• Composites Research
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• v.17 no.6
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• pp.22-27
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• 2004

The objective of this work is to design Surface Antenna Structure (SAS) and investigate fatigue behavior of SAS that is asymmetric sandwich structure. This term, SAS, indicates that structural surface becomes antenna. Constituent materials are selected considering electrical properties, dielectric constant and tangent loss as well as mechanical properties. For the antenna performance, SSSFIP elements inserted into structural layers were designed fur satellite communication at a resonant frequency of 12.5 GHz and final demonstration article was $16{\;}{\tiems}{\;}8$ array antenna. From electrical measurements, it was shown that antenna performances were in good agreement with design requirements. In cyclic 4-point bending, flexure behavior was investigated by static and fatigue test. Fatigue life curve of SAS was obtained. The fatigue load was determined experimentally at a 0.75 (1.875kN) load level, Experimental results were compared with single load level fatigue life prediction equations (SFLPE) and in good agreement with SFLPE. SAS concept is the first serious attempt at integration fur both antenna and composite engineers and promises innovative future communication technology.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.389-396
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• 2008

The effect of thermal cycling on bond strength and residual stress at the interface between benzocyclobutene (BCB) and plasma enhanced chemical vapor deposited (PECVD) silicon dioxide ($SiO_2$) coated silicon wafers were evaluated by four point bending and wafer curvature techniques. Wafers were bonded using a pre-established baseline process. Thermal cycling was done between room temperature and a maximum peak temperature. In thermal cycling performed with 350 and $400^{\circ}C$ peak temperature, the bond strength increased substantially during the first thermal cycle. The increase in bond strength is attributed to the relaxation in residual stress by the condensation reaction of the PECVD $SiO_2$: this relaxation leads to increases in deformation energy due to residual stress and bond strength.

• Composites Research
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• v.28 no.4
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• pp.212-218
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• 2015

A large composite spar was manufactured using an automatic fiber placement (AFP) machine. To verify its structural performance, the weakest part of the structure, which is called 'corner radius', was tested under bending and examined by finite element analysis. Since the application of AFP machine to composite structure fabrication is still in early stage in Korea, this paper presents the summary of whole process for manufacturing composite spar using AFP machine from mandrel design and analysis to verification test. The deflection and stress by mandrel weight and AFP machine force, thermal deformation and natural frequency were all examined for mandrel design. The target structure was composite C-spar and cured in an autoclave. Test results were compared with nonlinear finite element analysis results to show that the structure has the strength close to the theoretical value. It was confirmed that the corner radius of the spar manufactured by AFP process showed deviation less than 20% compared with first ply failure strength. The results indicate that the AFP technology could be used for large scale composite structure production in the near future.

• Composites Research
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• v.18 no.2
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• pp.20-29
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• 2005

To evaluate the flexural deformation and strength of composite motor case above the glass transition temperature$(T_g),\;170^{\circ}C$, of resin material, a finite element analysis(FEA) model in which material non-linearity and progressive failure mode were considered was proposed. The laminated flexural specimens which have the same lay-up and thickness as the composite motor case were tested by 4-point bending test to verify the validity of FEA model. Also. mechanical properties in high temperature were evaluated to obtain the input values for FEA. Because the material properties related to resin material were highly deteriorated in the temperature range beyond $T_g$, the flexural stiffness and strength of laminated flexural specimen in $200^{\circ}C$ were degraded by also $70\%\;and\;80\%$ in comparison with normal temperature results. Above $T_g$, the failure mode was changed from progressive failure mode initiated by matrix cracking at $90^{\circ}$ ply in bottom side and terminated by delamination at the center line of specimen to fiber compressive breakage mode at top side. From stress analysis, the progressive failure mechanism was well verified and the predicted bending stiffness and strength showed a good agreement with the test results.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• Journal of the Korean Society of Radiology
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• v.12 no.1
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• pp.115-122
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• 2018

The success of the total hip arthroplasty is revealed as initial stability, range of motion, and long term pain, etc. Depending upon choice of implantation options such as femoral neck offset, diameter of the femoral head, the lateral opening tilt. Especially the impingement between femoral head component and acetabular cup limits the range of motion of the hip. In this sense, estimation or evaluation of the range of motion before and after the total hip arthroplasty is important. This study provides the details of a computer simulation technique for the hip range of motion of intact hip as well as arthroplasty. The suggested method defines the hip rotation center and rotation axes for flexion and abduction, respectively. The simulation uses CT-based reconstructed 3D models and an STL treating software. The abduction angle of the hip is defined as the superolateral rotation angle from sagittal plane. The flexion angle of the hip is defined as the superoanterior angle from the coronal plane. The maximum abduction angle is found as the maximum rotation angle by which the femoral head can rotate superolaterally about the anterior-posterior axis without impingement. The maximum flexion angle is found as the maximum rotation angle by which the femoral head can rotate superoanteriorly about the medial-lateral axis without impingement. Compared to the normal hip, the total hip replacement hip showed decreased abduction by 60 degrees and decreased flexion by 4 degrees. This measured value implies that the proposed measurement technique can make surgeons find a modification of increase in the femoral neck offset or femoral head, to secure larger range of motion.