• Title/Summary/Keyword: 우선배향

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RF magnetron sputtering법으로 형성된 ZnO 박막의 RF 파워 및 공정 압력이 미치는 영향

  • Kim, Jong-Uk;Hwang, Chang-Su;Kim, Hong-Bae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.181-181
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    • 2010
  • RF magnetron sputtering을 이용하여 RF power 및 공정 압력에 따라 ZnO 박막을 유리기판 위에 제작하고 구조적, 광학적, 전기적 특성을 조사하였다. 박막 증착 조건의 초기 압력은 $1.0{\times}10^{-6}\;Torr$, 증착온도는 상온으로 고정하였으며 기판은 Corning 1737 유리 기판을 사용하였다. 공정 변수로 RF파워는 25W, 50W, 75W, 100W로 변화시키고, 증착 압력은 20m, 100m, 200m 300mTorr로 변화시켰다. 유리기판 위에 증착된 모든 ZnO 박막에서 (002) 면의 우선배향성이 관찰되었고 RF power가 50 W와 75W 에서 좋은 결정성을 나타내었다. 공정조건별로 제작된 모든 ZnO박막에서 85% 이상의 투과율을 나타내었으며, 증착압력이 증가함에 따라 광학적인 밴드 갭이 증가하였다. Hall 측정 결과 모든 샘플에서 n타입 특성이 확인되으며, 75W와 300mTorr일 때 전기비저항 $3.56\;{\times}\;10^{+1}\;{\Omega}cm$, 전하의 농도 $2.8\;{\times}\;10^{17}cm^{-3}$, 이동도 $0.613\;cm^2V^{-1}s^{-1}$로 반도체 활성층으로 가장 적합한 전기적 특성을 얻었다. RF 파워가 증가하고, 증착압력이 증가할 수록 ZnO 박막 특성이 좋아지는 경향성을 확인하였다.

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Magnetic properties and the shapes of magnetic domain for $CoCr_{16.2}Pt_{10.8}Ta_4$ alloy films with the prior deposition of Ti layer ($CoCr_{16.2}Pt_{10.8}Ta_4$ 합금박막의 Ti 우선증착에 따른 자기적 특성과 자구형상변화)

  • 이인선;김동원
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.1
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    • pp.17-22
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    • 2000
  • A quaternary alloy film of $CoCr_{16.2}Pt_{10.8}Ta_4$was investigated for its magnetic properties and c-axis orientation with and without Ti underlayer. Additional elements such as Ta, Pt have been frequently introduced in CoCr alloy film for perpendicular recording as a means of improving magnetic performance. It has been reported that the addition of Pt and Ta in CoCr increase the coercivity and the magnetic isolation of columnar grains, respectively. However, CoCrPtTa perpendicular magnetic layer should be more increased its perpendicular magnetic anisotropy than at present for the application of ultrahigh recording density. The improvement of underlayers and substrate materials is one of the promised schemes to intensify the perpendicular magnetic anisotropy. In this study, the insertion of Ti underlayer shows the remarkable improvement of c-axis orientation compare with the direct deposition on the bare glass. The mechanism about this effect of Ti underlayer on CoCrPtTa is not to be clarified yet. Meanwhile, it is found that the magnetic domain of CoCrPtTa on 20 nm Ti underlayer has the continuous stripe pattern but the one of CoCrPtTa on 90 nm Ti underlayer shows the discrete mass type from the results of MFM investigation. This phenomenon is to be a distinct evidence that the improvement of perpendicular anisotropy by the adoption of Ti underlayer is originated from the reinforcement of the grain boundary segregation in CoCrPtTa alloy. Moreover, the transition of the M-H hysteresis pattern with the thickness of Ti underlayer indicates that the major contribution of Ti underlayer is not the magnetocrystalline anisotropy but the shape anisotropy due to the formation of uniform columnar grains by the nonmagnetic alloy segregation.

