• Title/Summary/Keyword: 3D(three-dimensional)

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Fabrication and validation study of a 3D tumor cell culture system equipped with bloodvessle-mimik micro-channel (혈관모사 마이크로채널이 장착된 3D 종양 세포 배양 시스템의 제작 및 검증 연구)

  • Park, Jeong-Yeon;Koh, Byum-seok;Kim, Ki-Young;Lee, Dong-Mok;Yoon, Gil-Sang
    • Design & Manufacturing
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    • v.15 no.2
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    • pp.11-16
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    • 2021
  • Recently, three-dimensional (3D) cell culture systems, which are superior to conventional two-dimensional (2D) vascular systems that mimic the in vivo environment, are being actively studied to reproduce drug responses and cell differentiation in organisms. Conventional two-dimensional cell culture methods (scaffold-based and non-scaffold-based) have a limited cell growth rate because the culture cannot supply the culture medium as consistently as microvessels. To solve this problem, we would like to propose a 3D culture system with an environment similar to living cells by continuously supplying the culture medium to the bottom of the 3D cell support. The 3D culture system is a structure in which microvascular structures are combined under a scaffold (agar, collagen, etc.) where cells can settle and grow. First, we have manufactured molds for the formation of four types of microvessel-mimicking chips: width / height ①100 ㎛ / 100 ㎛, ②100 ㎛ / 50 ㎛, ③ 150 ㎛ / 100 ㎛, and ④ 200 ㎛ / 100 ㎛. By injection molding, four types of microfluidic chips were made with GPPS (general purpose polystyrene), and a 100㎛-thick PDMS (polydimethylsiloxane) film was attached to the top of each microfluidic chip. As a result of observing the flow of the culture medium in the microchannel, it was confirmed that when the aspect ratio (height/width) of the microchannel is 1.5 or more, the fluid flows from the inlet to the outlet without a backflow phenomenon. In addition, the culture efficiency experiments of colorectal cancer cells (SW490) were performed in a 3D culture system in which PDMS films with different pore diameters (1/25/45 ㎛) were combined on a microfluidic chip. As a result, it was found that the cell growth rate increased up to 1.3 times and the cell death rate decreased by 71% as a result of the 3D culture system having a hole membrane with a diameter of 10 ㎛ or more compared to the conventional commercial. Based on the results of this study, it is possible to expand and build various 3D cell culture systems that can maximize cell culture efficiency by cell type by adjusting the shape of the microchannel, the size of the film hole, and the flow rate of the inlet.

Three-Dimensional Magnetotelluric Modeling Using Integral Equations (적분방정식을 이용한 3차원 지자기 지전류 모델링)

  • Kim, Hee Joon;Lee, Dong Sung
    • Economic and Environmental Geology
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    • v.27 no.2
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    • pp.191-199
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    • 1994
  • We have developed an algorithm based on the method of integral equations to simulate the magnetotelluric (MT) responses of three-dimensional (3-D) bodies in a layered half-space. The inhomogeneities are divided into a number of cells and are replaced by an equivalent current distribution which is approximated by pulse basis functions. A matrix equation is constructed using the electric Green's tensor function appropriate to a layered earth, and is solved for the vector current in each cell. Subsequently, scattered fields are found by integrating electric and magnetic Green's tensor functions over the scattering current About a 3-D conductive body near the earth's surface, interpretation using 2-D transverse electric modeling schemes can imply highly erratic low resistivities at depth. This is why these routines do not account for the effect of boundary charges. However, centrally located profiles across elongate 3-D prisms may be modeled accurately with a 2-D transverse magnetic algorithm, which implicitly includes boundary charges in its formulation. Multifrequency calculations show that apparent resistivity and impedance phase are really two complementary parameters. Hence, they should be treated simultaneously in broadband MT interpretation.

