• Title/Summary/Keyword: 4 Point Bending

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A Study on 4 Point Bending Strength of Aircraft Composite Specimens (항공기 복합재료 적용 시편의 4점 굽힘 강도 연구)

  • Kong, Changduk;Park, Hyunbum;Lim, Seongjin
    • Journal of Aerospace System Engineering
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    • v.4 no.1
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    • pp.23-26
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    • 2010
  • In this study, it was performed damage assesment of small scale composite aircraft developing. This aircraft adopted the sandwich structure to skin of wing. This study aims to investigate the residual strength of sandwich composites with Nomex honeycomb core and carbon fiber face sheets after the open hole damage by the experimental investigation. The 4-point bending tests were used to find the bending strength, and the open hole was applied to introduce the simulated damage on the specimen. The bending strength test results after open hole was compared with the results of no damaged specimen test. The FEM analysis is assessed via an experimental 4-point bending test.

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Analysis on the Mechanism of Fluting in the Bending of Low Carbon Steels (저탄소강판을 이용한 굽힘 가공에서 발생하는 꺾임 현상에 대한 발생기구 해석)

  • Park, K.C.;Yoon, J.B.
    • Transactions of Materials Processing
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    • v.16 no.4 s.94
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    • pp.317-322
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    • 2007
  • In order to investigate the cause and condition of fluting in tangential bending of low carbon steel sheet, an analytic analysis, an experiment and a series of finite element analysis for bending process were done. The fluting in bended sheet was related with the yield point elongation of material. Due to the yield point elongation, unstable plastic hinge was occurred in course of bending of elastic perfectly plastic sheet. According to the analysis and computational results, lower yield point elongation than 5% was required to prevent fluting in 0.5-0.6t sheet in $15{\sim}25mm$ radius bending. The tendency of fluting occurrence was reduced as decreasing the radius of bending, increasing thickness of bended sheet, and removing irregularity in sheet and bending processes.

Development of a Pure Bending Test Machine and Bending Collapse Characteristics of Rectangular Tubes (순수굽힘 시험기개발 및 사각관부재의 굽힘붕괴특성 연구)

  • 강신유;장인배;김헌영
    • Transactions of the Korean Society of Automotive Engineers
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    • v.6 no.1
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    • pp.222-233
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    • 1998
  • A 4-point pure bending res machine is developed the evaluate the pure vending moment-rotation properties of the thin-walled tubes without imposing shear and tensile forces. The moment-rotation properties of the thin-walled tubes are measured up to and beyond collapse with the pure bending test machine. The test results are compared with those of finite element analyses and existing analytical solution.

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A Study on the Springback for Three Point Bending (3점 굽힘에서의 스프링백에 관한 연구)

  • 이호용;황병복
    • Transactions of Materials Processing
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    • v.3 no.4
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    • pp.401-414
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    • 1994
  • Springback for the three point bending is anlayzed and experimented. Neutral axis is assumed to remain at the midthickness for large ratio of radius of curvature to thickness. Pure bending theory is used to be extended to the analysis of the springback for three point bending. The specimen is thought to be divided into numerous small elements. The theory for pure bending is then adopted for analysis of each element to obtain springback in terms of the relationship between initial and final deflections. the boundary conditions between neighborhood elements are the deflection and slope which should be the same. Deflection is calculated by summing up the deflections of each element. Experiments have been performed for different conditions which are punch radius, span length, and initial deflections. Comparisons between the analytical solution and experimental results show the same trends.

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An Experimental Study on the Failure Characteristics of Flip Chips in Cyclic Bending Test (플립칩의 반복 굽힘 시험 시 파손 특성에 관한 실험적 연구)

  • Lee, Yong-Sung;Jeong, Jong-Seol;Kim, Hong-Seok;Shin, Ki-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.4
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    • pp.362-368
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    • 2009
  • In general, circuit board assemblies experience various mechanical loadings during assembly and in actual use. The repeated cyclic bending can cause electrical failures due to circuit board cracks, solder interconnects cracks, and the component cracks. In this paper, we report on the failure characteristics of semiconductor chips under the repeated cyclic bending. We first describe a new 4-point bending tester, which is developed according to JEDEC standard No. 22B113. The performance of the tester is then estimated through actual experiments. Test results reveal that the cracks first occur on the outer balls around 20,000 cycles and gradually propagate to the inner balls where cracks are found around 70,000 cycles.

