• Electrical & Electronic Materials
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• v.7 no.6
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• pp.534-542
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• 1994

Microstructures and dielectric properties of (Sr$_{1-x}$ .Ca$_{x}$)TiO$_{3}$+0.006Nb$_{2}$O$_{5}$ (0.05.leq.x.leq.0.2) ceramic were investigated. The specimens fired in a reducing atmosphere(N$_{2}$) were painted on the surface with CuO paste, and then annealed at 1100.deg. C for 2 hr. SEM and EDAX revealed that CuO penetrated rapidly into the bulk along the grain boundaries during the annealing. Grain size increased with increasing Ca content up to 15[mol%], but decreased with further addition. In the specimens with 10-15[mol%l of Ca, excellent dielectric properties were obtained as follows; dielectric constant <25000, dielectric loss(tan .delta[%]) <0.3[%] and capacitance change rate with temperature <.+-.[%], respectively. All the specimens in this study exhibited dielectric relaxation with frequency as a function of the temperature. The dispersive frequency was over 10$^{6}$ [Hz].z].

• Journal of the Korean Society for Nondestructive Testing
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• v.20 no.4
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• pp.296-304
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• 2000

Radar is becoming a popular tool for condition assessment of concrete structures. The advancement of radar method to concrete structures requires a systematic approach, which incorporates the fundamentals of radar theory and the characteristics of concrete as a material with electromagnetic properties. The research work presented in this paper deals with the establishment of effective measurement area for radar measurements, the determination of concrete thickness using radar, and the calculation of the dielectric constant of concrete from radar measurements. As results, formulas have been suggested to determine optimum measurement area for concrete, using radar and concrete thickness has been successfully identified for specimens used in this work. In the experiments, five concrete specimens which have the dimensions of 900mm (length) $\times$ 600mm (width) with thickness variation from 50mm to 250mm are used.

• Journal of KSNVE
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• v.8 no.6
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• pp.1093-1102
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• 1998

The success of controllability of smart structures depends on the quality of the bonding along the interface between the main structure and the attached sensing and acuating elements. Generally, the analysis procedures neglect the effect of the interfacial bond layer or assume that this bond layer behaves like viscoelastic material. Three different bond layers. two modified epoxy adhesives, and one isocyanate adhesive were prepared for their toughness and moduli. Bond layer of the chosen adhesive provides an almost perfect bonding condition between the composite structure and the PZT while bended significantly like arrow-shape. The perfect bonding condition is tested by considering various material properties of the bond layers. and based on this perfect bonding condition, the effects of the interfacial bond layer on the dynamic behavior and controllability of the test structure is experimentally studied. Once the perfect bonding condition is achieved. dynamic effects of the bond layer itself on the dynamic characteristics of the main structure is negligible. but the contribution of the attached PZT elements on the stiffness of the multi-layered structure becomes significant when the thickness of the bond layer increased.

• Electrical & Electronic Materials
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• v.6 no.2
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• pp.122-128
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• 1993

본 연구에서는 0.45Pb(Fe$_{1}$2/Nb$_{1}$2/)O$_{3}$- (0.55-xPb(Fe$_{2}$3/W$_{1}$3/)O$_{3}$ (x=0.20, 0.25, 0.30) 세라믹을 950~990[.deg.C]에서 2시간 유지시켜 일반소성법으로 제작하였다. 제작된 시편에 대해 적층 세라믹 캐패시터로의 응용가능성을 고찰하기 위해 조성비와 소결온도에 따른 구조적, 유전적 특성을 조사하였다. PMN의 첨가량이 증가할수록 결정립 크기는 감소하였으며 상전이 온도는 증가하였다. 소결밀도는 970[.deg.C]에서 소결된 0.45PFN-0.30PFW-0.25PMN 시편에서 7.86[g/cm$_{3}$]의 최대값을 나타내었다. 유전상수는 990[.deg.C]에서 소결된 0.45PFN-0.25PFW-0.30PMN 시편에서 20,751의 최대값을 나타내었으며 유전손실은 모든 조성에서 5[%]이상을 나타내었다.