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Effect of Substrate temperatures and Working pressures on the properties of the AI-doped ZnO thin films (기판온도 및 공정압력이 Aldoped ZnO 박막의 특성에 미치는 영향)

  • Kang, Seong-Jun;Joung, Yang-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.3
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    • pp.691-698
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    • 2010
  • In this study Al-doped ZnO (AZO) thin films have been fabricated on Eagle 2000 glass substrates at various substrate temperature ($100{\sim}500^{\circ}C$) and working pressure (10 ~ 40 mTorr) by RF magnetron sputtering in order to investigate the structural, electrical, and optical properties of the AZO thin films. The obtained films were polycrystalline with a hexagonal wurtzite structure and preferentially oriented in the (002) crystallographic direction. The AZO thin films, which were deposited at $T=300^{\circ}C$ for 10 mTorr, shows the highest (002) orientation, and the full width at half maximum (FWHM) of the (002) diffraction peak is $0.42^{\circ}$. The lowest resistivity ($2.64{\times}10^{-3}\;{\Omega}cm$) with the highest cartier concentration ($5.29{\times}10^{20}\;cm^{-3}$) and a Hall mobility of ($6.23\;cm^2/Vs$) are obtained in the AZO thin films deposited at $T=300^{\circ}C$ for 10 mTorr. The optical transmittance in the visible region is approximately 80%, regardless of process conditions. The optical band-gap depends on the Al doping level as the substrate temperature increases and the working pressure decrease. The optical band-gap widening is proportional to cartier concentration due to the Burstein-Moss effect.

Magnetic Properties of $Nd_xFe_{90.98-x}B_{9.02}$ Thin Films Grown by a KrF Pulsed Laser Ablation Method (KrF Pulsed Laser Ablation 법으로 제조한 $Nd_xFe_{90.98-x}B_{9.02}$ 박막의 자기특성)

  • 김상원;양충진
    • Journal of the Korean Magnetics Society
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    • v.7 no.6
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    • pp.299-307
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    • 1997
  • NdFeB films have been grown onto Si(100) substrate by a KrF pulsed laser ablation of the targets of $Nd_xFe_{90.98-x}B_{9.02}$ (x=17.51~27.51) at the substrate temperature of 620~700 $^{\circ}C$ and the laser beam energy density of 2.75~5.99 J/$\textrm{cm}^2$. The films exhibit no preferred orientation, however, good hard magnetic properties were produced from as-deposited condition : $4{\pi}M_s$=7 kG, $4{\pi}M_r$=4 kG, and $H_c$=300~1000 Oe. The depositon rate was not greatly influenced by changing the substrate temperature, but it increases linearly by increasing the beam energy density. The beam energy density of 3 J/$\textrm{cm}^2$ gave the optimal condition to have the highest $4{\pi}M_r$ and $H_c$ as well. The higher content of Nd induces a higher coercivity and $4{\pi}M_r$ at the same time without prominent change in $4{\pi}M_s$.

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Ferroelectric Properties of ErMnO3 Thin Film Prepared by Sol-gel Method (졸겔법으로 제조한 ErMnO3 박막의 강유전 특성)

  • Kim, Yoo-Taek;Kim, Eung-Soo;Chae, Jung-Hoon;Ryu, Jae-Ho
    • Journal of the Korean Ceramic Society
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    • v.39 no.9
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    • pp.829-834
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    • 2002
  • Ferroelectric properties of $ErMnO_3$ thin films deposited on Si(100) substrate using Sol-gel process with metal salts were investigated. $ErMnO_3$ thin films with a (001) preferred orientation were crystallized at 800$^{\circ}C$. The $ErMnO_3$ thin film post-annealed at 800$^{\circ}C$ for 1 h showed the dielectric constant(k) of 26 and the dielectric loss(tan ${\delta}$) of 0.032 at the frequency range from 1 to 100 KHz. The grain size of $ErMnO_3$ thin film post-annealed at 800 for 1 h was 10∼30 nm. The remanent polarization($P_r$) of the $ErMnO_3$ thin films increased with increasing (001) preferred orientation. The $ErMnO_3$ thin films post-annealed at 800$^{\circ}C$ for 1 h showed the remanent polarization($P_r$) of 400 nC/$cm^2$, with the increase of post-annealing time at 800$^{\circ}C$, the coercive field($E_c$) of thin films was lowered because the dense and homogeneous thin films were obtained.

