• Journal of the Korea Institute of Information Security & Cryptology
• /
• v.24 no.6
• /
• pp.1065-1078
• /
• 2014

Considering the safety of the data and performance, it can be said that the performance of the AES algorithm in a symmetric key-based encryption is the best in the IPSec-based VPN. When using the AES algorithm in IPSec-based VPN even with the expensive hardware encryption card such as OCTEON Card series of Cavium Networks, the Performance of VPN works less than half of the firewall using the same hardware. In 2008, Intel announced a set of 7 AES-NI instructions in order to improve the performance of the AES algorithm on the Intel CPU. In this paper, we verify how much the performance IPSec-based VPN can be improved when using seven sets of AES-NI instruction of the Intel CPU.

• Journal of the Korean Vacuum Society
• /
• v.2 no.2
• /
• pp.145-151
• /
• 1993

Ultra High Vacuum chamber for surface analysis and a series of AES-LEED controllers for LEED optics was designed and constructed. Electron energy resolution of LEED optics was tested. On the basis of the layer by layer mode, thickness of evaporated Ni on Pt(111) was calculated from the Auger signal ratio.

• Journal of Environmental Health Sciences
• /
• v.31 no.1
• /
• pp.73-78
• /
• 2005

A determination method of trace Ni(II) and Zn(II) in aqueous solution was studied and developed by adsorbing on titanium dioxide. For this purpose, several conditions were optimized such as the pH of sample solution, adsorption time, the types and concentration acid, and desorption time. The titanium dioxide was added in sample solution which was pH adjusted. Then, the sample solution was stirred for 5 minutes. This mixture was stored in room temperature for 30 minutes to allow adsorption. After filtering and washing the titanium dioxide, the analytes were dissolved from the titanium dioxide on membrane filter by an ultrasonic vibration for 10 minutes in 1.0 M $HNO_3$ solution. Then, this sample solution was analysed using ICP-AES. The adsorption equilibrium was achieved in 30 minutes. The desorption was the most of effective with 1.0 M(mol/l) nitric acid solution, and desorption time was 10 minutes. This procedure was applied for the analysis of two real samples, i.e., brown seaweed and tangle. The recoveries of Ni(II) and Zn(II) in spiked samples were 89.4${\sim}$98.9% for analytes.

• Analytical Science and Technology
• /
• v.6 no.2
• /
• pp.217-223
• /
• 1993

Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and $250^{\circ}C$ in a high-vacuum resistance heating evaporator and annealed at $300^{\circ}C$, $450^{\circ}C$ and $600^{\circ}C$ for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were $1000{\AA}$, $300{\AA}$, and $50{\AA}$, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of $250^{\circ}C$ and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.

• Corrosion Science and Technology
• /
• v.6 no.6
• /
• pp.311-315
• /
• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.288-291
• /
• 2002

Application of metal silicides such as TiSi$_2$ and CoSi$_2$ as contacts and gate electrodes are being studied. However, TiSi$_2$ due to the linewidth-dependance, and CoSi$_2$ due to the excessive Si consumption during silicidation cannot be applied to the deep-submicron MOSFET device. NiSi shows no such problems and can be formed at the low temperature. But, NiSi shows thermal instability. In this investigation, NiSi was formed with a Ti-capping layer to improve the thermal stability. Ni and Ti films were deposited by the thermal evaporator. The samples were then annealed in the N$_2$ ambient at 300-800$^{\circ}C$ in a RTA (rapid thermal annealing) system. Four point probe, FESEM, and AES were used to study the thermal properties of Ti-capped NiSi layers. The Ti-capped NiSi was stable up to 700$^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after 600$^{\circ}C$. The AES results revealed that the Ni diffusion further into the Si substrate was retarded by the capping layer, resulting in the suppression of agglomeration of NiSi films.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1994.02a
• /
• pp.35-35
• /
• 1994

