• Title/Summary/Keyword: 특허패키지

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Possible Alternative Antioxidant Research Applied to Tin-based Plating Solution for Semiconductor Package (반도체 패키지용 주석계 도금액에 적용 가능한 대체 산화방지제 연구)

  • Go, Jeong-U;Lee, Geum-Seop;Lee, Hyeong-Geun;Kim, Gyeong-Tae;Park, Gyu-Bin;Son, Jin-Ho;Park, Hyeon-Guk;O, Jeong-Hun;Yun, Nam-Sik;Lee, Seung-Won
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.165.2-165.2
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    • 2016
  • 현재, 솔더범프용 주석계 도금액의 필수성분인 산화방지제의 경우, 국내외 경쟁사에서는 가격 및 성능이 우수한 벤젠/페놀 계열을 적용 중이다. 그러나, 최근 대형 고객사에서 페놀류 산화방지지제를 환경규제물질로 규정함에 따라, 자사에서는, 특허 이슈 해소 가능한 친환경 대체 산화방지제 개발을 해오고 있다. 본 연구에서는, 반도체 패키지용 주석계 도금액의 산화방지제 종류와 농도에 따른 주요 특성 (Particle, 전류 효율, 안정성 (변색, 침전 외), 범프 두께의 편차, 감광제의 침해, Reflow 후 빈공간 등)에 대하여 살펴보았다.

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Technical Trends of Next-Generation GaN Power Amplifier for High-frequency and High-power (차세대 GaN 고주파 고출력 전력증폭기 기술동향)

  • Lee, S.H.;Kim, S.I.;Min, B.G.;Lim, J.W.;Kwon, Y.H.;Nam, E.S.
    • Electronics and Telecommunications Trends
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    • v.29 no.6
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    • pp.1-13
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    • 2014
  • GaN(Gallium Nitride)는 3.4eV의 넓은 에너지 갭으로 인하여 고전압에서 동작이 가능하고, 분극전하를 이용한 캐리어 농도가 높아 높은 전류밀도와 전력밀도를 얻을 수 있으며, 높은 전자 이동도와 포화 속도로부터 고속 동작이 가능하여 고주파 고출력 고효율 소형의 전력증폭기 소자의 재료로 적합하다. 본고에서는 민수 및 군수 겸용 Ku-대역 및 Ka-대역 GaN 고출력 전력증폭기(SSPA: Solid-State Power Amplifier)와 관련된 GaN 전력증폭 소자, GaN 전력증폭기 MMIC(Microwave Monolithic Integrated Circuit), 내부정합 패키지형 GaN 전력증폭기 및 GaN SSPA에 대하여, 국내외 특허 기술동향과 연구개발 기술동향을 중심으로 고찰하고자 한다. 국외의 GaN 고주파 고출력 전력증폭기 기술의 연구동향이나 특허동향을 심층분석하여 연구개발에 활용하고자 한다.

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Recast of the EU patent law system and its Lessons (유럽연합 특허시스템의 대대적 변혁과 그 교훈)

  • Kim, Yong-Jin
    • Journal of Legislation Research
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    • no.54
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    • pp.303-343
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    • 2018
  • In 2013 a new era for EU patent law system was launched. The creation of the EU patent with unitary effect and the establishment of the Unified Patent Court established a new legal framework on substantive patent protection and patent litigation in Europe. This year the EU Patent Package would become a reality. It includes a regulation on a unitary patent, a regulation on the translation regime and an international Agreement on the Unitary Patent Court. In contrast to the classical European patent, the post-grant life of unitary patent will be governed by the newly created unified patent court and it will have unitary effect. In this article, I highlight the effect of the unitary patent and the jurisdiction of the unified patent court over unitary patents (and 'traditional' patents granted under the EPC that are not opted-out) for actions in relation to patent infringement or to revocation of a European patent and to licences of right. This article explores on the one hand the relation between national patent, the classical European patent and EU patent with unitary effect and on the other hand the relation of unified patent court to the Brussels $I^{bis}$ Regulation. Particular attention is paid to the institutional changes created by the unitary patent package abd the new supplementary forum that enables the UPC to hear disputes involving defendants from third States that relate to an infringement of a European patent and give rise to damage inside as well as outside the Union. Furthermore on the perspective North-east Asia this essay examines the lessons from the experiences of EU patent package.

A Study on Technology Trend of Power Semiconductor Packaging using Topic model (토픽모델을 이용한 전력반도체 패키징 기술 동향 연구)

  • Park, Keunseo;Choi, Gyunghyun
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.2
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    • pp.53-58
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    • 2020
  • Analysis of electric semiconductor packaging technology for electric vehicles was performed. Topic modeling using LDA technique was performed by collecting valid patents by deriving valid patents. It was classified into 20 topics, and the definition of technology was defined through extracted words for each topic. In order to analyze the trend of each topic, the trend of power semiconductor packaging technology was analyzed by deriving hot and cold topics by topic through regression analysis on frequency by year. The package structure technology according to the withstand voltage, the input/output-related control technology and the heat dissipation technology were derived as the hot topic technology, and the inductance reduction technology was derived as the cold topic technology.