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Visual quality enhancement of three-dimensional photon-counting integral imaging using background noise removal algorithm (배경 잡음 제거 알고리즘을 적용한 3차원 광자 계수 집적 영상의 화질 향상)

  • Cho, Ki-Ok;Kim, Young jun;Kim, Cheolsu;Cho, Myungjin
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.20 no.7
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    • pp.1376-1382
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    • 2016
  • In this paper, we present a visual quality enhancement technique for conventional three-dimensional (3D) photon counting integral imaging using background noise removal algorithm. Photon counting imaging can detect a few photons from desired objects and visualize them under severely photon-starved conditions such as low light level environment. However, when a lot of photons are generated from background, it is difficult to detect photons from desired objects. Thus, the visual quality of the reconstructed image may be degraded. Therefore, in this paper, we propose a new photon counting imaging method that removes unnecessary background noise and detects photons from only desired objects. In addition, integral imaging can be used to obtain 3D information and visualize the 3D image by statistical estimations such as maximum likelihood estimation. To prove and evaluate our proposed method, we implement the optical experiment and calculate mean square error.

Keratinocyte Migration in a Three-Dimensional In Vitro Wound Healing Model Co-Cultured with Fibroblasts

  • Iyer, Kritika;Chen, Zhuo;Ganapa, Teja;Wu, Benjamin M.;Tawil, Bill;Linsley, Chase S.
    • Tissue Engineering and Regenerative Medicine
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    • v.15 no.6
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    • pp.721-733
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    • 2018
  • BACKGROUND: Because three-dimensional (3D) models more closely mimic native tissues, one of the goals of 3D in vitro tissue models is to aid in the development and toxicity screening of new drug therapies. In this study, a 3D skin wound healing model comprising of a collagen type I construct with fibrin-filled defects was developed. METHODS: Optical imaging was used to measure keratinocyte migration in the presence of fibroblasts over 7 days onto the fibrin-filled defects. Additionally, cell viability and growth of fibroblasts and keratinocytes was measured using the $alamarBlue^{(R)}$ assay and changes in the mechanical stiffness of the 3D construct was monitored using compressive indentation testing. RESULTS: Keratinocyte migration rate was significantly increased in the presence of fibroblasts with the cells reaching the center of the defect as early as day 3 in the co-culture constructs compared to day 7 for the control keratinocyte monoculture constructs. Additionally, constructs with the greatest rate of keratinocyte migration had reduced cell growth. When fibroblasts were cultured alone in the wound healing construct, there was a 1.3 to 3.4-fold increase in cell growth and a 1.2 to 1.4-fold increase in cell growth for keratinocyte monocultures. However, co-culture constructs exhibited no significant growth over 7 days. Finally, mechanical testing showed that fibroblasts and keratinocytes had varying effects on matrix stiffness with fibroblasts degrading the constructs while keratinocytes increased the construct's stiffness. CONCLUSION: This 3D in vitro wound healing model is a step towards developing a mimetic construct that recapitulates the complex microenvironment of healing wounds and could aid in the early studies of novel therapeutics that promote migration and proliferation of epithelial cells.

Comparison of cone-beam computed tomography cephalometric measurements using a midsagittal projection and conventional two-dimensional cephalometric measurements

  • Jung, Pil-Kyo;Lee, Gung-Chol;Moon, Cheol-Hyun
    • The korean journal of orthodontics
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    • v.45 no.6
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    • pp.282-288
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    • 2015
  • Objective: This study investigated whether it is possible to use a two-dimensional (2D) standard in three-dimensional (3D) analysis, by comparing the angles and lengths measured from a midsagittal projection in 3D cone-beam computed tomography (CBCT) with those measured by 2D lateral cephalometric radiography (LCR). Methods: Fifty patients who underwent both LCR and CBCT were selected as subjects. CBCT was reoriented in 3 different methods and the measuring-points were projected onto the midsagittal plane. Twelve angle values and 8 length values were measured on both LCR and CBCT and compared. Results: Repeated measures analysis of the variance revealed statistically significant differences in 7 angular and 5 linear measurements among LCR and 3 types of CBCT (p < 0.05). Of these 12 measurements, multiple comparisons showed that 6 measurements (ANB, AB to FH, IMPA, FMA, Co-Gn, Go-Me) were not significantly different in pairwise comparisons. LCR was significantly different from 3 types of CBCT in 3 angular (SN to FH, interincisal angle, FMIA) and 2 linear (S-Go, Co-ANS) measurements. The CBCT method was similar for all measurements, except for 1 linear measurement, i.e., S-N. However, the disparity between the mean values for all parameters was within the range of clinical measurement error. Conclusions: 3D-CBCT analysis, using midsagittal projection, is a useful method in which the 2D-LCR normative values can be used. Although the measurements changed with reorientation, these changes were not clinically significant.