• Electrical & Electronic Materials
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• v.9 no.5
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• pp.439-444
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• 1996

0.15(B $a_{0.95}$ S $r_{0.05}$)O-0.15(S $m_{2(1-x}$/N $d_{2x}$) $O_{3}$-0.7Ti $O_{2}$(x=0-10[m/o]) ceramics were fabricated by mixed oxide method. Microwave dielectric properties were investigated with contents of N $d_{2}$ $O_{3}$. In the case of specimen with N $d_{2}$ $O_{3}$(6[m/o]), dielectric constant, quality factor and temperature coefficient of resonant frequency were 78.14, 2938(at 3[GHz]) and +14.19[ppm/.deg. C], respectively. By comparison its properties with undoped specimen, dielectric constant and quality factor were highly improved, but the temperature coefficient of resonant frequency was increased to positive value......

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.572-577
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• 1996

Alternating current and direct current of pure, ball milled, and $Al_{2}$O$_{3}$ added ZnO were investigated by means of complex impedance measurement and voltage-current source measurement unit. The electrical conductivity of A1$_{2}$O$_{3}$ added ZnO samples increases when the content of A1$_{2}$O$_{3}$ is used within 1 at% and decreases when it's used more than that. The increase and decrease of electrical conductivity seem to be the donor effect of $Al_{2}$O$_{3}$ and the increase of the number of ZnO grains, respectively. Impedance spectrum seems to be one semircicle. The size of semicircle increase with increasing the A1$_{2}$O$_{3}$ contents. The calculated dielectric constant(at 50.deg. C) were about 70-140 at the peak of the semicircle. The semicircles seem not to be the resistance of ZnO grain as compared to that of 10 for pure ZnO.

• Journal of IKEEE
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• v.23 no.4
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• pp.1473-1476
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• 2019

Accurate material information is very important in PCB (Printed Circuit Board) design. In an integrated mast of a battleship, heat reduction is essential for stealth functionality. So heat dissipation from internal control equipments should be reduced as much as possible. Control equipments mostly consist of PCBs, but it often suffers from impedance mismatching due to imprecise Dk (Dielectric Constant), which significantly increases heat dissipation. In this paper, measurement methods of Dk is investigated. Also, effects on impedance mismatch by Dk variation with operating frequency is investigated.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.31-34
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• 2013

Based on the structural analysis of cantilever and the piezoelectric effect, we propose a new design of piezoelectric cantilever to harvest maximum vibration energy. Geometric parameters of piezoelectric cantilever are optimized according to two different types of cantilever structure. The main factors that affect the harvesting performance of the cantilever was the shape of the cantilever and the load at the free end. The amount of charge is affected by piezoelectric constant and mechanical strain of the cantilever.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.7 s.166
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• pp.1075-1084
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• 1999

The family of unidirectional continuous fiber reinforced polymeric composites are currently used in automotive bumper beams and load floors. The material properties and mechanical characteristics of the compression molded parts are determined by the curing behavior, fiber orientation and formation of knit lines, which are in turn determined by the mold filling parameters. In this paper, a new model is presented which can be used to predict the 3-dimensional flow under consideration of the slip of mold-composites and anisotropic viscosity of composites during compression molding of unidirectional fiber reinforced thermoplastics for isothermal state. The composites is treated as an incompressible Newtonian fluid. The effects of longitudinal/transverse viscosity ratio A and slip parameter $\alpha$ on the buldging phenomenon and mold filling patterns are also discussed.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.1-6
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• 1998

The dielectric effects of plastic packages on GaAs($\varepsilon$$_{r}$=13) MMIC microstrip characteristics are analyzed using the spectral domain method (SDM). As being packaged by typical FR-4 composites ($\varepsilon$$_{r}$=14.2) for PCB substrates and plastic packages, the characteristic impedance is reduced by about 6 %, but the effective dielectric constant is increased by 13 % from those of bare microstrip, respectively. The parasitic effects of the packaging materials can greatly degrade the performance of the packaged MMIC. We also calculated the optimum microstrip width, which maintains the 50 $\Omega$ matching condition after plastic packaging. These calculated results can be used to optimize the plastic packages, and extend the application ranges for low cost MMIC production.n.