• Title/Summary/Keyword: 3D integration

Search Result 825, Processing Time 0.026 seconds

Development of Smart Factory-Based Technology Education Platform Linking CPPS and VR (CPPS 및 VR을 연계한 스마트팩토리 기반 기술 교육 플랫폼 개발)

  • Lee, Hyun
    • Journal of Practical Engineering Education
    • /
    • v.13 no.3
    • /
    • pp.483-490
    • /
    • 2021
  • In this paper, we proposed the development of a smart factory intergrated technology education platform using smart factory based CPPS (Cyber Physical Production System) and VR (Vitrual Reality) technology and educational methods using the platform. A platform has been developed to learn how to integrate 3D digital twin and BOP (Bill of Process)-based manufacturing processes. In addition, Digital Twin established a smart factory-based integrated education platform by linking mechanical systems, digital twins, and virtual reality through the OPC-UA server. Based on this platform, the smart factory integration platform is proposed to have individual elements of the smart factory integration platform through BOP-based digital twin simulation, OPC-UA integration, MES system, SCADA system, and VR interworking.

Specification and Implementation of Projective Texturing Node in X3D

  • Kim, In-Kwon;Jang, Ho-Wook;Yoo, Kwan-Hee;Ha, Jong-Sung
    • International Journal of Contents
    • /
    • v.12 no.2
    • /
    • pp.1-5
    • /
    • 2016
  • Extensible 3D (X3D) is the ISO standard for defining 3D interactive web- and broadcast-based 3D content integrated with multimedia. With the advent of this integration of interactive 3D graphics into the web, users can easily produce 3D scenes within web contents. Even though there are diverse texture nodes in X3D, projective textures are not provided. We enable X3D to provide SingularProjectiveTexture and MultiProjectiveTexture nodes by materializing independent nodes of projector nodes for a singular projector and multi-projector. Our approach takes the creation of an independent projective texture node instead of Kamburelis's method, which requires inconvenient and duplicated specifications of two nodes, ImageTexture and Texture Coordinate.

3D Environmental Walkthrough Using The Integration of Multiple Segmentation Based Environment Models (다중 분할 기반 환경 모델의 통합에 의한 3차원 환경 탐색)

  • Ryoo, Seung-Taek
    • The Journal of Korean Association of Computer Education
    • /
    • v.8 no.1
    • /
    • pp.105-115
    • /
    • 2005
  • An environment model that is constructed using a single image has the problem of a blurring effect caused by the fixed resolution, and the stretching effect of the 3D model caused when information that does not exist on the image occurs due to the occlusion. This paper introduces the registration and integration method using multiple images to resolve the above problem. This method can represent parallax effect and expand the environment model to represent wide range of environment. The segmentation-based environment modeling method using multiple images can build a detail model with optimal resolution.

  • PDF

Research on Silicon Nanowire Transistors for Future Wearable Electronic Systems (차세대 웨어러블 전자시스템용 실리콘 나노선 트랜지스터 연구)

  • Im, Kyeungmin;Kim, Minsuk;Kim, Yoonjoong;Lim, Doohyeok;Kim, Sangsig
    • Vacuum Magazine
    • /
    • v.3 no.3
    • /
    • pp.15-18
    • /
    • 2016
  • In future wearable electronic systems, 3-dimensional (3D) devices have attracted much attention due to their high density integration and low-power functionality. Among 3D devices, gate-all-around (GAA) nanowire transistor provides superior gate controllability, resulting in suppressing short channel effect and other drawbacks in 2D metal-oxide-semiconductor field-effect transistor (MOSFET). Silicon nanowires (SiNWs) are the most promising building block for GAA structure device due to their compatibility with the current Si-based ultra large scale integration (ULSI) technology. Moreover, the theoretical limit for subthreshold swing (SS) of MOSFET is 60 mV/dec at room temperature, which causes the increase in Ioff current. To overcome theoretical limit for the SS, it is crucial that research into new types of device concepts should be performed. In our present studies, we have experimentally demonstrated feedback FET (FBFET) and tunnel FET (TFET) with sub-60 mV/dec based on SiNWs. Also, we fabricated SiNW based complementary TFET (c-TFET) and SiNW complementary metal-oxide-semiconductor (CMOS) inverter. Our research demonstrates the promising potential of SiNW electronic devices for future wearable electronic systems.

