• Journal of computational fluids engineering
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• v.10 no.3 s.30
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• pp.19-26
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• 2005

The purpose of this paper is the study on the characteristics of an inlet system with shock/boundary layer interactions by using various types of bumps which are substituted for the conventional bleeding system in supersonic inlet. in this study a comprehensive numerical analysis has been performed to understand the three-dimensional flow field including shock/boundary layer interaction and growth of turbulent boundary layer that might occur around a three-dimensional bump in a supersonic inlet. The characteristics of boundary layer seen in the current numerical simulations indicate the potential capability of a three-dimensional bump to control shock/boundary layer interaction in supersonic inlets.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.213-218
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• 2005

The purpose of this study is the characteristics of an innovative inlet system with shock/boundary layer interactions by using various types of bumps which are substituted for the conventional bleeding system in supersonic inlet. This study performs a comprehensive numerical effort that be directed at better understanding the three-dimensional flowfield includes shock/boundary layer interaction and growth of turbulent boundary layer that occur around a three-dimensional bump in a supersonic inlet. The characteristics of boundary layer seen in the current numerical simulations indicates the potential capability of the three-dimensional bump to control shock/boundary layer interaction in supersonic inlets.

• Tribology and Lubricants
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• v.21 no.6
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• pp.256-262
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• 2005

The calculation of bump foil deflection is very important to predict the performance of foil bearings more accurately, because the foil bearings consist of top foil and its elastic foundation usually called bump foil. For the purpose of this, a finite element model considering 3-dimensional structure of the bump foil is developed to calculate the deflection of inter-connected bump. The results obtained from the suggested model are compared and analyzed with those from the previous proposed deflection models. In addition, load capacity of the foil bearings is analyzed by using this model.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.870-874
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• 2004

This paper presents a three dimensional modeling and simulations of operation and running of a wheel loader using the ADAMS program. A wheel loader consists of a bucket, a boom, a crank, a front frame, a rear frame, a bucket cylinder, two boom cylinders, two steering cylinders, nine spherical joints, six universal joints, five translation joints, three inline joints, a revolute and a fixed joint. Judging from the actual degrees of freedom of the wheel loader, proper kinematic joints are selected to exclude redundant constraints in the modeling. Through the running simulation over a bump with the three dimensional modeling, the joint reaction forces are calculated.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.336-347
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• 1992

The three dimensional inviscid transonic cascade flow was investigated numerically, incorporation a four stage Runge-Kutta integration method proposed by Jameson. Time marching to the steady state was accelerated by using optimum time step and enthalpy damping. In describing the boundary conditions at inlet and outlet, Riemann invariants are considered. By adding a second and a fourth order artificial viscocities, the numerical instability due to the propagation of undamped disturbance or the rapid change of state near the shock has been prevented. The numerical results for are bump cascade, cambered two dimensional turbine cascade and three dimensional stator cascade agreed reasonably well with previous results. It has been known that the accuracy of the solution depended a lot on the modeling of the leading or trailing edge.

• Transactions of the Korean Society of Automotive Engineers
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• v.3 no.3
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• pp.97-108
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• 1995

A 3-dimensional double track vehicle model, that has 12-degress-of-freedom, was proposed to analyze handling and riding behaviours of an automotive car. Nonlinear characteristics of the suspension and steering systems of the vehicle model were considered in its equations of motion, which were solved by using the 4th-order Runge-Kutta integration method. Computer simulations for lane change, steady-state handling, and running-over-bump manoeuvres were made and verified by vehicle tests on proving ground. The computed results of the proposed model showed better agreement with test results than those of the conventional 2-dimensional single track model did. Especially they showed good accuracy near the characteristic speed and in high lateral accelerated manoeuvres.

• Korean Journal of Mathematics
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• v.25 no.3
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• pp.405-435
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• 2017

We deal with a sensitivity analysis of an optimal shape control problem for the stationary Navier-Stokes system. A two-dimensional channel flow of an incompressible, viscous fluid is examined to determine the shape of a bump on a part of the boundary that minimizes the viscous drag. By using the material derivative method and adjoint variables for a shape sensitivity analysis, we derive the shape gradient of the design functional for the model problem.

• ETRI Journal
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• v.36 no.4
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• pp.643-653
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• 2014

To reduce interconnect delay and power consumption while improving chip performance, a three-dimensional integrated circuit (3D IC) has been developed with die-stacking and through-silicon via (TSV) techniques. The power supply problem is one of the essential challenges in 3D IC design because IR-drop caused by insufficient supply voltage in a 3D chip reduces the chip performance. In particular, power bumps and TSVs are placed to minimize IR-drop in a 3D power delivery network. In this paper, we propose a design methodology for 3D power delivery networks to minimize the number of power bumps and TSVs with optimum mesh structure and distribute voltage variation more uniformly by shifting the locations of power bumps and TSVs while satisfying IR-drop constraint. Simulation results show that our method can reduce the voltage variation by 29.7% on average while reducing the number of power bumps and TSVs by 76.2% and 15.4%, respectively.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.