• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.63-67
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• 2008

3D integration technology has been a major focus of the next generation of IC industries. In this study Si wafer ultra-thinning has been investigated especially for the effect of ultra-thinning on the silicon surface. Wafers were grinded down to $30{\mu}m\;or\;50{\mu}m$ thickness and then grinded only samples were compared with surface treated samples in terms of surface roughness, surface damages, and hardness. Dry polishing or wet etching treatment has been applied as a surface treatment. Surface treated samples definitely showed much less surface damages and better roughness. However, ultra-thinned Si samples have the almost same hardness as a bulk Si wafer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.46-51
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• 2002

A grinding technology is very essential to finish the surface of IT and BT industrial application parts such as wafer, optical connection part and lenses etc. However the finding machine has bead depended on imports. Especially, it is completely imported for machining high precision part relevant to domestic electric and communicational industries. The amount to import grinding machine is about $110milions. It takes about 35% of total import amount of all the machine tools. A domestic finder manufacturer is a very small-scaled bussinessman and research facilities is poor. Recently, it is increasing to demand high speed and precision grinding technology because it brings cost down and value added up. Its further study will be something related to inteligent grinding system fur value added and high precision part. It will make domestic grinding technology to its advanced country level.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.275-281
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• 2010

This research's goal is to process directly aspherics with big sagment and thin center thickness. If we can process directly aspherics with big sagment and thin center thickness, we think it greatly helps to reduce the time of developing optical system. We made very thin glass using diamond grinding whetstone regarding the trace of tool and the detailed drawing of tool super precisive aspherics that has 0.46mm center thickness and over $30^{\circ}$ segment, $0.1{\mu}m$ machining accuracy, 15nm surface accuracy. We think this research's result will be effective to open new market because it is applied not only cell phone optical system but also CCTV robot optical system, internet phone optical system. Also we expect to enhance the super strong brittle precisive process's possibility with super precisive processing technique that achieves 0.46mm glass center thickness as first in the world.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.2
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• pp.48-58
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• 1995

A micro positioning system using piezoelectric actuators have very wide application region such as ultra-precision machine tool, optical device, measurement systen. In order ro keep a high precision displacement resolution, they use a position sensor and feedback the error. From the practical point of view, a high-resolution displacement sensor system are very expensive and difficult to guarantee such sensitive sensors work properly in the hard opera- tion environment of industry. In this study, a micro-positioning grinding table which does not require position sensor but uses piezoelectric voltage feedback, has been developed. It is driven by hystersis-considering reference input voltage which calculated from computer and then uses actuator/sensor characteristics of piezoelectric materials. From the result of experiments we proved a fast and stable response of micro-positioning system and suggested efficient technique to control the piezoelectric actuator. And through grinding experiments, it is revealed that a characteristics of ground surfaces transient to plastic deformation as extremely small depth of grinding.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.5
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• pp.25-33
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• 2000

• 기계와재료
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• v.11 no.4 s.42
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• pp.62-79
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• 1999

• The Safety technology
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• no.35
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• pp.46-47
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• 2000

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.11
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• pp.7-12
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• 2019

Generally, end effectors for automatic robots can use ceramics such as alumina(Al₂O₃) and silicon carbide(SiC). In this study, black alumina was developed and used in the semiconductor field through powder molding press forming. The black alumina can be mass produced.Alumina and black alumina were ground using a plane grinder to apply to the end effector of an automatic robot. The optimal cutting conditionswere found by analyzing the surface roughness(Ra) of black alumina through grinding. The alumina surface roughness is the feed rate was about 0.72 mm/sec, and the number of revolutions was best at 0.4879 ㎛ at 1700 rpm. In addition, the black alumina surface roughness shows a precision of less than 0.2 ㎛ in most cutting conditions. The feed rate was about 0.72 mm/sec, and the number of revolutions was best at 0.1361 ㎛ at 1900 rpm. The surface roughness of black alumina was better than that of alumina by about 0.35 to 0.47 ㎛.

• Journal of the Korean Society for Precision Engineering
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• v.6 no.4
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• pp.11-20
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• 1989

마이크로 일렉트로닉스(Microelectronics)를 중심으로 하는 산업혁명이 진행되고 있는 시점에서 전자, 광학 또는 신소재 부품에 대한 형상과 치수 또는 표면거칠기에 대한 정확도와 정밀도가 엄격하게 요구되고 있다. 예를 들어 경취 재료인 반도체의 웨이화( w-afer), 수정진동자 자기헷트, 비구면렌즈 또는 연질 금속의 레이저빔(Laser Beam) 프린터 용 포리곤 밀러(Polygon Mirror), 자기디스크, 복사기용 드럼(drum), 레저기기용 반사밀러 등 가공정밀도를 향상시키기 위해서는 과거의 가공기술을 대치할 수 있는 새로운 초정밀가공 기술의 도입이 활발하게 진행되고 있다. 경취성 재료의 초정밀가공은 지금까지는 랩핑(lappi- ng), 폴리싱(polishing)의 가공기술이 주체였으나, 최근의 엄격한 부품정밀도에 대응하기 위하여 전가공을 초정밀 연삭가공으로 평면도,표면거칠기, 가공변질층을 향상시키고 다듬질 가공은 폴리싱으로 하여 표면거칠기를 향상시켜야 하는 가공기술이 보급되고 있다. 일반연질 금속의 다듬질가공은 유리지립을 이용하는 랩핑이나 폴리싱으로 다듬질 가공을 진행하고 있었 으나 형상정도와 표면정밀도를 동시에 얻는다는 것이 어렵고 또 가공시간이 너무 길어서 매우 고가인 것이 되고 말았다. 그러나 유리에서 연질금속으로 재료를 전환시키고 저가격화, 양산 화의 요구, 정밀도 향상과 부품의 안정화 등등 여러 이유로서 다아아몬드(Diamond) 공구로 mirror surface 를 만드는 초정밀 경면연삭 가공기술(precision turning with diamond)의 발달 로 이제는 완전히 새로운 가공기술로 대치되고 말았다. 다이아몬드에 의한 초정밀절삭은 공구 끝이 매우 예리하고 마모가 매우 적은 단결정 다이아몬드를 이용하고 절삭가공 기계는 운동정도 를 피가공물에 정확히 전사 시키는 방법이며 따라서 가공기계는 고도의 운동정밀도가 요구되며 그외에 강성, 진동, 열변이, 제어면에서 엄격한 검도가 있어야 한다.

• The Optical Journal
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• s.105
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• pp.49-56
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• 2006

한국광학기기협회에서는‘한·일 광산업 기술협력’을 보다 효율적으로 추진하기 위하여 해마다 일본 연수기관 및 기업에 대한 현장연수를 실시하고 있는 가운데, 올해는 처음으로 지난 8월에 일본정밀공학회(JSPE)에서 주최하는‘차세대 초정밀광학부품 나노가공기술연수’를 실시했다. 연수기관은 일본 센다이 소재의 동북대학(Tohoku University)으로 구리야가와 츠네모토 교수가 교육을 담당했다. 주요 연수 내용으로는 마이크로 광학부품가공/초정밀 비구면 렌즈 가공/전기점성유체를 이용한 비구면 렌즈 코아 연마/특수광학렌즈 SPDT 가공/초고속 가공/마이크로 AJM 가공/마이크로 초음파가공이며 본 고에서는 직접 연수에 참가 못한 독자들을 위해 연수내용을 번역 게재하고자 한다. 이달에는 제1장 연삭가공의 기초 게재를 시작으로 11월호에 이어서 나머지 2,3,4장 교육과정내용을 게재할 예정이다.