• Title/Summary/Keyword: 접착요소

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Two Dimensional Elastic Finite Element Analysis for Fretting Contacts (프레팅 접촉에 대한 2차원 유한요소 탄성해석)

  • Jang Song-Koon;Rho Hong-Rae;Cho Sang-Bong
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1648-1651
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    • 2005
  • Fretting contact and fretting fatigue are known to occur in mechanical devices which have fasteners subjected to oscillatory tangential load. Theoretical studies on fretting contact have been focussed on simple geometries, such as cylindrical contact problem. Recently, the contact problem of a flat rounded punch has been solved theoretically. The purpose of this paper is to show that the results of finite element analysis for the fretting contact problem are nearly consistent with the theoretical solutions.

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유한요소법을 이용한 현수애자의 응력 해석

  • 금영탁;박관흠;유영면;이종원
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.9 no.3
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    • pp.367-372
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    • 1985
  • 본 연구에서는 Heuer는 원추형 애자의 해석을 ANSYS프그램을 사용하여 시도하 였으나 시멘트와 자기간의 접촉문제를 다루지 않았고, Iwama와 Kito는 이에 대한 언급 이 없이 유한요소법에 의한 자기내부의 응력분포 결과와 실험식과를 개략적으로 비교 하였다. Fig. 1은 현수애자의 외관과 단면도이다. 철재의 핀(Pin)과 캡(cap), 자 기, 철재와 자기를 접착시키는 시멘트(cement), 접촉면의 불균일 상태를 보상시키는 역청(bituminous layer), 그리고 시멘트와 자기간의 사층(sand band)으로 구성되어 있 는 현수애자의 핀의 하단에서 송전선 무게의 하중이 가해지고 캡의 홈으로 다른 애자 가 연결되어 송전탑에 부착된다. 본 해석에서는 핀의 하단에 정적으로 사용하중이 가해진다고 가정하였다.

Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.25-30
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    • 2001
  • The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

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Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.14 no.3
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    • pp.309-315
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    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

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The analysis of physical features and affective words on facial types of Korean females in twenties (얼굴의 물리적 특징 분석 및 얼굴 관련 감성 어휘 분석 - 20대 한국인 여성 얼굴을 대상으로 -)

  • 박수진;한재현;정찬섭
    • Korean Journal of Cognitive Science
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    • v.13 no.3
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    • pp.1-10
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    • 2002
  • This study was performed to analyze the physical attributes of the faces and affective words on the fares. For analyzing physical attributes inside of a face, 36 facial features were selected and almost of them were the lengths or distance values. For analyzing facial contour 14 points were selected and the lengths from nose-end to them were measured. The values of these features except ratio values normalized by facial vortical length or facial horizontal length because the face size of each person is different. The principal component analysis (PCA) was performed and four major factors were extracted: 'facial contour' component, 'vortical length of eye' component, 'facial width' component, 'eyebrow region' component. We supposed the five-dimensional imaginary space of faces using factor scores of PCA, and selected representative faces evenly in this space. On the other hand, the affective words on faces were collected from magazines and through surveys. The factor analysis and multidimensional scaling method were performed and two orthogonal dimensions for the affections on faces were suggested: babyish-mature and sharp-soft.

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Finite Element Modeling for Free Vibration Control of Beam Structures using Piezoelectric Sensors and Actuators (압전감지기와 압전작동기를 이용한 보구조물의 자유진동제어에 대한 유한요소 모형화)

  • 송명관;한인선;김선훈;최창근
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.16 no.2
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    • pp.183-195
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    • 2003
  • In this study, the method of the finite element modeling for free vibration control of beam-type smart structures with bonded plate-type piezoelectric sensors and actuators is proposed. Constitutive equations for the direct piezoelectric effect and converse piezoelectric effect of piezoelectric materials are considered. By using the variational principle, the equations of motion for the smart beam finite element are derived. The proposed 2-node beam finite element is an isoparametric element based on Timoshenko beam theory. Therefore, by analyzing beam-type smart structures with smart beam finite elements, it is possible to simulate the control of the structural behavior by applying voltages to piezoelectric actuators and monitoring of the structural behavior by sensing voltages of piezoelectric sensors. By using the smart beam finite element and constant-gain feed back control scheme, the formulation of the free nitration control for the beam structures with bonded plate-tyPe Piezoelectric sensors and actuators is proposed.

Estimation of Bond Performance Improvement by Surface Treatment Equipments and Polymer Content by Boned Concrete Overlays (접착식 콘크리트 덧씌우기 경계면 처리 방식 및 폴리머 혼입률에 따른 부착성능 평가)

  • Jung, Won Kyong;Kim, Hyun Seok;Kwon, Oh Seon;Kim, Hyung Bae
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.36 no.1
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    • pp.39-47
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    • 2016
  • Repair methods of aging concrete pavement are generally used composite structure pavements, such a composite structure is subjected to a large impact on the mechanical behavior and ensure long-term commonality integrated under vehicle loads, environmental loads of the public in accordance with the bond strength between old and new concrete. A common of bonded concrete overlays that are currently available is Interface arrangements using a variety of equipment to ensure the excellent bond strength between old and new concrete than standard concrete, mixed with a material such as a polymer in order to improve the adhesion with the material itself. However, these method of constructions are being applied, depending on the developer site presents no special specifications apply when a specific application criteria objectively, this is due to the situation of each individual method, which is based on the difficulty in quality control of the site manager. In this study by performing a field test for polymer content via the variables that contribute most significantly to ensure bond strength and the field element core of the interface processing method and materials to ensure bond strength between the old and the new concrete, it was to derive the construction site construction method that can improve the performance of the bond strength through a review of the construction around the correlations and the bond strength according to the effective performance analysis of the conventional surface treatment process and variation of polymer volume fraction.

