• 제목/요약/키워드: 4-Point Bending

검색결과 502건 처리시간 0.022초

용융 Si 침윤법에 의해 제조된 반응소결 탄화규소 복합체에서 SiC 입자 크기의 영향 (The Effect of SiC Powder Size at Reaction Bonded SiC Composite Fabricated by a Molten Si Infiltration Method)

  • 윤성호;조경선;;정훈;김영도;박상환
    • 한국세라믹학회지
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    • 제45권8호
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    • pp.486-492
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    • 2008
  • Reaction bonded silicon carbide(RBSC) composite for heat-exchanger was fabricated by molten Si infiltration method. The raw materials with variable particle sizes were used in this experience. The finer the particle size in sintered silicon carbide was the more increasing 3-point bending strength and fracture toughness. As the adaptable particle sizes had been occupied interstice arising from packing sample, the mechanical properties were increased. In the PCS1-1 sample, the 3-point bending strength and fracture toughness were 323MPa and $4.9\;MPa{\cdot}m^{1/2}$, respectively.

ENF 시험편을 이용한 평직 CFRP의 층간파괴인성 및 AE 특성 평가 (The Evaluation of Interlaminar Fracture Toughness and AE Characteristics in a Plain Woven CFRP Composite with ENF Specimen)

  • 윤유성;권오헌
    • 동력기계공학회지
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    • 제10권2호
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    • pp.117-123
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    • 2006
  • Woven fabrics composites are used as primary structural components in many applications because of their superior properties that offer high specific strength and stiffness. However, the complexity of the fabric structure makes understanding of their failure behavior very difficult. Also, laminate woven fabrics CFRP have unique failure mechanisms such as fiber bridging, fiber/matrix crack and so on. In particular, the delamination phenomenon of the composite materials is one of the most frequent failure mechanisms. So, we estimated interlaminar fracture and damage in composites using as ENF specimen by a 3 point bending test. And AE characteristics were examined for crack propagation on plain woven CFRP. We obtained the following conclusions from the results of the evaluation of the 3 point bending fracture test and AE characteristic estimation. AE counts of maximum crack length were obtained as $85.97{\times}10^4\;and\;93{\times}10^3\;for\;a_0/L=0.3$ and 0.6, respectively. Also the maximum amplitudes were over 80dB at both $a_0/L=0.3\;and\;0.6$. $G_{IIc}$ at that's $a_0/L$ ratio were obtained with $1.07kJ/m^2\;and\;3.79kJ/m^2$.

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식품분쇄용 세라믹 롤 재료 개발과 기계적 특성평가 (Development of Ceramic Roll Materials for Food Grinding Processing and Evaluation of Mechanical Behavior)

  • 강위수
    • Journal of Biosystems Engineering
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    • 제26권1호
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    • pp.47-56
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    • 2001
  • In order to prevent the possibility of mixing of metal powder during food grinding processing with the metal roll mill this study was conducted to develope the materials of ceramics roll as a substitute of gray cast iron mill. Since the ceramics is brittle material and can be broken easily by a crack, it was needed to develope engineering ceramics roll materials with high elastic modulus and fracture toughness. Adding 0∼50 wt% Al$_2$O$_3$as densification additives to porcelain body material and forming the ceramics an different condition, mechanical properties were evaluated. The material structure’s densification process was analyzed by SEM and XRD. The evaluation of the mechanical properties of ceramics roll materials were compared and analyzed by non-destructive test using Young’s modulus and destructive test using 3-point bending strength and fracture toughness. The results showed several correlative results. Porcelain body material with 40 wt% Al$_2$O$_3$content heated at 1,200$\^{C}$ for 5h was high bulk density of 2.77, Young’s modulus of 118.4Gpa, 3-point bending strength of 137 MPa and fracture toughness of 2.88 MPa$.$m$\^$$\sfrac{1}{2}$/ . After analyzing the relationship between non-destructive test and destructive test, the coefficient of determination was more than 0.9. Therefore, the evaluation of non-destructive test by ultrasonic was turned out to be feasible in evaluating the mechanical properties of ceramics.

