• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.233-234
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• 2009

박막 재료의 면저항 측정은 일반적으로 FPP(Four-Point Probe)원리를 적용한 측정기률 사용하고 있다. 개발된 면저항 측정기의 특징은 dual configuration 기술을 적용하여 탐침 간격에 대한 시료의 크기 및 두께에 대한 보정계수를 고려하지 않아도 되므로 누구나 업고 정확하게 사용 할 수 있다. 측정범위는 $1\;m{\Omega}{/\square}\;{\sim}\;1\;G{\Omega}{/\square}$이며, 반복성과 재현성 및 직선성은 0.1 %이하로서 우수한 특성을 나타냈다. 또한 기존의 면저항 측정기에 적용된 single configuration 기술에서 나타나는 가장자리 효과의 단점을 dual configuration 기술을 적용하여 해결하였고 정밀 정확도를 향상시켰다. 개발된 면저항 측정기의 특성평가는 국가측정표준으로부터 소급성이 유지된 표준저항, 분할저항기, 면저항 인증표준물질 등을 사용하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.2
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• pp.37-42
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• 2005

Recently $6{\sigma}$ quality control is an most important strategy to many enterprises in order to be a top company in the world, because it is an excellent scientific method to achieve the best quality control for their management and products. SY company is a small and medium one that has the quality problem for a long time such as occurring cracks on the surface of commutator at his assembly line while being assembled a rotor shaft and commutator of DC motor. This research was started to improve this problem by $6{\sigma}$ process, and as the results of this study, first, to find three vital fews, second, to get an achievement of about 21% improvement for the fracture strength of commutator, and third, to be recognized to change into $6{\sigma}$ quality control in SY company.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2057_2058
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• 2009

반도체 및 평판표시장치(Flat Panel Display) 공정에서 필수적으로 사용되는 박막 두께 측정기를 개발하였다. 측정방식은 FPP법의 dual configuration 측정원리를 적용하였으며 측정범위는 수 nm ~수십 ${\mu}m$이다. 순수한 금속 박막에 대하여 측정이 가능하며 박막 시료의 표면에 probe를 접촉시키면 두께가 자동 측정 되므로 박막 시료의 측정위치에 관계없이 누구나 쉽고 정확하게 사용할 수 있다. 저항 측정기능에서 재현성과 반복성 및 직선성은 0.1 % 이하의 불확도 범위에서 우수한 특성을 나타냈다.

• Korean Journal of Optics and Photonics
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• v.17 no.1
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• pp.47-53
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• 2006

The Integrated Ballistics Identification Systems (IBIS) is widely used for bullet and casing signature identification. The IBIS obtains a pair of ballistic signatures from two bullets (or casings) using optical microscopy, and estimates a correlation score which can represent the degree of signature match. However, this method largely depends on lighting and surface conditions because optical image contrast is primarily a function of test surface's slope, shadowing, multiple reflections, optical properties, and illumination direction. Moreover, it can be affected with surface height variation. To overcome these problems and improve the identification system, we used well known surface topographic techniques, such as confocal microscopy and white-light scanning interferometry. The measuring instruments were calibrated by a NIST step height standard and verified by a NIST sinusoidal profile roughness standard and a commercial roughness standard. We also suggest a new analysis method for the ballistic identification. In this method, the maximum cross-correlation function CCFmax is used to quantify the degree of signature match. If the compared signatures were exactly the same, CCFmax would be $100\%$.