Surface Morphology and Thickness Distribution of the Non-cyanide Au Bumps with Variations of the Electroplating Current Density and the Bath Temperature (도금전류밀도 및 도금액 온도에 따른 비시안계 Au 범프의 표면 형상과 높이 분포도)
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- Journal of the Microelectronics and Packaging Society
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- v.13 no.4
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- pp.77-84
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- 2006