The surface segragation of NiZr, CuZr alloy has been studied wi th X-ray Imotoelectron spectroscopy(XPS), Auger electron spectroscopy(AES) and low energy ion scattering(LEIS). The composition of outmost atomic layer has been determinded by the use of LEIS at several incident energies using Ar+ ion. In the LEIS analysis, the effect of charge exchange has been estimated by a novel measurment of the charge exchange parameters while simul taneous determining the relative concentrations of Ni and Zr and the complementary information obtained will be described. The composition of the clean annealed surface, measured with AES only, will be contrasted wi th the surface concentration of the preferentially sputtered surface. The experimental results has been clearly demonstrated that when the NiZr ruld CuZr alloys are exposed to continuous Ar+ ion bombardment the outermost atomic layer is Zr rich due to preferential sputtering of Ni atoms. where Ni is preferentially sputtered, but the difference in sputtering yields is not sufficient to explain the observed composition. Therefore, it is necessary to consider other processes such as Radiation Induced Segregation(RIS). The surface composition of the heated sample surface predicts that Zr should surface segregate which futher supports the view that part of the Zr enrichment is due to RIS.to RIS.

• Journal of the Korean Society of Clothing and Textiles
• /
• v.28 no.1
• /
• pp.165-171
• /
• 2004

The analytical method of toxic heavy metals in disposable diapers was developed. Disposable diapers obtained from Korea, Japan, America and German were determinated and quantified. Sample treatment (Total Digestion) was wet chemical acid digestion for extraction of nine hazardous inorganic elements (Sb, As, Pb, Cd, Cr, Co, Cu, Ni, Hg) in disposable diapers. Inductively Coupled Plasma Mass Spectrometer (ICP-MS) and Inductively Coupled Plasma Atomic Emission Spectrometer (ICP-AES) have been used for analyzing nine hazardous inorganic elements. The results were as follows : The concentration of extractable Sb which was treated for 3 hours with artificial urine and disposable diapers was higher than those of 6 hours and 24 hours. The concentration of extractable Cr was same as Sb. On the other hands, the behavior of Cu and Ni were different from Sb and Cr. Concentrations of extractable Cu and Ni increased as increasing the reaction time between artificial urine and disposable diapers.

• Analytical Science and Technology
• /
• v.24 no.2
• /
• pp.61-68
• /
• 2011

Ni-coated alumina was prepared by sonochemical method. To increase an efficiency of Ni coating on alumina, amorphous alumina was prepared by sol-gel method and Ni was coated to fine particles of alumina. Ni-coated alumina was prepared from various calcination temperatures ($500^{\circ}C$, $1,000^{\circ}C$), concentrations of Ni solution (0.01 M~0.2 M) and sonochemical reaction times (30 min, 2h). The prepared fine particles were characterized by X-Ray Diffractometer (XRD), Scanning Electron Microscope (SEM), Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP-AES), and Particle Size Analyzer (PSA). The coating amount of Ni increased, as Ni concentration and ultrasonication time increased. The maximum amount of Ni was coated to fine particles of alumina, when Ni-coated alumina was prepared with 0.1 M concentration of Ni solution for 2 h of sonication time at $1000^{\circ}C$ of calcination temperature. The average particle size was in the range of 835.9 to 986.7 nm.

• Korean Journal of Materials Research
• /
• v.13 no.1
• /
• pp.24-30
• /
• 2003

The Raney Ni catalyst was fabricated by mechanochemically process(MC process) in the Al-Ni system. Intermetallic compound obtained by mechanical alloying was leached in an alkaline solution. The characteristics of the mechanically alloyed powder and Raney Ni catalyst were analyzed by XRD, ICP-AES and EXAFS. In Al-50wt.%Ni, the metastable intermetallic compound phase close to AlNi phase was obtained by mechanical alloying unlike Al-Ni equilibrium phase diagram. The metastable intermetallic compound was transformed into $Al_3$$Ni_2$phase via the annealing at $750^{\circ}C$. The microstructure of Raney Ni fabricated by MC process was mainly bcc Ni including fcc Ni.