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Nanoscale Longitudinal Normal Strain Behavior of ${Si_3}{N_4}$-to-ANSI 304L Brazed Joints under Pure Bending Condition

  • Seo, D.W.;Lim, J.K.
    • International Journal of Korean Welding Society
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    • v.4 no.1
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    • pp.46-52
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    • 2004
  • To combine the mechanical advantages of ceramics with those of metals, one often uses both materials within one composite component. But, as known, they have different material properties and fracture behaviors. In this study, a four-point bending test is carried out on $Si_3N_4$ joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu interlayer at room temperature to evaluate their longitudinal strain behaviors. And, to detect localized strain, a couple of strain gages are pasted near the joint interfaces of the ceramic and metal sides. The normal strain rates are varied from $3.33{\times}10^5$ to $3.33{\times}10^{-1}s^{-1}$ Within this range, the experimental results showed that the four-point bending strength and the deflection of the interlayer increased with increasing the strain rate.

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Study on fracture mechanics of granite specimens with different precast notch depths based on DIC method

  • Shuwen Cao;Hao Shu
    • Geomechanics and Engineering
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    • v.33 no.4
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    • pp.393-400
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    • 2023
  • Displacements near crack and stress intensity factor (SIF) are key parameters to solve rock failure issue when using fracture mechanics. In order to study the horizontal displacement and stress intensity factor of the mode I fracture, a series of three-point bending tests of granite specimens with central notch were carried out. The evolution of horizontal displacements of precast notch and crack tip opening displacements (CTOD) were analyzed based on the digital image correlation (DIC) method. Stress intensity factors for three-point bending beams with arbitrary span-to-width ratios(S/W) were calculated by using the WU-Carlsson analytical weight function for edge-crack finite width plate and the analytical solution of un-cracked stress by Filon. The present study provides a high efficient and accurate method for fracture mechanics analysis of the three-point bending granite beams.

Four Point Bending Test for Adhesion Testing of Packaging Strictures: A Review

  • Mahan, Kenny;Han, Bongtae
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.33-39
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    • 2014
  • To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

Bending Characteristics of Ag Micro Circuits using Electrohydrodynamics Printing Technology (전기수력학적 프린팅 기술을 이용한 Ag 미세회로의 굽힘 특성)

  • Lee, Yong-Chan;Ahn, Ju-Hun;Lee, Chang-Yull
    • Journal of Aerospace System Engineering
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    • v.13 no.4
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    • pp.37-42
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    • 2019
  • The objective of this study was to study the bending characteristics of Ag nano ink using EHD (Electrohydrodynamics) inkjet printing technology for flexibility and miniaturization of devices. The optimal conditions for the technology were derived, and bending characteristics of the Ag nano circuit obtained. For the EHD printing, it is essential to find the optimal point for each parameter such as material characteristics, density, flow rate, voltage, discharge height etc. Therefore, it was derived as the point from the working height and the applied voltage. Also, bending characteristics are confirmed by measuring resistance with each radius of curvature using a fabricated bending module. It was confirmed that rate of resistance change increases rapidly as the radius of curvature increases.

High Temperature Design Criteria of Cordierite Ceramic Substrate in Four-point Banding (4점 굽힘시험에서 코디어라이트 세라믹 담체의 고온설계기준)

  • Baek, Seok-Heum;Park, Jea-Sung;Choi, Hyun-Jin;Cho, Seok-Swoo;Joo, Won-Sik
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.173-174
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    • 2008
  • The four-point bending test is a widely used method to determine material parameters. The aim of the present study was to evaluate the flexural strength (or modulus of rupture) and the Weibull modulus of cordierite ceramic substrate by means of four-point bending tests. The strength data from experiments followed Weibull statistics. These data indicate that the fatigue effects are more severe when the substrate temperature in the peripheral region is near $200^{\circ}$. At temperatures well above $200^{\circ}C$ the available design strength can be as high as 65% as substrate's initial strength.

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