선택적 단결정 & 비정질층의 상분리를 이용한 ultra-slim MgZnO 나노와이어의 밀도조절 및 수직성장 방법

  • Kim, Dong-Chan;Lee, Ju-Ho;Bae, Yeong-Suk;Jo, Hyeong-Gyun;Lee, Jeong-Yong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.22-22
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    • 2009
  • 최근 산화물 반도체와 나노소자 대한 관심이 날로 높아지고 있는 가운데 산화아연(ZnO) 나노구조를 이용한 나노소자 제작이 많이 연구되고 있다. 산화아연은 c축으로 우선 배향성을 가지는 우르짜이트 구조로써, 나노선 성장이 다른 산화물에 비해 용이하고 그 물리적, 화학적 특성이 안정 무수하다. 이러한 산화아연 나노선 제작법 가운데, 유기금속화학기상증착법은 다른 성장법에 비해 결정학적 광학적 특성이 우수하고 성장속도가 빨라 고품질 나노선 성장에 용이한 장비로 각광받고 있다. 하지만 bottom-up 공정을 기반으로 한 나노소자제작에서 몇 가지 문제점을 가지고 있다. 1) 수직형 대면적 성장, 2) 나노선 밀도 조절의 어려움, 3) 기판과의 계면층에 자발적으로 생성되는 계면층의 제거, 4) 고온성장시 precursor의 증발 문제 등이 그것이다. 본인은 이러한 문제점을 해결하기 위해 산화아연 나노구조 성장 시, 마그네슘(Mg)을 도입하여, 각 원소의 함량 분포 정도에 따라 기판 표면에 30nm 두께 미만의 상분리층(단결정+비정질층)을 자발적으로 형성시켰다. 성장이 진행됨에 따라, 아연이 rich한 단결정 층에서는 나노선이 선택적으로 성장하게 하였고, 마그네슘이 rich한 비정질 층에서는 성장이 이루어지지 않게 하였다. 따라서 산화아연이 증발되는 온도영역에서 10nm 이하 직경을 가지는 나노선을 자발적으로 계면층 없이 수직 성장하였다. 또한, 표면의 단결정, 비정질의 사이즈를 Mg 함량으로 적절히 조절한 결과, 산화아연계 나노월 구조성장이 가능하였다.

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Characteristics of W-TiN Gate Electrode Depending on the Formation of TiN Thin Film (W-TiN 복층 전극 소자에서 TiN 박막 형성 조건에 따른 특성 분석)

  • 윤선필;노관종;양성우;노용한;김기수;장영철;이내응
    • Journal of the Korean Vacuum Society
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    • v.10 no.2
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    • pp.189-193
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    • 2001
  • We have characterized physical and electrical properties of W-TiN stacked gate electrode structure with TiN as a diffusion barrier of fluorine. As the $N_2/Ar$ gas ratio increased during sputter deposition, TiN thin films became N-rich, and the resistivity of the films increased. However, the resistivity of W-TiN stacked gate reduced as a result of the crystallization of tungsten with the increase of $N_2/Ar$ gas ratio. On the other hand, tungsten in W-TiN stacked gate structure have the (100)-oriented crystalline structure although TiN films were subjected to annealing at high temperature (600~$800^{\circ}C$). Leakage currents of W-TiN gate MOS capacitors were less than $10^{-7}\textrm{/Acm}^2$ and also were lowered by the order of 2 compared with those of pure W gate electrode.

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Microstructural ananalysis of AlN thin films on Si substrate grown by plasma assisted molecular beam epitaxy (RAMBE를 사용하여 Si 기판 위에 성장된 AIN 박막의 결정성 분석)

  • 홍성의;한기평;백문철;조경익;윤순길
    • Journal of the Korean Vacuum Society
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    • v.10 no.1
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    • pp.22-26
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    • 2001
  • Microstructures of AlN thin films on Si substrates grown by plasma assisted molecular beam epitaxy were analyzed with various growth temperatures and substrate orientations. Reflection high energy electron diffraction (RHEED) patterns were checked for the in-situ monitoring of the growth condition. X-ray diffraction(XRD), double crystal X-ray diffraction (DCXD), and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the microstructure of the films after growth. On Si(100) sub-strates, AlN thin films were grown mostly along the hexagonal c-axis orientation at temperature higher than $850^{\circ}C$. On the other hand the AlN films on Si(111) were epitaxially grown with directional coherencies in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112). The microstructure of AlN thin films on Si(111) substrates, with a full width at half maximum of almost 3000 arcsec at 2$\theta$=$36.2^{\circ}$, showed that the single crystal films were grown, even if they includ a lot of crystal defects such as dislocations and stacking faults.

