• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.24.1-24.1
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• 2011

CMP (Chemical Mechanical Planarization)는 고직접도의 다층구조의 소자를 형성하기 위한 표면연마 공정으로 사용되며, pattern 크기의 감소에 따른 공정 중요도는 증가하고 있다. 반도체 소자 제조 공정에서는 낮은 비용으로 초기재료를 만들 수 있고 우수한 성능의 전기 절연성질을 가지는 산화막을 만들 수 있는 단결정 실리콘 웨이퍼가 주 재료로 사용되고 있으며, 반도체 공정에서 실리콘 웨이퍼 표면의 거칠기는 후속공정에 매우 큰 영향을 미치므로 CMP 공정을 이용한 평탄화 공정이 필수적이다. 다결정 실리콘 박막은 현재 IC, RCAT (Recess Channel Array Transistor), 3차원 FinFET 제조 공정에서 사용되며 CMP공정을 이용한 표면 거칠기의 최소화에 대한 연구의 필요성이 요구되고 있다. 본 연구에서는 알칼리성 슬러리를 이용한 단결정 및 다결정 실리콘의 식각 및 연마거동에 대한 특성평가를 실시하였다. 화학적 기계적 연마공정에서 슬러리의 pH는 슬러리의 분산성, removal rate 등 결과에 큰 영향을 미치고 연마대상에 따라 pH의 최적조건이 달라지게 된다. 따라서 단결정 및 다결정 실리콘 연마공정의 최적 조건을 확립하기 위해 static etch rate, dynamic etch rate을 측정하였으며 연마공정상의 friction force 및 pad의 온도변화를 관찰한 후 removal rate을 계산하였다. 실험 결과, 단결정 실리콘은 다결정 실리콘보다 static/dynamic etch rate과 removal rate이 높은 것으로 나타났으며 슬러리의 pH에 따른 removal rate의 증가율은 다결정 실리콘이 더 높은 것으로 관찰되었다. 또한 다결정 실리콘 연마공정에서는 friction force 및 pad의 온도가 단결정 실리콘 연마공정에 비해 상대적으로 더 높은 것으로 나타났다. 결과적으로 단결정 실리콘의 연마 공정에서는 화학적 기계적인 거동이 복합적으로 작용하지만 다결정 실리콘의 경우 슬러리를 통한 화학적인 영향보다는 공정변수에 따른 기계적인 영향이 재료 연마율에 큰 영향을 미치는 것으로 확인되었으며, 이를 통한 최적화된 공정개발이 가능할 것으로 예상된다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.9
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• pp.1013-1018
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• 2014

Magnetic Abrasive Polishing (MAP) process is a nontraditional method for polishing the surface of workpiece by using the flexibility of tool. At present, a mixture of polishing abrasives and ferrous particles is used as the tool in the MAP process. Previously, an experiment was conducted with different sizes of polishing abrasives with an aim to improve the polishing accuracy. However, the sizes of ferrous particles are also expected to have a dominant effect on the process, warranting a study on the effect of the size of ferrous iron particles. In this study, an experiment was conducted using three different sizes of ferrous particles. Iron powder of average diameters 8, 78 and $250{\mu}m$ was used as ferrous particles. The effect of each ferrous particle size was evaluated by comparing the improvements in surface roughness. The particle size of a ferrous iron was found to play a significant role in MAP and particles of $78{\mu}m$ facilitated the best improvement in surface roughness.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 2002.05a
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• pp.407-412
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• 2002

산업의 급속한 발달과 더불어 정보화 산업과 초정밀 가공분야의 신기술 개발이 활발히 진행되고 있다 최근 표면연마기술은 자동화 기계, 반도체, 원자력, 의료장비, 항공우주 산업 등의 분야에 사용되는 파이프와 실린더 등의 내면을 정밀하고 신속하게 가공하는데 있어서 여러 가지 기술적인 어려움으로 인해 기계 장비 및 가공효율을 저하시키는 요인이 되고 있다.(중략)

