the analytes were dissolved from the titanium dioxide on membrane filter by an ultrasonic vibration for 10 minutes in 1.0 M $HNO_3$ solution. Then, this sample solution was analysed using ICP-AES. The adsorption equilibrium was achieved in 30 minutes. The desorption was the most of effective with 1.0 M(mol/l) nitric acid solution, and desorption time was 10 minutes. This procedure was applied for the analysis of two real samples, i.e., brown seaweed and tangle. The recoveries of Ni(II) and Zn(II) in spiked samples were 89.4${\sim}$98.9% for analytes.

• 분석과학
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• 제6권2호
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• pp.217-223
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• 1993

저항가열식 진공중착기를 이용하여 실온(ambient temp.)과 $250^{\circ}C$에서 알루미나 기판 위에 Au/Cr, Au/Ni/Cr 및 Au/Pd/Cr 박막을 제조하였으며, 공기 중에서 $300^{\circ}C$, $450^{\circ}C$, $600^{\circ}C$의 온도로 각각 1시간 동안 열처리하였다. Au, Ni(또는 Pd) 및 Cr 박막의 두께는 각각 $1000{\AA}$, $300{\AA}$, 및 $50{\AA}$이었다. 박막 제조시 기판의 온도와 박막 제조 후 열처리 온도는 각 층의 상호확산으로 인하여 박막의 면저항값에 영향을 주었다. Auger depth profile 분석결과, Au/Cr 시스템에서는 기판의 온도는 $250^{\circ}C$로 하여 박막을 제조할 때 이미 Cr은 Au 표면으로 확산되었으며, 열처리 후에는 Au의 분포도만 변화하였다. Au/Ni/Cr과 Au/Pd/Cr 시스템의 경우 Ni와 Pd 모두 확산현상이 발견되었으며, 특히 Ni(약 45 at.%)는 Au 박막 표면으로 확산되어 산화되었다.

• Corrosion Science and Technology
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• 제6권6호
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• pp.311-315
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• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.288-291
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• 2002

Application of metal silicides such as TiSi$_2$ and CoSi$_2$ as contacts and gate electrodes are being studied. However, TiSi$_2$ due to the linewidth-dependance, and CoSi$_2$ due to the excessive Si consumption during silicidation cannot be applied to the deep-submicron MOSFET device. NiSi shows no such problems and can be formed at the low temperature. But, NiSi shows thermal instability. In this investigation, NiSi was formed with a Ti-capping layer to improve the thermal stability. Ni and Ti films were deposited by the thermal evaporator. The samples were then annealed in the N$_2$ ambient at 300-800$^{\circ}C$ in a RTA (rapid thermal annealing) system. Four point probe, FESEM, and AES were used to study the thermal properties of Ti-capped NiSi layers. The Ti-capped NiSi was stable up to 700$^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after 600$^{\circ}C$. The AES results revealed that the Ni diffusion further into the Si substrate was retarded by the capping layer, resulting in the suppression of agglomeration of NiSi films.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1994년도 제6회 학술발표회 논문개요집
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• pp.35-35
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• 1994

The surface segragation of NiZr, CuZr alloy has been studied wi th X-ray Imotoelectron spectroscopy(XPS), Auger electron spectroscopy(AES) and low energy ion scattering(LEIS). The composition of outmost atomic layer has been determinded by the use of LEIS at several incident energies using Ar+ ion. In the LEIS analysis, the effect of charge exchange has been estimated by a novel measurment of the charge exchange parameters while simul taneous determining the relative concentrations of Ni and Zr and the complementary information obtained will be described. The composition of the clean annealed surface, measured with AES only, will be contrasted wi th the surface concentration of the preferentially sputtered surface. The experimental results has been clearly demonstrated that when the NiZr ruld CuZr alloys are exposed to continuous Ar+ ion bombardment the outermost atomic layer is Zr rich due to preferential sputtering of Ni atoms. where Ni is preferentially sputtered, but the difference in sputtering yields is not sufficient to explain the observed composition. Therefore, it is necessary to consider other processes such as Radiation Induced Segregation(RIS). The surface composition of the heated sample surface predicts that Zr should surface segregate which futher supports the view that part of the Zr enrichment is due to RIS.to RIS.

• 한국의류학회지
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• 제28권1호
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• pp.165-171
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• 2004

The analytical method of toxic heavy metals in disposable diapers was developed. Disposable diapers obtained from Korea, Japan, America and German were determinated and quantified. Sample treatment (Total Digestion) was wet chemical acid digestion for extraction of nine hazardous inorganic elements (Sb, As, Pb, Cd, Cr, Co, Cu, Ni, Hg) in disposable diapers. Inductively Coupled Plasma Mass Spectrometer (ICP-MS) and Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) have been used for analyzing nine hazardous inorganic elements. The results were as follows : The concentration of extractable Sb which was treated for 3 hours with artificial urine and disposable diapers was higher than those of 6 hours and 24 hours. The concentration of extractable Cr was same as Sb. On the other hands, the behavior of Cu and Ni were different from Sb and Cr. Concentrations of extractable Cu and Ni increased as increasing the reaction time between artificial urine and disposable diapers.

• 분석과학
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• 제24권2호
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• pp.61-68
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• 2011

알루미나에 니켈을 코팅하는 효율을 높이기 위하여 졸-겔법을 이용하여 비결정성 알루미나를 제조한 후, 음향화학법을 이용하여 니켈을 알루미나에 코팅하여 미립자를 제조하였다. 니켈을 코팅한 알루미나 미립자는 여러 가지 소성온도($500^{\circ}C$, $1,000^{\circ}C$), 니켈용액의 농도(0.01 M~0.2 M), 초음파반응시간 (30 min, 2 h)의 조건에서 제조하였다. 제조한 미분체는 X-Ray Diffractometer (XRD), Scanning Electron Microscope (SEM), Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES), Particle Size Analyzer (PSA)로 특성을 분석하였다. 니켈용액의 농도가 진해짐에 따라 그리고 초음파반응시간이 길수록 니켈의 코팅량이 증가하였다. 알루미나에 니켈을 코팅하는데 있어 $1000^{\circ}C$의 소성온도, 0.1 M의 니켈용액의 농도, 2시간의 초음파에 반응하였을 때 알루미나에 니켈이 가장 많이 코팅되었다. 그리고 평균입자의 크기는 835.9~986.7 nm였다.

• 한국재료학회지
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• 제13권1호
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• pp.24-30
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• 2003

The Raney Ni catalyst was fabricated by mechanochemically process(MC process) in the Al-Ni system. Intermetallic compound obtained by mechanical alloying was leached in an alkaline solution. The characteristics of the mechanically alloyed powder and Raney Ni catalyst were analyzed by XRD, ICP-AES and EXAFS. In Al-50wt.%Ni, the metastable intermetallic compound phase close to AlNi phase was obtained by mechanical alloying unlike Al-Ni equilibrium phase diagram. The metastable intermetallic compound was transformed into $Al_3$$Ni_2$phase via the annealing at $750^{\circ}C$. The microstructure of Raney Ni fabricated by MC process was mainly bcc Ni including fcc Ni.