• 세라미스트
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• 제15권1호
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• pp.47-55
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• 2012

• 정보처리학회논문지D
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• 제10D권2호
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• pp.247-260
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• 2003

한 도메인 내에서 다양한 데이터베이스의 데이터를 공유하고 표준화하기 위해 MDR(Metadata Registry)을 이용하여 정보를 통합할 수 있다. 그러나 MDR을 구축하는 조직간 데이터요소 표현의 불일치 때문에 MDR간 광역적인 정보를 통합하는데 어려움이 있다. 또한 웹과 같은 다양한 데이터베이스가 존재하는 환경에서 통합된 정보를 검색하고자 하는 사용자는 각각의 데이터베이스 스키마 정보를 확보하기엔 한계가 있다. 따라서 본 논문에서는 MDR과 온톨로지(Ontology)를 결합한 3계층 정보 통합 시스템을 제안한다. MDR간 데이터요소의 관계를 사상시키고 표현의 불일치를 해결하기 위해 MDR의 표준성기능과 온톨로지의 개념과 관계기능을 결합한 정보 통합 모델을 정의하고 에이전트 기술을 적용한 계층적이고 독립적인 정보 통합 아키텍처를 제안한다. 온톨로지는 사용자의 질의에서 개념을 추출하기 위한 의미망(semantic network)의 역할과 MDR간의 데이터요소 관계를 설정하기 위한 기능으로 적용되었다. MDR과 지식베이스(Knowledge Base)는 데이터요소간 표현 불일치를 해결하기 위해 적용하였다. 이러한 핵심요소를 고려하여 제안된 아키텍처를 사용하여 MDR과 온톨로지를 결합한 3계층 정보 통합 시스템을 구현하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.332-332
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• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

• 한국표면공학회지
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• 제54권3호
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• 전자공학회논문지
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• 제53권7호
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• pp.131-137
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• 2016

본 논문에서는 기존의 2D IC의 성능을 개선하고 3D IC의 집적도와 전기적인 특성을 개선하기 위한 목적으로 연구되고 있는 TSV (Through Silicon Via)의 임피던스를 해석하였다. 향후 Full-chip 3D IC 시스템 설계에서 TSV는 매우 중요한 기술이며, 높은 집적도와 광대역폭 시스템 설계를 위해서 TSV에 대한 전기적인 특성에 관한 연구가 매우 중요하다. 따라서 본 연구에서는 Full-chip 3D IC를 설계하기 위한 목적으로 다중 TSV-to-TSV에서 거리와 주파수에 따른 TSV의 임피던스 영향을 해석하였다. 또한 이 연구 결과는 Full-chip 3D IC를 제조하기 위한 반도체 공정과 설계 툴에 적용할 수 있다.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2009년도 춘계학술대회 논문집 특별세미나,특별/일반세션
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• pp.233-237
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• 2009

In this study, we suggest that several approaches to evaluate the collision acceleration value of a car in the article 35 and the guideline 16 of Korean rolling stock safety regulation. There are various methods to evaluate collision acceleration such as; a displacement comparison method by the double integration of filtered acceleration data, a velocity comparison method by the integration of filtered acceleration data, an analysis method of time-velocity curve, or a differential method of time-velocity curve. We compared these methods one another using 1D dynamic simulation model composed of nonlinear dampers, springs and bars, and masses. Also, we applied these methods to a hybrid model, which is made of 3D shell element model and 2D collision dynamics model, in order to evaluate whether 1D force-displacement curve modeling for energy absorbing structures have an effect on the collision acceleration levels or not.

• 한국수학교육학회지시리즈D:수학교육연구
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• 제23권3호
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• pp.165-179
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• 2020

In this article, the author's intent is to begin a conversation centered on the question: How was the integration of digital technology into elementary mathematics classrooms framed? In the first part of the discussion, the author provides a historical perspective of the development of theoretical perspectives of the integration of digital technology in learning mathematics. Then, the author describes three theoretical perspectives of the role of digital technology in mathematics education: microworlds, instrumental genesis, and semiotic mediation. Last, based on three different theoretical perspectives, the author concludes the article by asking the reader to think differently.

• 한국재료학회지
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• 제23권10호
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• 한국자동차공학회논문집
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• 제19권1호
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• pp.66-72
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• 2011

Injection pressure is an important factor in filling procedure for injection molded parts. In addition, weldlines should be avoided to successfully produce injection molded parts. In this study, we optimally obtained injection molding process parameters that minimize injection pressure. Then, we determined the thickness of the part to avoid weldlines. To solve the optimization problem proposed, we employed MAPS-3D (Mold Analysis and Plastics Solution-3 Dimension), a commercial CAE tool for injection molding analysis, and PIAnO (Process Integration, Automation, and Optimization) as a commercial PIDO (Process Integration and Design Optimization) tool. We integrated MAPS-3D into PIAnO, automated the analysis and design procedure, and performed optimization by employing PQRSM (Progressive Quadratic Response Surface Method) equipped in PIAnO. We successfully obtained optimization results, which demonstrates the effectiveness of our design method.