• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.7
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• pp.1393-1398
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• 2009

Conventionally, etching is first considered for microelectronics fabrication process and is specially important in process of a-Si:H thin film transistor for LCD. In this paper, we stabilize properties of device by development of wet and dry etching process. The a-Si:H TFTs of this paper is inverted staggered type. The gate electrode is lower part. The gate electrode is formed by patterning with length of 8 ${\mu}$m${\sim}$16 ${\mu}$m and width of 80${\sim}$200 ${\mu}$m after depositing with gate electrode (Cr) 1500 ${\AA}$under coming 7059 glass substrate. We have fabricated a-SiN:H, conductor, etch-stopper and photo resistor on gate electrode in sequence, respectively. The thickness of these thin films is formed with a-SiN:H (2000 ${\mu}$m), a-Si:H(2000 ${\mu}$m) and n+a-Si:H (500 ${\mu}$m), We have deposited n-a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-stopper pattern. The NPR layer by inverting pattern of upper gate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. In the fabricated TFT, the most frequent problems are over and under etching in etching process. We were able to improve properties of device by strict criterion on wet, dry etching and cleaning process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.80-85
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• 2019

Vanadium dioxide is a well-known metal-insulator phase transition material. Lots of researches of vanadium redox flow batteries have been researched as large scale energy storage system. In this study, vanadium oxide($VO_x$) thin films were applied to cathode for lithium ion battery. The $VO_x$ thin films were deposited on Si substrate($SiO_2$ layer of 300 nm thickness was formed on Si wafer via thermal oxidation process), quartz substrate by RF magnetron sputter system for 60 minutes at $500^{\circ}C$ with different RF powers. The surface morphology of as-deposited $VO_x$ thin films was characterized by field-emission scanning electron microscopy. The crystallographic property was confirmed by Raman spectroscopy. The optical properties were characterized by UV-visible spectrophotometer. The coin cell lithium-ion battery of CR2032 was fabricated with cathode material of $VO_x$ thin films on Cu foil. Electrochemical property of the coin cell was investigated by electrochemical analyzer. As the results, as increased of RF power, grain size of as-deposited $VO_x$ thin films was increased. As-deposited thin films exhibit $VO_2$ phase with RF power of 200 W above. The transmittance of as-deposited $VO_x$ films exhibits different values for different crystalline phase. The cyclic performance of $VO_x$ films exhibits higher values for large surface area and mixed crystalline phase.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.8
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• pp.52-59
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• 2007

In this paper, we analyzed and measured implant isolation characteristics for a 1.25 Gbps monolithic integrated hi-directional (M-BiDi) optoelectronic system-on-a-chip, which is a key component to constitute gigabit passive optical networks (PONs) for a fiber-to-the-home (FTTH). Also, we derived an equivalent circuit of the implant structure under various DC bias conditions. The 1.25 Gbps M-BiDi transmit-receive SoC consists of a laser diode with a monitor photodiode as a transmitter and a digital photodiode as a digital data receiver on the same InP wafer According to IEEE 802.3ah and ITU-T G.983.3 standards, a receiver sensitivity of the digital receiver has to satisfy under -24 dBm @ BER=10-12. Therefore, the electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysed and measured results of the implant structure, the M-BiDi SoC with the implant area of 20 mm width and more than 200 mm distance between the laser diode and monitor photodiode, and between the monitor photodiode and digital photodiode, satisfies the electrical crosstalk level. These implant characteristics can be used for the design and fabrication of an optoelectronic SoC design, and expended to a mixed-mode SoC field.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.4
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• pp.378-387
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• 1994

To improve the properties of $PbTiO_3$ thin films successfully grown by thermal diffusion of 3 component layers of $Ti0_2/Pb/TiO_2(900{\AA}/900{\AA}/900{\AA})$ in preceding research, 3, 5, 7, 9, and 11 multilayer structures $(TiO_2/Pb/.../Tio_2)$ with thinner component layer of $200~300 {\AA}$ thick were deposited on Si substrate by RF sputtering, which were followed by RTA to form $PbTiO_3$ thin films. As a result, $PbTiO_3$ single phase was formed above $500^{\circ}C$. When the thickness of component layer reduced and the number of component layers increased, suppression of Pb-silicate and voids formation resulted in relatively sharp interfaces and the film composition became more homogeneous. Relative dielectric constants in MIM structure were independent of the annealing condition, but they increased with increasing thickness of the $PbTiO_3$ thin films. The maximum breakdown field in MIS structure reached 150kV/cm.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.662-668
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• 2018

