• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.343-351
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• 2008

In this paper, a spiral shaped common mode filter(CMF) embedded in a flexible printed circuit board(FPCB) is proposed for a multi-function cable. The CMF embedded in a FPC cable presents a new concept as a multi-function cable by the common mode rejection characteristics without a surface mounted device(SMD) CMF. The embedded CMF has a wideband common mode rejection bandwidth and an enhanced differential mode characteristics compared to conventional CMFs that use a magnetic material such as a ferrite of high loss. The proposed CMF of 3 turn inductors has a common mode rejection bandwidth from 0.4 GHz to 3.12 GHz and has 1.95 dB at 3 GHz, 6.97 dB at 8 GHz improvements of a differential mode insertion loss compared to the commercial LTCC(Low Temperature Co-fire Ceramics) CMFs.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.187-196
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• 2005

MEMS devices such as a vibratory gyroscope often suffer from a lower yield rate due to fabrication errors and the external stress. In the decoupled vibratory gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, fabricated with SOI (Silicon-On-Insulator) wafer and packaged using the anodic bonding, has a large wafer bowing caused by thermal expansion mismatch as well as non-uniform surfaces of the structures caused by the notching effect. These effects result in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) technology. It uses a silicon wafer and two glass wafers to minimize the wafer bowing and a metallic membrane to avoid the notching. In the packaged SiOG gyroscope, the notching effect is eliminated and the warpage of the wafer is greatly reduced. Consequently the frequency difference is more uniformly distributed and its variation is greatly improved. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.156-156
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• 2003

수평 전기로에서 ZnIn$_2$S$_4$ 다결정을 합성하여 HWE(Hot Wall Epitaxy)방법으로 2nIn2S4단결정 박막을 반절연성 GaAs(100)기판 위에 성장시켰다. ZnIn2S4 단결정 박막은 증발원의 온도를 610 $^{\circ}C$, 기판의 온도를 450 $^{\circ}C$로 성장시켰고 성장 속도는 0.5 $\mu\textrm{m}$/hr로 확인되었다. ZrIn2S4 단결정 박막의 결정성의 조사에서 10 K에서 광발광(photoluminescence) 스펙트럼이 433 nm (2.8633eV)에서 exciton emission스펙트럼이 가장 강하게 나타났으며, 또한 이중결정 X-선 요동곡선(DCRC)의 반폭치(FWHM)도 133 arcsec로 가장 작아 최적 성장 조건임을 알 수 있었다. Hall 효과는 van der Pauw방법에 의해 측정되었으며, 온도에 의존하는 운반자 농도와 이동도는 293K에서 각각 8.51$\times$$10^{17}$ electron/$cm^{-3}$ 291 $\textrm{cm}^2$/v-s였다. ZnIn2S4 단결정 박막의 광전류 단파장대 봉우리들로부터 10 K에서 측정된 $\Delta$Cr(crystal field splitting)은 0.1678 eV, $\Delta$So(spin orbit coupling)는 0.0148 eV였다. 10 K의 광발광 측정으로부터 고품질의 결정에서 볼 수 있는 free exciton 과 매우 강한 세기의 중성 주개 bound exciton등의 피크가 관찰되었다. 이때 중성 주개 bound exciton의 반치폭과 결합 에너지는 각각 9 meV와 26 meV 였다. 또한 Haynes rule에 의해 구한 불순물의 활성화 에너지는 130 meV 였다.다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.349-349
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• 2012