Numerical Simulation of the Delamination Behavior of Polymeric Adhesive Tapes Using Cohesive Zone Element (응집 영역 요소를 이용한 고분자 접착 테이프의 박리거동 모사)

  • Jang, Jinhyeok;Sung, Minchang;Yu, Woong-Ryeol
    • Composites Research
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    • v.29 no.4
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    • pp.203-208
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    • 2016
  • Metal and polymer sandwich composites, which are made of sheet metal sheath and polymer or fiber reinforced plastic core, have been reconsidered as an alternative to sheet metal due to their lightness and multifunctional properties such as damping and sound-proof properties. For the successful applications of these composites, the delamination prediction based on the adhesion strength is important element. In this study, the numerical simulation of the delamination behavior of polymeric adhesive tapes with metallic surfaces was performed using cohesive zone elements and finite element software. The traction-separation law of the cohesive zone element was defined using the fracture energy derived from peel mechanics and experimental results from peel test and implemented in finite element software. The peel test of the polymeric adhesive film against steel surface was simulated and compared with experiments, demonstrating reasonable agreement between simulation and experiment.

The Formaldehyde/VOCs Emission of Particleboard with Cross-linked Vinyl Resin (변성 비닐계 접착제를 이용한 파티클보드의 포름알데히드/VOCs 방산특성)

  • Kim, Ki-Wook;Lee, Se Na;Baek, Bong-San;Lee, Byong-Ho;Kim, Hyun-Joong;Choi, Younmee;Jang, Seong Wook
    • Journal of Adhesion and Interface
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    • v.9 no.1
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    • pp.28-34
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    • 2008
  • This study was used particleboard with urea-formaldehyde resin and cross linking vinyl resin. Manufactured particleboard had high cross linking vinyl resin content that internal bonding strength was low value but flexural strength was increased. For emission test of particleboard using VOC Analyzer, it was confirmed that more cross linking vinyl resin had reduced 4 volatile organic compounds (Toluene, Ethylbenzen, Xylene, Styrene) but also TVOC (Total VOC), 5 VOCs (Benzene, Toluene, Ethylbenzen, Xylene, Styrene) and formaldehyde emissions from manufactured particleboard were also lower emission factor than particleboard with only urea formaldehyde resin.

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Effects of UF Resin and Taro Adhesive Mixture on Plywood Bonding Strength (요소수지(尿素樹脂)와 토란접착제(土卵接着劑) 혼용(混用)이 합판(合板)의 접착력(接着力)에 미치는 영향(影響))

  • Lee, Phil-Woo;Park, Heon
    • Journal of the Korean Wood Science and Technology
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    • v.12 no.1
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    • pp.3-10
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    • 1984
  • Taro-UF mixed type resin system was developed for gluing plywoods. The taro adhesive that was activated with sodium hydroxide was mixed with the definite ratios of UF resin adhesive. At the sametime, wheat-UF mixed type resin was also applied with the same method as taro-UF mixed type resin The mixing ratios of taro or wheat adhesive: UF resin were 0:100, 10:90, 20:80, 30:70, 40:60, 50:50, 60:40, 80:20, and 100:0 by weight. In addition, the UF resins extended with wheat powder at the extending ratios of wheat powder UF resin, 10:90, 20:80, 30:70, 40:60, and 50:50 by weight, were also used. The dry and wet shear strengths of the plywoods of 30:70 (taro adhesive : UF resin) mixing ratio were highest. The dry shear strengths of the plywoods manufactured with the UF resin-mixing taro adhesive were higher than those of the plywoods with the UF resin-mixing wheat adhesive at 10:90, 20:80, 30:70, 40:60, 50:50, and 60:40 (taro or wheat adhesive: UF resin) mixing ratios. At all mixing ratios, the wet shear strengths of the plywoods manufactured with the UF resin-mixing taro adhesive were higher than those of the plywoods with the UF resin-mixing wheat adhesive. The dry and wet shear strengths of the plywoods manufactured with the UF resin-mixing wheat adhesive were higher than those of the plywoods with the wheat powder-extending UF resin at the mixmg ratios, 10:90, 20:80, 30:70, and 40:60 (wheat adhesive or wheat powder: UF resin). So, it was found that the plywoods manufactured with the UF resin-mixing taro adhesive and the UF resin mixing wheat adhesive had better shear strength than the plywoods with the wheat powder-extending UF resin. It was because the taro adhesive and wheat adhesive themselves took the bonding properties after being activated with alkali.

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