• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Journal of Navigation and Port Research
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• v.28 no.1
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• pp.31-36
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• 2004

In this paper, the characteristics of an inverted-F antenna for the 2.4GHz(ISM) Bluetooth system have been analysed in terms of the variation of design parameters. The antenna can be integrated on printed circuit board, and the characteristics in terms of the variation of the gap between feed line and shorting stub, gap between antenna's leg and ground plane, antenna leg's width, substrate's height and dielectric constant are analysed By using these characterization plot of design parameter, the tuning techniques are proposed to design optimum antenna. The designed antenna has 6.3%(150MHz) frequency bandwidth for VSWR under 1.5, and 3dBi gain.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.1
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• pp.35-42
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• 2003

Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.9
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• pp.940-946
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• 2010

In this paper, we proposed the internal antenna on PCB(Planar Circuit Board) for achieving WWAN(Wireless Wide Area Network) operation in the laptop computer. The proposed antenna has a metal structure instead of printed pattern on PCB to improve the antenna characteristics for GSM850/900 bands. Compared to PCB embedded antenna without metal structure, the proposed antenna occupies similar area of $74{\times}11{\times}0.5\;mm^3$ with before and the bandwidth of the proposed one for GSM850/900 bands is increased 13 MHz than before. Further we confirmed that the proposed antenna has higher radiation gain of -4.45~-2.29 dBi for GSM850/900 bands than PCB embedded antenna without metal structure.

• Journal of Korea Society of Industrial Information Systems
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• v.11 no.5
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• pp.98-104
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• 2006

In this parer, proposed a Miniature inverted F Antenna for Bluetooth applications using folded structure and confirm it through producing and measurement. The proposed antenna as PIFA is optimized the impedance matching and the radiation pattern by positioning of feed line and short line. This antenna is designed with Microwave Studio presented CST and the optimized antenna structure is fabricated. The optimized miniature antenna size is 17.3 * 6 * 0.8 mm, the measured return loss bandwidth is 220MHz at 2.45GHz, the radiation pattern is quasi omni, and the gain is -1 dBi. these results are similar to the simulation data. It is comparatively appropriate for Bluetooth system.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.42 no.12
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• pp.159-164
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• 2005

Recently, it has demanded high-speed digital circuits as information increase. Therefore, electromagnetic characteristics of compact microwave circuit occurred importantly. And, the effect of the imperfect ground plane on the signal integrity and influence of coupling between two parallel lines for high-speed digital transmission line on the printed circuit board is investigated by FDTD simulations in 3-D electromagnetic analysis method. The results of FDTD simulation are compared with the ADS simulation in commercial software, analyzed lumped element of modeling and electromagnetic wave's radiation of slot as frequency. As a consequence, when the slot in the ground plane is under microstrip line, it has much effect on propagation of wave.

• Journal of electromagnetic engineering and science
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• v.15 no.3
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• pp.185-193
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• 2015

In this paper, a hybrid multiple input multiple output (MIMO) antenna for eight-band mobile handsets is designed and implemented. For the MIMO antenna, two hybrid antennas are laid symmetrically and connected by an interconnection tie, thereby enabling complementary operation. The tie affects both the impedance and radiation characteristics of each antenna. Further, printed circuit board (PCB) embedded type is applied to the antenna design. To verify the results of this study, we designed eight bands-LTE class 12, 13, and 14, CDMA, GSM900, DCS1800, PCS, and WCDMA-and implemented them on a bare board the same size as the real board of a handset. The voltage standing wave ratio (VSWR) is within 3:1 over the entire design band. Antenna isolation is less than -15 dB at the lower band, and -12 dB at the WCDMA band. Envelope correlation coefficient (ECC) of 0.0002-0.05 is obtained for all bands. The average gain and efficiency are measured to range from -4.69 dBi to -2.88 dBi and 33.99% to 51.5% for antenna 1, and -4.74 dBi to -2.97 dBi and 33.45% to 50.49% for antenna 2, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.10
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• pp.758-765
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• 2018

This paper presents a 24-GHz frequency-modulated continuous wave(FMCW) radar transceiver with two Rx and one Tx channels in 65-nm complementary metal-oxide-semiconductor(CMOS) process and implemented it on a radar system using the developed transceiver chip. The transceiver chip includes a $14{\times}$ frequency multiplier, low-noise amplifier, down-conversion mixer, and power amplifier(PA). The transmitter achieves >10 dBm output power from 23.8 to 24.36 GHz and the phase noise is -97.3 GHz/Hz at a 1-MHz offset. The receiver achieves 25.2 dB conversion gain and output $P_{1dB}$ of -31.7 dBm. The transceiver consumes 295 mW of power and occupies an area of $1.63{\times}1.6mm^2$. The radar system is fabricated on a low-loss Duroid printed circuit board(PCB) stacked on the low-cost FR4 PCBs. The chip and antenna are placed on the Duroid PCB with interconnects and bias, gain blocks and FMCW signal-generating circuitry are mounted on the FR4 PCB. The transmit antenna is a $4{\times}4$ patch array with 14.76 dBi gain and receiving antennas are two $4{\times}2$ patch antennas with a gain of 11.77 dBi. The operation of the radar is evaluated and confirmed by detecting the range and azimuthal angle of the corner reflectors.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.471-477
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• 2014

In this paper, a modeling and co-simulation methodology is proposed to predict the radiated electromagnetic interference (EMI) from on-chip switching I/O buffers. The output waveforms of I/O buffers are simulated including the on-chip I/O buffer circuit and the RC extracted on-chip interconnect netlist, package, and printed circuit board (PCB). In order to accurately estimate the EMI, a full-wave 3D simulation is performed including the measurement environment. The simulation results are compared with near-field electromagnetic scan results and far-field measurements from an anechoic chamber, and the sources of emission peaks were analyzed. For accurate far-field EMI simulation, PCB power trace models considering IC switching current paths and external power cable models must be considered for accurate EMI prediction. With the proposed EMI simulation model and flow, the electromagnetic compatibility can be tested even before the IC is fabricated.