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치과용(齒科用) 아말감의 파괴인성(破壞靭性)에 관한 연구(硏究) (A STUDY ON THE FRACTURE TOUGHNESS OF DENTAL AMALGAMS)

  • 허현도;김영해
    • Restorative Dentistry and Endodontics
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    • 제15권1호
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    • pp.20-32
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    • 1990
  • The plane strain fracture toughness of a material characterize the resistance to fracture in the presence of a sharp crack under severe tensile condition. Fracture toughness can be determined by indentation method. The purpose of this study was to investigate the fracture toughness of dental amalgams by measuring the plane strain fracture toughness and the fracture toughness from indentation method. Two conventional and four high copper amalgam alloys were employed for this study. The amalgams were prepared according to the A.D.A. spec. No. 1 and inserted into the specially designed mould with the single edge notch specimen to use in 3-point bending method. The specimens (20mm long, 4mm wide, 2mm thick) were stored at $37^{\circ}C$ for 1 week, and tested in 3-point bending by means of Instron at a cross-head speed of 1mm/min. In indentation method, the specimens were made in same manner as single edge notch specimens. The test was conducted with Vickers hardness tester at 10kg load. The following results were obtained. 1. The plane strain fracture toughness and the fracture toughness from indentation method were higher in the low copper amalgams than the high copper amalgams. 2. In high copper amalgams, the fracture toughness of amalgams decreases according as the copper contents increase. 3. In similar copper contents, the single composition amalgams have a higher fracture toughness than the admixed amalgams.

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3점 굴곡 실험에서 하중 속도 변화에 따른 단결정 실리콘 칩의 파괴강도 측정 (Fracture Strength Measurement of Single Crystal Silicon Chips as a Function of Loading Rate during 3-Point Bending Test)

  • 이동기;이성민
    • 대한금속재료학회지
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    • 제50권2호
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    • pp.146-151
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    • 2012
  • The present article shows how the fracture strength of single crystal silicon chips, which are generally used as semiconductor devices, is influenced by loading rate variation during a 3-point bending test. It was found that the fracture strength of the silicon chips slightly increases up to 4% with increasing loading rate for loading rates lower than 20 mm/min. Meanwhile, the fracture strength of the chips hardly increases with increase of loading rate to levels higher than 40 mm/min. However, there was an abrupt transition in the fracture strength within a loading rate range of 20 mm/min to 40 mm/min. This work explains through microscopic examination of the fracture surface of all test chips that such a big transition is related to the deflection of crack propagation direction from the (011) [${\bar{1}}00$] system to the (111) [${\bar{2}}11$] system in a particular loading rate (i.e. from 20 mm/min to 40 mm/min).

단결정 알루미나의 균열첨단에서 전위거동 (Dislocation Behavior around Crack Tips in Single Crystal Alumina)

  • 김형순
    • 한국재료학회지
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    • 제4권5호
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    • pp.590-599
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    • 1994
  • 취성재료의 균열첨단에서 전위의 이동에 대한 거동을 이해하기 위하여 단결정의 알루미나에 대한 취성-연성 전이(BDT)에 대한 한 연구가 진행되었다. 여러 온도에서, 예비균열된 시편으로 4점 굽힘시험을 이용하여 임계응력확대계수와 항복강도가 측정되었다. 그 결과로, BDT온도는 변형속도와 시편 방향에 따라 달랐다.:(1120)파단면에 대하여 $4.2 \times 10^{-6}$$4.2 \times 10^{-7}s^{-1}$에서 BDT온도는 각각$1034^{\circ}C$, $1150^{\circ}C$이었다. 또한 4점굽힘 시험을 이용하여 연성영역에서 균열첨단으로 부터 방출된 전위의 이동거리과 방향은 에칭 피트법에 의해서 측정되었다. 이중 에칭법을 이용하여 즉정된 사파이어에서 전위의 이동속도는 모델링 연구에 응용되었다.

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4${\times}$4 매트릭스 광스위치의 최적 설계 (An optimal design of 4${\times}$4 optical matrix switch)

  • 최원준;홍성철;이석;김회종;이정일;강광남;조규만
    • 전자공학회논문지A
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    • 제32A권8호
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    • pp.153-165
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    • 1995
  • The design procedure of a GaAs/AlGaAs semiconductor matrix optical switch is presented for a simplified tree architecture in the viewpoint of optical loss. A low loss, 0.537 dB/cm, pin type substrate is designed by considering the loss due to imputity doping at 1.3 $\mu$m wavelength. The operating voltage and the device length of a reversed ${\Delta}{\beta}$ electro-optic directional coupler(EODC) swith which is a cross-point device of the 4${\times}$4 matrix optical switch and the bending loss of rib waveguide are caculated as functions of waveguide parameters and bending parameters. There is an optimum bending radius for some waveguide parameters. It is recommened that higher optical confinement conditions such as wide waveguide width and higher rib-height should be chosen for structural parameters of a low loss and a process insensitive 4${\times}$4 matris optical switch. A 4${\times}$4 optical matrix switch which has a 3 dB loss and a 12 volt operating voltage is designed.

