• 제목/요약/키워드: 초정밀 절삭

검색결과 97건 처리시간 0.022초

초정밀가공기술의 현황과 전망

  • 송지복
    • 한국정밀공학회지
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    • 제10권1호
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    • pp.9-13
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    • 1993
  • Micro-electronics를 핵으로 하는 기술혁신의 물결이 눈부시고, 우리 주변의 일상생활이 하루가 다르게 변해 가고 있다. Leading-edge technology, high technology, advanced technology 등으로 호칭되는 일군의 새로운 기술의 절대적 level이 현재 어디에 위치해 있는지 확인 조차 하기 어렵고 첨단기술 제품의 성능에 넋을 잃을 지경이 지만 고려청자나 이조백자에 대해서는 현재의 기술을 가지고도 그 재현이 곤란하다. 이와 같이 시차의 이중성 속에서 제품의 부가가치를 높이고 생산성을 올리기 위해서는 가공기술의 고도화를 가하지 않으면 안된다. 어떤 소재를 설계된 모양대로 변화시키는 일련의 과정을 가공이라 한다면 이에는 변형가공(주조, 소성가공), 부가가공(용접), 제거가공(절삭, 연삭)등을 생각할 수 있으며 이들 사이의 가공정도의 개략치는 다음과 같다. (그림.1 가공공정에 따른 가공정도) 공작물에 요구되는 가공정도는 시대의 변천과 더불어 level up되고 이를 위한 기술 개발이 부단히 이어오고 있다. 1960-70 년대의 생산가공 기술은 .mu. m 단위인 $10^{-5}$--$10^{-6}$m의 범위의 가공정도를 생산 line으로 실현하는 것이 중점 개발 목표였다. 그러나, 현재는 $10^{-5}$--$10^{-7}$m를 목표로 한 submicron 가공정도 실용기에 들어서고 있다.

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초정밀 가공기를 이용한 적외선 감지소자 HgCdTe의 절삭특성에 관한 연구 (Ultra Precision Machining the Characteristics of IR Detection device HgCdTe)

  • 김효식;양순철;김명상;김건희;이인제;원종호;조병무
    • 한국기계가공학회지
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    • 제6권4호
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    • pp.50-56
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    • 2007
  • This study aims to find the optimal cutting conditions, when are IR Detection device HgCdTe is machined with diamond tool of diamond turning machine. Machining technique for HgCdTe with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. It has been found HgCdTe has more and more important applications in the field of modern optics. The purpose of our research is to find the optimum machining conditions for ductile cutting of HgCdTe and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials.

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Al6061-T651의 초정밀 절삭특성에 관한 연구 (A Study on the Characteristics on Ultra Precision Machining of Al6061-T651)

  • 김건희;양순철;박요창
    • 한국기계가공학회지
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    • 제4권1호
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    • pp.43-48
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    • 2005
  • This paper is described about the technique of ultra-precision machining for an aerospace aspheric mirror. The reflection mirror system generates parallel beams inside a thermal vacuum chamber. A 200mm diameter aspheric mirror was fabricated by SPDTM. Aluminum alloy as mirror substrates is known to be easily machined, but not polishable due to its ductility. Aspheric large reflector without a polishing process, the surface roughness of 10nm Ra, and the form error of ${\lambda}/2$ (${\lambda}$=632.8nm) for reference curved surface 200mm has been required. The purpose of this research is to find the optimum machining conditions for cutting reflector using Al6061-T651 and apply the SPDTM technique to the manufacturing of ultra precision optical components of Al-alloy aspheric reflector.