Most electric rooms are located in the underground spaces of buildings. When a fire occurs in electrical equipment, the fire expands to cable insulation material, resulting in toxic smoke and combustion products. If the smoke and combustion products quickly move vertically and horizontally, the evacuation of occupants and firefighting activities will be hindered. Therefore, it is necessary to design optimal equipment for smoke control in cases of fires in electric rooms. This study analyzes the characteristics of smoke and combustion products in fires in a cubicle-type switchboard in an electric room using PyroSim, which is based on the program Fire Dynamics Simulator (FDS). The fire modeling consists of four scenarios according to the operation mode of the mechanical ventilation equipment, the amount of air supply and exhaust, and the location of the air supply slot. The analysis shows that the mechanical ventilation equipment improves the smoke density, visibility, carbon monoxide concentration, and temperature characteristics. The visibility and temperature characteristics were improved when the air flow rate and the location of the air supply slot from fire defense regulations were applied.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.5
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• pp.689-696
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• 2018

System grounding is applied to the neutral point of a power source to secure the from any abnormal voltage and/or grounding fault. System grounding, which is applied mainly in ships is an ungrounded and resistance grounded system. Vessels using the MV power system with 3.3kV, 6.6kV, and 11kV mainly adopt a high resistance grounding system among the resistance grounding systems. The ground fault accounts for 95% of all faults occurring in the electrical system and when a fault occurs, the line-to-ground voltage of the power system is increased excessively, which adversely affects the onboard insulation system. This study analyzed the variation characteristics of the line-to-ground voltage neutral point according to the degree of ground fault in a resistance ground system applied in vessels. For this purpose, the characteristics of the grounding system were first explained, and the modeling of the neutral point potential of the line-to-ground voltage of the resistance grounding system in the vessels was derived. Finally, this study examined how the line-to-ground voltage, line voltage, and neutral point change according to various variable environments through MATLAB simulations.

• Journal of the Korean Magnetics Society
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• v.14 no.1
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• pp.7-12
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• 2004

The annealing-temperature dependence of magnetic properties in compressed powder cores being composed of ball-milled F $e_{73.5}$C $u_1$N $b_3$S $i_{15.5}$ $B_{7}$ alloy powders (size 250∼850${\mu}{\textrm}{m}$) and 5 wt% of ceramic insulators has been investigated. When annealed at 5$50^{\circ}C$ for 1 h and so transformed to $\alpha$-Fe phase nanocrystalline structure with the grain size of 11 nm (electrical resistivity : 110 $\mu$Ω$.$cm), the highest effective permeability of 125 and quality factor of 53 were obtained, and the permeability persisted up to about 500 KHz. Further the core loss measured at the frequency of 50 KHz and the induction amplitude of 0.1 T was very low (230 mW/㎤). However the dc bias characteristics was not satisfactory as compared to that of conventional powder core materials(MPP, Sendust etc.). The inferior dc bias property of F $e_{73.5}$C $u_1$N $b_3$S $i_{15.5}$ $B_{7}$ alloy powder cores was attributed to the fact that the size of powder was too large for obtaining the same permeability with that of conventional materials.

• Journal of the Korean Magnetics Society
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• v.21 no.3
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• pp.93-98
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• 2011

We successfully grew $La_{0.35}Pr_{0.35}Ca_{0.3}MnO_3$(LPCMO)/$LaAlO_3$(LAO) thin film using Laser Molecular-Beam Epitaxy and studied post-growth annealing effects ($750^{\circ}C$, 5 h) on its crystal structural and magnetic properties. Whereas the single-layered LPCMO and LPCMO/STO superlattice thin films show rough surface before and after the post-growth annealing, LPCMO/LAO superlattice shows a relatively very flat surface even after the post-growth annealing. The enhancement of ferromagnetism of LPCMO/LAO superlattice after the post-growth annealing was remarkable compared to the single-layered LPCMO thin film. The coercive and saturation magnetic field of the single-layed LPCMO thin film were decreased after the post-annealing. However, for LPCMO/LAO superlattice, a same coercive and increased saturation magnetic field were exhibited after post-growth annealing. We suggest that these peculiar observations are originate from the super-structure of LPCMO and LAO.

