Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 13 Issue 4
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- Pages.77-84
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- 2006
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Surface Morphology and Thickness Distribution of the Non-cyanide Au Bumps with Variations of the Electroplating Current Density and the Bath Temperature
도금전류밀도 및 도금액 온도에 따른 비시안계 Au 범프의 표면 형상과 높이 분포도
- Choi, Eun-Kyung (Department of Materials Science and Engineering, Hongik University) ;
- Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University) ;
- Englemann, G. (High Density Interconnect and Wafer Level Packaging)
- Published : 2006.12.30
Abstract
Surface roughness and wafer-level thickness distribution of the non-cyanide Au bumps were characterized with variations of the electroplating current density and the bath temperature. The Au bumps, electroplated at
도금전류밀도와 도금액 온도에 따른 비시안계 Au 범프의 표면 거칠기 및 웨이퍼 레벨에서 Au 범프의 높이 분포도를 분석하였다.