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습식워터젯을 채용한 초정밀 절삭 가공시스템의 특허동향조사에 관한 연구 (Research for Patent Application Tendency in the Super Fine Machining System Using the Wet Waterjet)

  • 김성민;고준빈;박희상
    • 한국공작기계학회논문집
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    • 제18권1호
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    • pp.1-12
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    • 2009
  • Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

초정밀가공의 파상도 보정시스템에 관한 연구 (A Study on the Waviness Compensation System of Ultraprecision Machining)

  • 김정두
    • 한국생산제조학회지
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    • 제7권6호
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    • pp.132-140
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    • 1998
  • Recently, precision machining technology has been developed continuously in order to make high productivity and quality assurance of the precision parts of several industrial fields. Waviness may occur on the surface of the machined parts due to the table motion error and the dynamic cutting mechanism between the tool and the workpiece. The waviness may fall off the form accuracy of the precision machine parts. In the research, a micro cutting device with piezoelectric actuator has been developed to control precise depth of cut and compensate the waviness on the surface of the workpiece. Experiments have been carried out in the precision lathe. The characteristics of the surface profile and cause of the waviness profile have been analyzed and waviness profiles of some cause have been compared with those of experiments.

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단결정 실리콘의 초정밀가공 (Nano-turning of single crystal silicon)

  • 김건희;도철진;홍권희;유병주;원종호;박상진;안병민
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.939-942
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    • 2000
  • Single point diamond turning technique for optical crystals is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material.

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비구면 초정밀절삭 공정기술에 관한 연구 (A study on Ultra Precision machining process for Aspheric)

  • 김건희;홍권희;김효식;김현배;양순철;윈종호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.90-93
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    • 2003
  • This paper described about the ultra-precision profile measurement of aspheric surfaces using contact probing technique. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime utilizing a circle leaf spring mechanism and a capacitive-type sensor. The, contact probe is attached on the z-axis during measurement while aspheric object are supported on the diamond turning machine(DTM). The machine xz-axis motions are monitored by a set of two orthogonal plane mirror type laser interferometers. Experimental results show that the contact probing technique developed of on-machine measurement system in this investigation is capable of providing a repeatability of 10 nanometers with a $\pm$20 uncertainty of 200nmPv.

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광학소자의 초정밀절삭 특성에 관한 연구 (The Characteristics of Ultra Precision Machining of Optical Crystal)

  • 김주환;박원규;김건희;원종호
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.529-532
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    • 2003
  • Machining technique for optical crystals with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency. poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result. the surface roughness is good when spindle speed is 200m/min. and teed rate is small. The influence of depth of cut is very small.

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다이아몬드 터닝머신을 이용한 금속 비구면 초정밀 절삭특성 (A study of metal aspheric reflector manufacturing in diamond turning machine)

  • 김건희;도철진;홍권희;유병주;원종호;김상석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집C
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    • pp.83-87
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    • 2001
  • A 110 mm diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fabricated by ultra-precision single point diamond turning (SPDT). Aluminum alloy for mirror substrates is known to be easily machinable, but not polishable due to its ductility. A harder material, Ni, is usually electrolessly coated on an Al substrate to increase the surface hardness for optical polishing. Aspheric metal secondary mirror without a conventional polishing process, the surface roughness of Ra=10nm, and the form error of $Ra={\lambda}/12({\lambda}=632nm)$ has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of electroless-Ni coated Al alloy and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

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초정밀 가공기를 이용한 적외선 우주망원경용 렌즈의 절삭가공기술개발 (Ultra-precision Machining of Space Telescope IR Camera Lens)

  • 양순철;김건희;김효식;신현수;홍권희;유종신;김동락;박수종;남욱원
    • 한국기계가공학회지
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    • 제4권2호
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    • pp.31-36
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    • 2005
  • Machining technique for optical crystals with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are studied and regularities of machining process are drawn. Optical crystals have been known to more and more important applications in the field of modern optics. Ge is more brittle material of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of Ge and apply the SPDTM technique to the manufacturing of ultra precision optical components of Ge. As a result, the surface roughness is the best when cutting speed is 180m/min, feed rate is 2mm/min, depth of cut is $0.5{\mu}m$ and nose radius of tool is 0.8mm.

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