Recent Progress of Hybrid Bonding and Packaging Technology for 3D Chip Integration (3D 칩 적층을 위한 하이브리드 본딩의 최근 기술 동향)

  • Chul Hwa Jung;Jae Pil Jung
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.4
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    • pp.38-47
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    • 2023
  • Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

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Three-dimensional monte carlo modeling and simulation of point defect generation and recombination during ion implantation (이온 주입 시의 점결함 발생과 재결합에 관한 3차원 몬테 카를로 모델링 및 시뮬레이션)

  • 손명식;황호정
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.5
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    • pp.32-44
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    • 1997
  • A three-dimensional (3D) full-dynamic damage model for ion implantation in crystalline silicon was proposed to calculate more accurately point defect distributions and ion-implanted concentration profiles during ion implantation process. The developed model was based on the physical monte carlo approach. This model was applied to simulate B and BF2 implantation. We compared our results for damage distributions with those of the analytical kinchin-pease approach. In our result, the point defect distributions obtained by our new model are less than those of kinchin-pease approach, and the vacancy distributions differ from the interstitial distributions. The vacancy concentrations are higher than the interstitial ones before 0.8 . Rp to the silicon surface, and after the 0.8 . Rp to the silicon bulk, the interstitial concentrations are revesrsely higher than the vacancy ones.The fully-dynamic damage model for the accumulative damage during ion implantation follows all of the trajectories of both ions and recoiled silicons and, concurrently, the cumulative damage effect on the ions and the recoiled silicons are considered dynamically by introducing the distributon probability of the point defect. In addition, the self-annealing effect of the vacancy-interstitial recombination during ion implantation at room temperature is considered, which resulted in the saturation level for the damage distribution.

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Terahertz Nondestructive Time-of-flight Imaging with a Large Depth Range

  • Kim, Hwan Sik;Kim, Jangsun;Ahn, Yeong Hwan
    • Current Optics and Photonics
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    • v.6 no.6
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    • pp.619-626
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    • 2022
  • In this study, we develop a three-dimensional (3D) terahertz time-of-flight (THz-TOF) imaging technique with a large depth range, based on asynchronous optical sampling (ASOPS) methods. THz-TOF imaging with the ASOPS technique enables rapid scanning with a time-delay span of 10 ns. This means that a depth range of 1.5 m is possible in principle, whereas in practice it is limited by the focus depth determined by the optical geometry, such as the focal length of the scan lens. We characterize the spatial resolution of objects at different vertical positions with a focal length of 5 cm. The lateral resolution varies from 0.8-1.8 mm within the vertical range of 50 mm. We obtain THz-TOF images for samples with multiple reflection layers; the horizontal and vertical locations of the objects are successfully determined from the 2D cross-sectional images, or from reconstructed 3D images. For instance, we can identify metallic objects embedded in insulating enclosures having a vertical depth range greater than 30 mm. For feasible practical use, we employ the proposed technique to locate a metallic object within a thick chocolate bar, which is not accessible via conventional transmission geometry.

Preoperative Three Dimensional Ultrasonographic Evaluation of the Rotator Cuff Tear (회전근 개 파열에 대한 수술 전 3차원 초음파 검사의 유용성)

  • Yum, Jae-Kwang;Sin, Yong-Woon;Han, Jung-Il
    • Clinics in Shoulder and Elbow
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    • v.11 no.1
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    • pp.24-28
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    • 2008
  • Purpose: We wanted to determine if preoperative three dimensional (3D) ultrasonographic evaluation for rotator cuff tear is useful to measure the real size of a torn rotator cuff for performing an operation Materials and Methods: This study included 15 cases (7 males and 8 female), and these patients were confirmed to have a full thickness tear of the rotator cuff by 3D ultrasonography and the operative findings, as well as on the magnetic resonance imaging (MRI). The average age of the patients was 55.4yrs. Results: The average difference between the 3D ultrasonographic and operative measurements of the full thickness tear of the rotator cuff was 0.7 mm in the transverse length and 2.0 mm in the longitudinal length. Conclusion: The low error between the 3D ultrasonographic and intraoperative measurements of rotator cuff tear shows the usefulness of preoperative 3D ultrasonographic evaluation for rotator cuff tear.