• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.169-170
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• 2008

인공위성의 전장품들은 전장품의 특성에 적합한 전력 형태를 요구하고, 전력계에서는 이러한 다양한 전력 분배 요구에 따라 전력을 공급해야한다. 또한, 전장품의 오동작이 타 전장품에 영향을 미치지 못하도록 차단하는 안전장치를 기본적으로 갖추어야 한다. 본 논문에서는 인공위성의 전장품들이 요구하는 전력 분배 방식을 구분하고, 이에 적합한 안전장치를 갖는 분배 모듈의 설계에 관해 기술한다.

• Bulletin of the Korean Space Science Society
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• 2003.10a
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• pp.105-105
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• 2003

인공위성의 개발과정에서 비행모델을 만들기 전 EM (Engineering Model) 들로 구성하는 Electrical Test Bed (ETB) 를 개발하여 위성의 하니스를 포함함 각 서브시스템 전장품들의 성능을 점검하게 되고, ETB 시험기간 동안 발생된 문제점 들은 비행모델 설계와 제작에 반영하게 된다. 다목적실용위성 2호에 대한 ETB를 개발하여 각종 위성 전장품에 대한 성능과 부분품들간의 인터페이스 신호들의 점검을 성공적으로 완료하였으며, 시험기간 동안 발생된 각종 문제점들은 비행모델 설계와 제작에 이미 반영하였다. 본 논문에서는 다목적실용위성 2호 비행모델에 대한 시험을 위하여 각 서브시스템 즉, 원격측 정명령계, 전력계, 자세제어계의 전장품과 탑재소프트웨어 그리고 각종 시뮬레이터들의 구성과 전기/전자적인 기능시험을 위한 시험항목 및 방법에 대해 고찰하고자 한다.

• Journal of Satellite, Information and Communications
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• v.11 no.3
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• pp.114-118
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• 2016

In this paper, we present the advanced open collector circuit, interface circuit between aerospace electronics. Satellite is composed of a number of electronics, which were provided from various manufacturers. Each company manufactured its own electronics for satellite using its heritage and requirements for their electronics. Therefore each electronics may use different internal supplies. It make a problem between electronics because the supply is different from other electronics, such as the increasing of power dissipation because of the static current and the mismatch of interface voltage, the offset. Proposed circuit can reduce the static current and rising time, and also decrease the useless power dissipation caused by the static current for open collector circuit

• Proceedings of the KIPE Conference
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• 2012.11a
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• pp.121-122
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• 2012

저궤도 인공위성의 전력변환 시스템은 태양전지판에서 생성된 전력을 배터리와 전장품으로 구성된 비조절형 버스로 전압 강하하여 제공한다. 무게, 부피, EMI/EMC 특성에 제한적인 요구조건을 갖는 인공위성의 응용분야에 적용하기 위하여 설계된 강압형 DC/DC 컨버터는 기존의 벅-컨버터와 유사한 동작특성을 보이지만 인턱터를 분리함으로써 입력단에도 연속적인 전류특성을 보이며 두 개로 분리된 인턱터는 부피와 무게에서 이점을 갖추고 있다. 본 논문에서는 연속적인 입출력 전류 특성을 갖는 강압형 컨버터의 동작특성에 대하여 기술한다.

• Journal of computational fluids engineering
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• v.11 no.2 s.33
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• Aerospace Engineering and Technology
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• v.9 no.2
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• pp.57-62
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• 2010

SAR payload of LEO satellite will consume about 150A current. This high current makes the voltage drop between battery, satellite main bus and payload interface, which cannot guarantee the input voltage level of the satellite electrical unit and payload. So, it is necessary to predict the main bus and payload input voltage level when the payload works. In this paper, the worst case analysis of the harness and contact resistance was executed and predicted the voltage drop when the payload works.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.46 no.10
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• pp.876-882
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• 2018

The purpose of this research is to verify the feasibility of Plastic Ball Grid Array (PBGA), one of the most popular chip packaging types for commercial electronics, under strong random vibration occurred in satellite during launch. Experiment were performed by preparing daisy chained PCB specimen, where large size PBGA were surface mounted, and the PCB was fixed to an aluminum frame which is commonly used to install the electronics parts to satellite. Then the entire sample was fixed to vibration tester. The random vibration power spectrum density employed in the tests were composed of two steps, the acceptance level of 22.7 Grms, and qualification level of 32.1 Grms with given period of time. The test results showed no solder cracks, which provided the strong structural integrity and feasibility evidences of the PBGA packaging to aerospace electronics. Numerical analyses were also performed to calculate the solder stresses and analyze their development mechanism.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.