• The Journal of Korean Institute of Communications and Information Sciences
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• v.22 no.8
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• pp.1622-1631
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• 1997

A 3-stages Active Microstrip Phased Array Antenn(AMPAA) is implemented using Injection-Locking Coupled Oscillators(ILCO). The AMPAA is a beam scanning active antenna with capability of electrical scanning by frequency varation of ILCO. The synchronization of resonance frequencies in array elements is occured by ILCO, and the ILCO amplifies the injection signal and functions as a phase shifter. The microstrip ptch is operated as a radiation element. The unilateral amplifier is a mutual coupling element of AMPAA, eliminates the reverse locking signal and controls the locking bandwidth of ILCO. The possibility of Monolithic Microwave Integrated Circuits(MMIC) of T/R module is proposed by simplified and integrated fabrication process of AMPAA. The 0.75.$lambda_{0}$ is fixed for a mutual coupling space to wide the scanning angle and minimize the multi-mode. The AMPAA has beam scanning angle of 31.4.deg., HPBW(Half Power Beam Widths) of 26.deg., directive gain of 13.64dB and side lobe of -16.5dB were measured, respectively.

• ETRI Journal
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• v.45 no.2
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• pp.338-345
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• 2023

A filtering power divider based on air-filled substrate-integrated waveguide (AFSIW) technology is proposed in this study. The AFSIW structure is used in the proposed filtering power divider for substantially reducing the transmission losses. This structure occupies a large area because of the use of air as a dielectric instead of typical dielectric materials. A filtering power divider provides power division and frequency selectivity simultaneously in a single device. The proposed filtering power divider comprises three AFSIW cavities. The filtering function is achieved using symmetrical inductive posts. The input and output ports of the proposed circuit are realized by directly connecting coaxial lines to the AFSIW cavities. This transition from the coaxial line to the AFSIW cavity eliminates the additional transitions, such as AFSIW-SIW and SIW-conductor-backed coplanar waveguide, applied in existing AFSIW circuits. The proposed power divider with a second-order bandpass filtering response is fabricated and measured at 5.5 GHz. The measurement results show that this circuit has a minimum insertion loss of 1 dB, 3-dB fractional bandwidth of 11.2%, and return loss exceeding 11 dB.

• ETRI Journal
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• v.23 no.1
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• pp.23-32
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• 2001

Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process is presented. A set of integrated capacitor structures is fabricated, and their scattering parameters are measured for a range of frequencies from 50 MHz to 5 GHz. Using optimized equivalent circuits obtained from HSPICE, mean and absolute deviation is calculated for each component of each device model. Monte Carlo Analysis for the capacitor structures is then performed using HSPICE. Using a comparison of the Monte Carlo results and measured data, it is determined that even a small number of sample structures, the statistical variation of the component values provides an accurate representation of the overall capacitor performance.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.139-142
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• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• Journal of the Optical Society of Korea
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• v.14 no.4
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• pp.438-443
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• 2010

In this paper, behaviors of photonic crystal (PC) radiative structures and antenna arrays have been compared for two types of uniform and binomial excitations. Appropriate duality has been shown between them. These results can be generalized to other types of excitation and arrangement of photonic crystal radiative arrays such as linear, planar and circular arrays of three dimensional (3D) photonic crystal termination resonators. Using these results in designing photonic circuits has some advantages for shaping a particular radiative beam at the photonic crystal exit, for instance reducing the divergence angle of the main lobe in order to enhance the directivity, for better coupling, or for splitting the emitted beam, for dividing the output beam to the next devices in photonic integrated circuits (PIC). For analysis and simulation of the photonic crystal structures, the finite difference time domain (FDTD) method has been employed.

• Journal of the Optical Society of Korea
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• v.15 no.2
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• pp.187-195
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• 2011

We have designed two photonic crystal waveguide (PCW) structures with output focused beams in order to achieve more coupling between photonic devices and decrease the mismatch losses in photonic integrated circuits. PCW with coupled resonator optical waveguide (CROW) termination has been optimized by both one dimensional (1D) and seven dimensional (7D) particle swarm optimization (PSO) algorithms by evaluating the fitness function by the finite difference time domain (FDTD) method. The 1D and 7D-optimizations caused the factors of 2.79 and 3.875 improvements in intensity of the main lobe compared to the non-optimized structure, whereas the FWHM in 7D-optimized structure was increased, unlike the 1D case. It has also been shown that the increment of focusing causes decrement of the bandwidth.

• Korean Journal of Optics and Photonics
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• v.33 no.4
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• pp.137-145
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• 2022

A directional coupler device, one of the fundamental components of photonic integrated circuits, distributes optical power by evanescent field coupling between two adjacent optical waveguides. In this paper, the design process for manufacturing a directional coupler device is reviewed, and the accuracy of the design results, as seen from the characteristics of the actual fabricated device, is confirmed. When designing a directional coupler device through a two-dimensional (2D) beam-propagation-method (BPM) simulation, an optical structure is converted to a two-dimensional planar structure through the effective index method. After fabricating the directional coupler device array, the characteristics are measured. To supplement the 2D-BPM results that are different from the experimental results, a 3D-BPM simulation is performed. Although 3D-BPM simulation requires more computational resources, the simulation result is closer to the experimental results. Furthermore, the waveguide core refractive index used in 3D-BPM is adjusted to produce a simulation result consistent with the experimental results. The proposed design procedure enables accurate design of directional coupler devices, predicting the experimental results based on 3D-BPM.

• Journal of information and communication convergence engineering
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• v.14 no.4
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• pp.258-267
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• 2016

Three-dimensional integrated circuits (3D ICs) experience die-to-die variations in addition to the already challenging within-die variations. This adds an additional design complexity and makes variation estimation and full-chip optimization even more challenging. In this paper, we show that the industry standard on-chip variation (AOCV) tables cannot be applied directly to 3D paths that are spanning multiple dies. We develop a new machine learning-based model and methodology for an accurate variation estimation of logic paths in 3D designs. Our model makes use of key parameters extracted from existing GDSII 3D IC design and sign-off simulation database. Thus, it requires no runtime overhead when compared to AOCV analysis while achieving an average accuracy of 90% in variation evaluation. By using our model in a full-chip variation-aware 3D IC physical design flow, we obtain up to 16% improvement in critical path delay under variations, which is verified with detailed Monte Carlo simulations.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.61-64
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• 2002

We have optimally designed and implemented by a monolithic microwave integrated circuit(MMIC) the low noise amplifier(LNA) of 5.8GHz band composed of receiver front-end(RFE) in a on-board equipment system for dedicated short range communication using a depletion-mode GaAs MESFET. The LNA is provided with two active devices, matching circuits, and two drain bias circuits. Operating at a single supply of 3V and a consumption current of 18㎃, The gain at center frequency 5.8GHz is 13.4dB, Noise figure(NF) is 1.94dB, Input 3rd order intercept point(lIPS) is 3dBm, and Input return loss(5$_{11}$) and Output return loss(S$_{22}$) is -l8dB and -13.3dB, respectively. The circuit size is 1.2$\times$O.7$\textrm{mm}^2$.EX>.>.