• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.305-305
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• 2008

LTCC는 고주파영역에서 손실이 낮고 적층구조의 모듈제작이 가능하여 고주파용 모듈제작에 응용이 가능하다. 최근 수동소자가 내장된 ASM이나 FEM 등의 모듈은 그 집적도가 높고 기판의 두께가 감소함에 따라 소재의 고강도 특성이 요구되고 있다. 이와 같은 경향에 따라 Anorthite계 결정화 유리로 알려진 300MPa 이상의 고강도를 나타내는 CaO-Al2O3-SiO2계 소재가 선행 연구 과정을 통하여 개발되었다. 본 실험에서는 기 개발된 조성의 고강도 소재를 이용하여 RF부품에 적용하기 위한 테스트 쿠폰을 제작하였다. 고강도 소재를 이용하여 green sheet를 제조하고 수동소자인 R, L, C 등을 기판 내에 내장화 하기위해 LTCC 공정을 이용하여 각 층에 다양한 선폭 및 크기의 패턴을 인쇄한 뒤 적층하여 $900^{\circ}C$에서 소결하였다. 이 과정에서 공정에 대한 적용성이 각 공정별로 평가되었으며 완성된 테스트 쿠폰을 이용하여 소재의 전기적인 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.67-70
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• 2003

단원계 및 이원계 촉매를 이용하여 나노 감지 소자를 합성하였고, 이를 이용하여 가연성 후막 가스 센서를 제작, 촉매 시스템에 따른 가스 감지 특성을 비교하였다. 단원계의 경우 Pd 및 Pt를 각각 3wt%로, 이원계의 경우 Pd:Pt 농도를 1:2~2:1wt%로 각각 제어하여 평균 입도가 15 nm 인 $SnO_2$ 나노 분말에 도핑, 감지물질을 합성하였다. 그 후 감지물질을 paste로 만들어 인쇄, 가스센서 제작 후 $450{\sim}600^{\circ}C$의 온도로 열처리하였다. 그 결과 이원계 촉매 시스템을 가진 가스 센서는 시효 시간에 따라 감도 값이 변하는 불안정한 현상을 나타내었다, 그러나 단원계 촉매의 경우 시효 시간이 지나도 감도 값이 안정된 현상을 나타내었다. 특히 3wt% pt를 도핑하여 $500^{\circ}C$에서 열처리한 경우 5시간 시효 후에도 감도 값의 변화 폭이 3.5% 이하의 매우 안정된 특성을 나타내었고 반응 시간도 20초 이하로 매우 빠른 응답 특성을 나타내었다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.43-48
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• 2022

Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.69-74
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• 2017

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.27-31
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• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• Applied Chemistry for Engineering
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• v.35 no.1
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• pp.61-65
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• 2024

The effectiveness of CuSCN as a hole injection layer in large-area organic light-emitting diodes, organic solar cells, and thin-film transistors has been well demonstrated. Therefore, in this study, the surface, optical, and electrical analyses of CuSCN were carried out according to the solution process conditions in order to propose optimized film conditions. Various CuSCN solution concentrations were prepared to determine the film surface characteristics and to determine whether the film surface affects the electrical performance of the device. When the CuSCN solution concentration was low, the CuSCN film was not formed and coated in the form of islands, and when the solution concentration was increased, the CuSCN film was formed uniformly, which contributed to improving the conductivity of the device. In addition, a hole-only device was fabricated to demonstrate the role of CuSCN as a hole transport layer.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.69-72
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• 2021

Various studies for QLEDs using inkjet printing has been actively conducted. Multilayers in QLEDs need an orthogonal process inevitably using different solvents and it makes the inkjet printing process more difficult and expensive. Therefore, coating two layers in a single process can reduce the fabrication step, resulting in the process time. In this study, we fabricated QLEDs of standard structure using a mixture of emission layer and hole transport layer. The mixed layer was fabricated by dissolving TFB and QDs in chlorobenzene, and the maximum luminance of the device was 45,850 cd/m². It shows the bright future of the electroluminescence devices applied with inkjet printing process.

• Journal of the Korean Applied Science and Technology
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• v.40 no.1
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• pp.71-80
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• 2023

Silver paste is a valuable electrode material for electronic device applications because it is easy to handle with relatively low heat treatment. This study treated the electrode surface using an atmospheric-pressure plasma jet on the silver-paste electrode. This plasma jet was generated in an argon atmosphere using a high voltage of 5.5 to 6.5 kV with an operating frequency of 11.5 kHz. Plasma-jet may be more beneficial to the printing process by performing it at atmospheric pressure. The electrode surface becomes hydrophilic quickly and contact angle variation is observed on the electrode surface as a function of plasma treatment time, applied voltage, and gas flow rate. Also, there was no deviation in the contact angle after the plasma treatment in the large-area sample, that means a uniform result could be obtained regardless of the substrate size. The outcomes of this study are expected to be very useful in forming a stacked structure in the manufacture of large-area electronic devices and future applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.382-393
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• 2024

The Microplotter system with a fluid dispensing method, sprays fluid based on ultrasonic pumping through piezoelectric devices. This technique can possible for various materials with a wide range of viscosities to be printed in microscale. In this paper, we introduces dispenser printing technology as well as aim to understand and apply various processes using the equipment. In addition, we will explain how to optimize the equipment by adjusting parameters such as spray intensity, tip height during printing, and patterning speed. By utilizing Microplotter's advantage of being compatible with a wide range of fluids, including metal nanoparticles, carbon nanotubes, DNA, and proteins, it is expected to be used in various fields such as printed electronics, biotechnology, and chemical engineering.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.3
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• pp.7-11
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• 2011

In this paper, we proposed a simple and high-yield printing process for source and drain electrodes of organic thin film transistor (OTFT). The surface energy of PVP (poly 4-vinylphenol) gate dielectric was decreased from 56 $mJ/m^2$ to 45 $mJ/m^2$ by adding fluoride of 3000ppm into it. Meanwhile the surface energy of source and drain (S/D) electrodes area on the PVP was increased to 87 $mJ/m^2$ by treating the areas, which was patterned by photolithography, with oxygen plasma, maximizing the surface energy difference from the other areas. A conductive polymer, G-PEDOT:PSS, was deposited on the S/D electrode areas by brushing painting process. With such a simple process we could obtain a high yield of above 90 % in $16{\times}16$ arrays of OTFTs. The performance of OTFTs with the fluoride-added PVP was similar to that of OTFTs with the ordinary PVP without fluoride, generating the mobility of 0.1 $cm^2/V.sec$, which was sufficient enough to drive electrophoretic display (EPD) sheet. The EPD panel employing the OTFT-backpane successfully demonstrated to display some patterns on it.