KOREA PACKAGING AWARDS (지상전시 - 2010 미래패키징 신기술 정부 포상 수상작)

  • (사)한국포장협회
    • The monthly packaging world
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    • s.206
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    • pp.96-107
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    • 2010
  • 지식경제부가 2010 미래패키징신기술 정부포상 심사 결과를 발표했다. 미래피키징 신기술 정부포상은 국내 패키징(포장) 산업의 우수한 기술 및 국내 패키징 산업의 발전에 기여한 유공자를 발굴, 포상함으로써 관련 종사자의 사기진작 및 기술개발 의욕을 고취하고, 궁극적으로는 국내 제조업의 경쟁력 강화를 극대화하기 위해 마련됐다. 포상부문은 코리아스타상(일반부문, 학생부문), 유공자 표창(표창장)으로 구분하여 시상한다. 코리아스타상 일반부문은 패키징 완제품, 재료(플라스틱, 종이 판지, 금속, 유리, 목재, 복합소재), 친환경, 기계(설비) 및 관련부품, 인쇄(라벨링), 부자재, 생산 및 가공공정, 패키지 디자인 등의 분야에서 신기술 개발 또는 개선으로 수출신장, 매출 수익 증대 및 발명특허 획득을 통해 패키징 기술력 발전에 기여한 기업을 대상으로 하며 코리아스타상 학생부문은 패키징 디자인 관련분야 전공자로 패키징과 연관된 컨셉으로 제품에 적용 가능한 상품성, 창의성, 표현성, 친환경성, 지속가능성 등이 어우러진 독창적인 제품을 대상으로 한다. 또한 유공자 표창 부문은 패키징 관련 핵심 기술개발, 패키징산업발전 정책연구 및 패키징산업 육성 등에 기여한 개인을 대상으로 시상하게 된다. 본 고에서는 2010 미래패키징 신기술 정부 포상 수상작들에 대해 살펴보도록 한다.

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A Miniaturized 2.5 GHz 8 W GaN HEMT Power Amplifier Module Using Selectively Anodized Aluminum Oxide Substrate (선택적 산화 알루미늄 기판을 이용한 소형 2.5 GHz 8 W GaN HEMT 전력 증폭기 모듈)

  • Jeong, Hae-Chang;Oh, Hyun-Seok;Yeom, Kyung-Whan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.12
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    • pp.1069-1077
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    • 2011
  • In this paper, a design and fabrication of a miniaturized 2.5 GHz 8 W power amplifier using selectively anodized aluminum oxide(SAAO) substrate are presented. The process of SAAO substrate is recently proposed and patented by Wavenics Inc. which uses aluminum as wafer. The selected active device is a commercially available GaN HEMT chip of TriQuint company, which is recently released. The optimum impedances for power amplifier design were extracted using the custom tuning jig composed of tunable passive components. The class-F power amplifier are designed based on EM co-simulation of impedance matching circuit. The matching circuit is realized in SAAO substrate. For integration and matching in the small package module, spiral inductors and single layer capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 40 % and harmonic suppression above 30 dBc for the second(2nd) and the third(3rd) harmonic at the output power of 8 W.

Models of Database Assets Valuation and their Life-cycle Determination (데이터베이스 자산 가치평가 모형과 수명주기 결정)

  • Sung, Tae-Eung;Byun, Jeongeun;Park, Hyun-Woo
    • The Journal of the Korea Contents Association
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    • v.16 no.3
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    • pp.676-693
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    • 2016
  • Although the methodology and models to assess the economic value of technology assets such as patents are being presented in various ways, there does not exist a structured assessment model which enables to objectively assess a database property's value, and thus there is a need to enhance the application feasibility of practical purposes such as licensing of DB assets, commercialization transfer, security, etc., through the establishment of the valuation model and the life-cycle decision logic. In this study, during the valuation process of DB assets, the size of customer demand group expected and the amount of demand, the size and importance of data sets, the approximate degree of database' contribution to the sales performance of a company, the life-cycle of database assets, etc. will be analyzed whether they are appropriate as input variables or not. As for most of DB assets, due to irregular updates there are hardly cases their life-cycle expires, and thus software package's persisting period, ie. 5 years, is often considered the standard. We herein propose the life-cycle estimation logic and valuation models of DB assets based on the concept of half life for DB usage frequency under the condition that DB assets' value decays and there occurs no data update over time.

Design and Optimization of Vibration-resistant and Heat-insulating Support Structure of Fuel Cylinder for LNG Vehicles (차량용 LNG 연료 용기의 내진동 단열지지구조 설계 및 최적화)

  • Kwon, Hyun-Wook;Hwang, In-Cheol
    • Journal of the Korean Institute of Gas
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    • v.18 no.5
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    • pp.6-11
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    • 2014
  • To optimize the design of fuel cylinder for LNG vehicles, we introduced the design parameters of the inner and the outer tank of the vessel support structure by analyzing the structural characteristics of conventional design. We selected the inner and outer diameter of the hollow support bars and a dimension of the inner structure of the vessel among the design parameters for design optimization. In this study the temperature distribution and thermal stress of the support structure were evaluated by using the utility program as MSC/MARC. The evaluation criteria are first mode natural frequency, total transferred energy through support structure and thermal stress. The developed design satisfied the design criteria and it was made of prototype. The prototype was verified through three-dimensional vibration testing and thermal performance test.