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n-ZnO/p-GaN 이종접합 LED의 전기.광학적 특성

  • Kim, Jun;Song, Chang-Ho;Sin, Dong-Hwi;Jo, Yeong-Beom;Bae, Nam-Ho;Byeon, Chang-Seop;Kim, Seon-Tae
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.41.1-41.1
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    • 2011
  • 본 연구에서는 MOCVD법으로 사파이어 기판위에 u-GaN를 성장한 후 Mg을 도핑시켜 p-GaN를 성장하고, RF 스퍼터를 이용하여 n-ZnO를 도포하여 n-ZnO/p-GaN 이종접합을 형성한 후 진공증착기를 이용하여 Au/Ni를 증착시켜 발광다이오드(LED)를 제작하고 전기 광학적 특성을 조사하였다. 두께가 500 nm인 u-GaN 위에 성장된 p-GaN의 운반자 농도는 $1.68{\times}10^{17}\;cm^{-3}$ 이었다. 그리고 150, 300 nm 두께의 p-GaN에 대하여 측정된 DXRD 반치폭은 각각 450 arcsec, 396 arcsec 이었고, 상온에서 2.8~3.0 eV 영역에서 Mg 억셉터와 관련된 광루미네센스가 검출되었다. RF 스퍼터링에 의해 0.7 nm/min의 속도로 증착된 n-ZnO 박막은 증착 두께에 따라 비저항이 27.7 $m{\Omega}{\cdot}cm$ 에서 6.85 $m{\Omega}{\cdot}cm$ 까지 감소하였다. 그리고 n-ZnO 박막은 (0002)면으로 우선 배향되었으며, 상온에서 에너지갭 관련된 광루미네센스가 3.25 eV 부근에서 주되게 검출되었다. n-ZnO/p-GaN 이종접합 LED의 전류전압 특성곡선은 다이오드 방정식에 만족하는 특성을 나타내었다. 다이오드 지수는 3 V 이하 영역에서 1.64, 3~5 V 영역에서 0.85이었다. 그리고 5 V 이상 영역에서 공간전하의 제한을 받았으며, 다이오드 지수는 3.36이었다. 한편, 역방향 전류전압 특성은 p-GaN 박막의 두께에 영향을 받았으며, p-GaN 박막의 두께가 150, 300 nm 일 때 각각의 누설 전류는 $1.3{\times}10^{-3}$ mA와 $8.6{\times}10^{-5}$ mA 이었다. 상온에서 측정된 EL 스펙트럼의 주된 발광피크는 430 nm이었고, 반치폭은 49.5 nm이었다.

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FBAR Devices Fabrication and Effects of Deposition Temperature on ZnO Crystal Growth for RF Filter Applications (RF 필터응용을 위한 FBAR 소자제작과 증착온도가 ZnO 박막의 결정성장에 미치는 영향)

  • Munhyuk Yim;Kim, Dong-Hyun;Dongkyu Chai;Mai Linh;Giwan Yoon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2003.05a
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    • pp.88-92
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    • 2003
  • In this paper, the characteristics of the ZnO films deposited on AI bottom electrode and the temperature effects on the ZnO film growth are presented along with the fabrication and their evaluation of the film bulk acoustic wave resonator (FBAR) devices. All the films used in this work were deposited using a radio-frequency (RF) magnetron sputtering technique. Growth characteristics of the ZnO films are shown to have a strong dependence on the deposition temperatures ranged from room temperature to 35$0^{\circ}C$ regardless of the RF power applied for sputtering the ZnO target. In addition, according to the growth characteristics of the distinguishably different micro-crystal structures and the degree of the c-axis preferred orientation, the deposition temperatures can be divided into 3 temperature regions and 2 critical temperatures in-between. Overall, the ZnO films deposited at/below 20$0^{\circ}C$ are seen to have columnar grains with a highly preferred c-axis orientation where the full width at half maximum (FWHM) of X-ray diffraction rocking curve is 14$^{\circ}$. Based on the experimental findings, several FBAR devices were fabricated and measured. As a result, the FBAR devices show return loss of ~19.5dB at resonant frequency of ~2.05GHz.

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