산화제를 이용 기상중합법을 통해 합성되는 고전도도 Poly (3,4-Ethylenedioxythiophene)(PEDOT) 박막은 OTFT, RFID tag, 또는 연성 디스플레이 같은 분야에 다양한 응용 가능성을 가지고 있으며 이로 인해 최근에 연구가 활발히 진행되고 있다. PEDOT박막의 전극소재로써 가능성은 박막의 중합 정도와 표면 형상에 크게 좌우된다. 특히, Si-웨이퍼 기판 위에 산화제의 균일한 도포 및 산화제 자체의 높은 산도 ($pH{\leq}2$)에 따른 부반응의 억제는 기상중합법을 이용한 PEDOT박막의 합성에 있어 매우 중요하다. PEDOT의 효율적인 중합과 균일한 성장을 위해 산화제에 DUDO 와 PEG-PPG-PEG를 첨가한 혼합 산화제 용액을 제조 기상중합 방법을 통해 PEDOT박막을 제작하였다. 그 결과 산화제만을 사용하여 제작된 박막에 비해 전도도가 최대 3,660 S/cm로 향상된 PEDOT 박막이 합성되었다. 이러한 결과는 PEG-PPG-PEG가 산화제 용액의 균일 도포를 향상시키고 Base Inhibitor로 작용하는 DUDO는 PEDOT 성장 시 중합속도를 조절하고 부반응을 최소화 하여 효율적인 공액 이중 결합의 생성을 촉진한데 주로 기인한다. 따라서 그로인해 조밀하며 마이크로 스케일의 기공이 최소화된 PEDOT박막의 합성이 가능하였다. PEDOT박막의 특성 평가에는 4-point probe, optical microscopy, Field Emission-Scanning Electron Microscope, 등이 사용되었으며 또한 전도도의 향상 원인을 분석하고자 ATR-IR Spectrophotometer를 이용하여 합성된 박막의 작용기를 분석하였다. 이러한 고전도도의 PEDOT 박막이 OTFT의 전극소재로 사용된다면 OTFT소자의 성능 향상에 크게 기여 할 것으로 기대된다.

• Korean Journal of Materials Research
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• v.24 no.11
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• pp.632-638
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• 2014

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.212-218
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• 2002

This research is the development of a distributed tactile sensor using PVDF film far the detection of the contact state. The prototype of the tactile sensor with 8$\times$8 taxels was fabricated using PVDF film and flexible circuitry. In the fabrication procedure, the electrode and the common electrode patterns are attached to the both side of the 28${\mu}m$ thickness PVDF film. The sensor is covered with polyester film for insulation. The signals of a contact pressure to the tactile sensor are sensed and processed in the DSP system in which the signals are digitalized and filtered. And the signals are integrated for taking the force profile. The processed signals of the output of the sensor are visualized to take the shape and force distribution of the contact object in personal computer. The usefulness of the sensor system is verified through the sensing examples.

• Korean Journal of Crystallography
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• v.9 no.2
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• pp.96-106
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• 1998

수평 전기로에서 AgInS2 다결정을 합성하여 HWE 방법으로 AgInS2 단결정 박막을 반절연성 GaAs(100) 위에 성장하였다. AgInS2 단결정 박막은 증발원과 기판의 온도를 각각 680℃, 410℃로 성장하였다. 이때 단결정 박막의 결정성이 10 K에서 측정한 광발광 스펙트럼은 597.8 nm(2.0741 eV) 근처에서 엑시톤 방출 스펙트럼이 가장 강하게 나타났으며, 또한 이중결정 X-선 요동곡선(DCRC)의 반폭치(FWHM)도 121 arcsec로 가장 작게 측정되어 최적 성장 조건임을 알 수 있었다. Hall 효과는 van der Pauw 방법에 의해 측정되었으며, 온도에 의존하는 운반자 농도와 이동도는 293 K에서 각각 9.35×1023개/㎥, 2.94×10-2㎡/V·s였다. AgInS2 단결정 박막의 광전류 단파장대 봉우리들로부터 10 K에서 측정된 ΔCr(crystal field splitting)은 0.15eV, ΔSo(spin orbit coupling)는 0.0089 eV였다. 광전도 셀로서 응용성을 알아보기 위해 감도(γ), pc/dc(photocurrent/darkcurrent), 최대허용소비전력(maximum allowable power dissipation: MAPD), 응답시간(response time)등을 측정한 결과, S 증기 분위기에 열처리한 광전도 셀의 경우 γ=0.98, pc/dc=1.02×106, MAPD=312 mW, 오름시간(rise time)=10.4 ms, 내림시간(decay time)=10.8 ms로 가장 좋은 특성을 얻었다.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.34-46
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• 2004

Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.