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전기저항측정에 의한 SiC섬유강화 $Si_3N_4$기 복합재료의 파괴예측 (Facture Prediction in SiC Fiber Reinforced $Si_3N_4$ Matrix Composites from Electrical Resistivity Measurements)

  • 신순기
    • 한국재료학회지
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    • 제10권5호
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    • pp.364-368
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    • 2000
  • 섬유강화 세라믹스 복합재료의 파괴예측 가능성을 알아보기 위해서 탄소섬유와 WC분말입자를 전기 전도상으로 이용하여 재료 스스로가 파괴예측 기능을 가지도록 한 SiC섬유강화 $Si_3N_4$세라믹스기 복합재료를 1773K에서 1시간 동안 hot-press하여 제작하였다. 4점 굽힘 시험하는 동안 전기저항 변화를 측정하여 파괴예측 기능을 평가하였다. 그 결과 전기정항은 재료의 파괴거동과 밀접한 관계를 가지면서 변화함을 알았다. 특히 분말형태의 전기전도상의 첨가는 본 복합재료의 파괴과정을 낮은 응력단계로부터 예측하는데 유용하였다. 결과적으로 이러한 재료설RP의 신개 (파괴예측기능)의도입은 $Si_3N_4$기 세라믹스를 구조재료로 이용함에 있어서 큰 문제가 되고 있는 신뢰성 확보에 새로운 기능을 준다고 생각되었다. 생각되었다.

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아연나노입자함유 교정용 레진의 물리적 특성 평가 (Evaluation of Physical Properties of Resin Containing Zinc Nanoparticle.)

  • 조정기
    • 디지털융복합연구
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    • 제17권10호
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    • pp.373-379
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    • 2019
  • 가철성 교정장치의 자가중합 레진인 Polymethyl methacrylate(PMMA)는 색의 안정성과 체적 안정성, 조직 친화성 등의 장점이 있어 오랫동안 치과 교정장치 재료로 사용해 왔다. 하지만 이러한 가철성 교정장치는 구강내에서 사용이 길어질수록 PMMA의 낮은 강도로 인하여 사용중 교정장치 레진상이 파절되는 단점이 있다. 본 연구에서는 zinc nanoparticle (ZNP)가 orthodontic PMMA에 혼합하여 강도효과를 도입하고자한다. ZNP을 함유된 orthodontic PMMA (0, 0.5, 1.0, 2.0 및 4.0%)의 직사각형 시료($1.4{\times}3.0{\times}19.0mm$)를 제작하였다. 제작완료된 시편을 1 mm/min의 속도로 3점 굽힘강도 시험하였고, 비커스 경도는 경도기를 이용하여 3회측정하였고, 표면조도기로 표면조도를 측정하였다. 그 결과 3점 굽힘강도는 유의한 변화가 없었다(p>0.05). 경도를 평가한 결과 역시 유지됨을 관찰하였다. 표면조도도 큰 차이가 보이지 않았다. 표면에너지는 유의차 있게 증가하였다. ZNP함유된 orthodontic PMMA는 의치 및 교정용 장치의 기계적 특성 대한 유의한 차이가 없음을 확인하였다. 결과적으로 본 연구에서 ZNP를 성공적으로 합성하고 이것이 분산된 교정용 레진 시편을 제작하였다. 추후 항균실험을 추가하여 고강도와 항균력이 있는 교정장치를 개발할 수 있는 연구가 필요하다.

Cu 두께에 따른 Cu-Cu 열 압착 웨이퍼 접합부의 접합 특성 평가 (Cu Thickness Effects on Bonding Characteristics in Cu-Cu Direct Bonds)

  • 김재원;정명혁;;;;이학주;현승민;박영배
    • 마이크로전자및패키징학회지
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    • 제17권4호
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    • pp.61-66
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    • 2010
  • 3차원 TSV 접합 시접합 두께 및 전, 후 추가 공정 처리가 Cu-Cu 열 압착 접합에 미치는 영향을 알아보기 위해 0.25, 0.5, 1.5, 3.0 um 두께로 Cu 박막을 제작한 후 접합 전 $300^{\circ}C$에서 15분간 $Ar+H_2$, 분위기에서 열처리 후 $300^{\circ}C$에서 30분 접합 후 후속 열처리 효과를 실시하여 계면접착에너지를 4점굽힘 시험법을 통해 평가하였다. FIB 이미지 확인 결과 Cu 두께에 상관없이 열 압착 접합이 잘 이루어져 있었다. 계면접착에너지 역시 두께에 상관없이 $4.34{\pm}0.17J/m^2$ 값을 얻었으며, 파괴된 계면을 분석 한 결과 $Ta/SiO_2$의 약한 계면에서 파괴가 일어났음을 확인하였다.