• Journal of the Korean Magnetics Society
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• v.15 no.3
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• pp.191-197
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• 2005

In the fabrication process of Fe-based amorphous alloy powder cores by pulverization of the melt-spun ribbons and cold compaction, the effects of powder preparation method on the magnetic & electric properties, powder shapes and microstructure of cores have been investigated. The powder cores made by using rotor mill showed low effective permeability as compared to the cores prepared by ball milling. However the frequency dependence and quality factor properties were superior in the case of rotor-milling. Further the powders prepared by rotor mill had homogeneous and round shapes through strong shearing in the sieve ring, while the ball milled powders were inhomogeneous and relatively small. The lower permeability of the powder cores fabricated with rotor mill was considered to be due to the high internal stress occurred by very intensive shearing. Moreover the powder cores produced by rotor-milling showed lower core loss and good frequency dependence of effective permeability possibly due to the higher electrical insulation between magnetic particles. The dc bias property of the powder cores made by rotor-milling was better than the one by ball-milling.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.151-151
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• 1999

금속-산화막-반도체(MOS) 소자를 이용하는 집적회로의 발전은 게이트 금속의 규격 감소를 필요로 한다. 규격감소에 따른 저항 증가가 중요한 문제점으로 대두되었으며, 그동안 여러 연구자들에 의하여 금속 게이트에 관련된 연구가 진행되어 왔다. 특히 저항이 낮으며 녹는점이 매우 높은 내화성금속(refractory metal)인 텅스텐(tungsten, W)이 차세대 MOS 소자의 유력한 대체 게이트 금속으로 제안되었다. 텅스텐은 스퍼터링(sputtering)과 화학기상 증착(CVD) 방식을 이용하여 성장시킬 수 있다. 스퍼터링에 의한 텅스텐 증착은 산화막과의 접착성은 우수한 반면에 증착과정 동안에 게이트 산화막(SiO2)에 손상을 주어 게이트 산화막의 특성을 열화시킬 수 있다. 반면, 화학기상 증차에 의한 텅스텐 성장은 스퍼터링보다 증착막의 저항이 상대적으로 낮으나 산화막과의 접착성이 좋지 않은 문제를 해결하여야 한다. 본 연구에서는 감압 화학기상 증착(LPCVD)방식을 이용하여 텅스텐 게이트 금속을 100~150$\AA$ 두께의 게이트 산화막(SiO2 또는 N2O 질화막)위에 증착하여 물리 및 전기적 특성을 분석하였다. 물리적 분석을 위하여 XRD, SEM 및 저항등이 증착 조건에 따라서 측정되었으며, 텅스텐 게이트로 구성된 MOS 캐패시터를 제작하여 절연 파괴 강도, 전하 포획 메커니즘 등과 같은 전기적 특성 분석을 실시하였다. 특히 텅스텐의 접착성을 증착조건의 변화에 따라서 분석하였다. 텅스텐 박막의 SiO2와의 접착성은 스카치 테이프 테스트를 실시하여 조사되었고, 증착시의 기판의 온도에 민감하게 반응하는 것을 알 수 있었다. 또한, 40$0^{\circ}C$ 이상에서 안정한 것을 볼 수 있었다. 텅스텐 박막은 $\alpha$ 및 $\beta$-W 구조를 가질 수 있으나 본 연구에서 성장된 텅스텐은 $\alpha$-W 구조를 가지는 것을 XRD 측정으로 확인하였다. 성장된 텅스텐 박막의 저항은 구조에 따라서 변화되는 것으로 알려져 있다. 증착조건에 따른 저항의 변화는 SiH4 대 WF6의 가스비, 증착온도에 따라서 변화하였다. 특히 온도가 40$0^{\circ}C$ 이상, SiH4/WF6의 비가 0.2일 경우 텅스텐을 증착시킨 후에 열처리를 거치지 않은 경우에도 기존에 발표된 저항률인 10$\mu$$\Omega$.cm 대의 값을 얻을 수 있었다. 본 연구를 통하여 산화막과의 접착성 문제를 해결하고 낮은 저항을 얻을 수 있었으나, 텅스텐 박막의 성장과정에 의한 게이트 산화막의 열화는 심각학 문제를 야기하였다. 즉, LPCVD 과정에서 발생한 불소 또는 불소 화합물이 게이트의 산화막에 결함을 발생시킴을 확인하였다. 향후, 불소에 의한 게이트 산화막의 열화를 최소화시킬 수 있는 공정 조건의 최저고하 또는 대체게이트 산화막이 적용될 경우, 개발된 연구 결과를 산업체로 이전할 수 있는 가능성이 높을 것을 기대된다.