Comparability and uniformity of ontology for automated information integration of parts (부품 라이브러리의 자동 정보 통합을 위한 온톨로지의 비교 가능성과 균질성 확보)

  • Cho Joonmyun;Han Soonhung;Kim Hyun
    • The KIPS Transactions:PartD
    • /
    • v.12D no.3 s.99
    • /
    • pp.365-374
    • /
    • 2005
  • The B2B electronic product commerce needs intermediary system to provide an integrated interface for the parts libraries of multiple suppliers. However, it is difficult to automatically integrate the parts libraries because they are heterogeneous. Existing ontology-based approaches show a limited functionality of automated integration of information because Dey can not prevent ontologies from being modeled in different ways, so that the inter-ontology mappings to resolve the heterogeneity become complicated and arbitrary. In order to overcome such problems this paper proposes an ontology modeling framework for parts libraries based on the Guarino's theory of upper ontology. The framework provides knowledge modeling primitives which have explicit formal meanings and modeling principles based on ontological natures. Using the framework, ontology developers can model the knowledge of parts libraries systematically and consistently, so that the resulting ontologies become comparable and uniform and the ontology merging algorithm for the automated information integration can be easily developed.

An Approach for Integrated Modeling of Protein Data using a Fact Constellation Schema and a Tree based XML Model (Fact constellation 스키마와 트리 기반 XML 모델을 적용한 실험실 레벨의 단백질 데이터 통합 기법)

  • Park, Sung-Hee;Li, Rong-Hua;Ryu, Keun-Ho
    • The KIPS Transactions:PartD
    • /
    • v.11D no.3
    • /
    • pp.519-532
    • /
    • 2004
  • With the explosion of bioinformatics data such proteins and genes, biologists need a integrated system to analyze and organize large datasets that interact with heterogeneous types of biological data. In this paper, we propose a integration system based on a mediated data warehouse architecture using a XML model in order to combine protein related data at biology laboratories. A fact constellation model in this system is used at a common model for integration and an integrated schema it translated to a XML schema. In addition, to track source changes and provenance of data in an integrated database employ incremental update and management of sequence version. This paper shows modeling of integration for protein structures, sequences and classification of structures using the proposed system.

Prediction of Spring Back and Formability in 3-D Stamping by An Explicit Code (Explicit Code에 의한 Stamping시 스프링백 및 성형성 예측)

  • Kim, Heon-Young;Kim, Joong-Jae
    • Transactions of Materials Processing
    • /
    • v.3 no.1
    • /
    • pp.84-96
    • /
    • 1994
  • Simulation of 3 dimensional large irregularly shaped stamping process by a dynamic approach, based on an explicit time integration scheme, has been shown to be highly efficient and robust in comparison to traditional, implicit, quasi-static ones. The objective of the work is to evaluate the results from explicit code in application to deep drawing of rectangular cup and stamping of automotive front fender, in which deformation, force, thickness distribution are calculated. The method of predicting spring back and formability by and explicit code are suggested and applied to the processes.

  • PDF

Prediction of Welding Stress and Deformation by 3D-FEM Analysis and Its Accuracy (3차원 유한요소해석에 의한 용접응력과 변형의 해석 및 정도)

  • 장경호;이상형;이진형
    • Proceedings of the Computational Structural Engineering Institute Conference
    • /
    • 2000.10a
    • /
    • pp.11-17
    • /
    • 2000
  • ,An residual stress and out-of plane deformation produced by butt welding was analyzed by four kinds of 3D-FEM programs(Thermal El-P1 Analysis) developed by authors. The magnitude of deformation of perpendicular to the welding line generated by butt welding was large when the reduced integration method was used. This was because of removal of the locking phenomenon, which it was generally known that the stiffness of the shear component of out-of-plane was largely evaluated. And the magnitude of residual stress was analyzed by using the FEM program based on a large and small deformation theory was similar to that was analyzed by the redeced integration method.

  • PDF

Development of BIM Library for Civil Structures based on Standardized Drawings-Focused on 2D Standard Drawings of The MOLIT (표준도 기반의 토목구조물 BIM 라이브러리 개발 -국토교통부 표준도를 대상으로)

  • Moon, HyounSeok;Ju, KiBum
    • Korean Journal of Computational Design and Engineering
    • /
    • v.19 no.1
    • /
    • pp.80-90
    • /
    • 2014
  • In architecture projects, BIM library has widely been using for prefabrication of products and design process. However, since the shape of structures is different by each project in civil engineering projects and a shape representation system is complicated, it is not easy to develop a standardized BIM library. To solve these issues, this study develops BIM library based on standardized 2D shop drawings for civil structures. The standardized shop drawings, which are the targets of the BIM library model, should be first selected. Besides, in order to define modeling scope with the level of general and shop drawings for each structure, LOD(Level of Detail) and breakdown structure are determined, and development methods of families of 3D object type including 2D profile and rebar through commercial software are established. With these, properties of BIM library are configured, and a utilization model of the BIM libraries is constructed for 3D modeling and a simulation using the BIM library. Therefore, this study can identify properties that are necessary when IFC schema is configured for civil engineering projects. For future, it is expected that easiness of BIM design for the civil engineering projects and generation, management, and analysis system of BIM library for road projects will be secured.