• Journal of the Korean Society for Precision Engineering
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• v.14 no.10
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• pp.58-67
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• 1997

Generally, die polishing process occupies about 30 .approx. 50% of the whole die manufacturing time. However, die polshing has not been automated yet, since it needs a great deal of experience and skill. This study aims at development of an expert system for die polishing which gives such optimal parameters as tool and polishing conditions. Through experiments, polishing characteristics such as surface roughness, stock removal and scratch were analyzed quantitatively for each polishing tool, and a knowledge base for the expert system was established. Evaluation tests show that the developed system works well to suggest the optimal polishing conditions and it is very promising.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.1
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• pp.69-77
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• 1997

본 논문은 금형의 마무리 연마 작업을 로봇을 이용하여 자동화하기 위한 오프라인 프로그래밍 시스템개발을 그 내용으로 하고있다. 3차원 자유곡면 형상을 갖는 금형을 연마하기 위한 로봇 작업 경로를 효율적으로 생성하기 위해서는 기존의 교시 방법이 아닌 CAD시스템과 연계된 시뮬레이션 방식의 자동 경로 생성 방법이 요구된다. 본 연구에서 개발된 금형 연마 작업을 위한 오프라인 프로그래밍 시스템은 연마 작업 시뮬레이션을 위한 기하학적 모델링 기능, 로봇의 작업 공간을 고려한 작업장 배치 기능, 연마 로봇의 효율적인 기구학 해, 3차원 그래픽 시뮬레이션, 3차원 물체간의 충돌 검사 기능 및 유기적인 관계형 데이타 베이스 기능 등으로 구성된다. 본 시스템의 시뮬레이션 결과를 로봇의 위치 보정 과정을 거쳐 로봇 작업 프로그램 으로 변환함으로써 최종적으로 실제 연마 작업이 가능한, 정확하고 안전한 로봇 프로그램을 생성하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.276-281
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• 2014

In this research, we describe a force feedback control for industrial robots has been proposed as a system which is suitable to work utilizing pressure sensitive alternative to human. Conventionally, polished surface of the workpiece are recognized, chamfer ridge, machining processes such as deburring, and it is most difficult to automate because of its complexity, has been largely dependent on the human. To aim to build automatic vacuum system robotic force control was gripping the grinding tool, the present study we examined the adaptability to the polishing process to understand the characteristics of the control system feedback signal obtained from the force sensor mainly. Furthermore, as a field, which holds the key to the commercialization, I went ahead with the application to robotic sweeping machine. As a result, the final sweeping utilizing a robot machine to obtain a very good grinded surface was revealed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.12
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• pp.1641-1646
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• 2011

The second-generation magnetic abrasive polishing is one of the nontraditional machining technologies newly developed. Because of the flexibility effect in magnetic abrasive polishing, the precise and mirror like surface can be obtained during this process. In this study, magnetic abrasive polishing process was applied in small grooved surface. As a result, it was seen that the flexible magnetic abrasive tool was effective to remove burrs on the edge of the groove. However, the efficiency of magnetic abrasive polishing at the slot was very low according to increasing depth and width of slot. So, correlation between geometric parameters, such as the depth and width, and surface roughness was evaluated and the minimum width for suitable polishing was found by experimental results.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.5 s.98
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• pp.40-47
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• 1999

In CMP for semiconductor wafer films, the acceptable within-chip planarity, within-wafer and wafer-to-wafer nonuniformity could be achieved by conditioning. The role of conditioning is to remove continuously polishing residues from pad and to maintain the initial pad surface pores. To reach these requirements, the diamond grits disk has been considered as a conventional conditioner. However, we have investigated many defects as scratch on wafers out of diamond grits shedding, contaminations from bonding materials, and pad pore subsidences by over-conditioning. So, this paper studies the effect of ultrasonic vibration in CMP conditioning as a representative. The effect of ultrasonic vibration was certified through ILD, Metal CMP.

• The Journal of Korean Academy of Prosthodontics
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• v.48 no.4
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• pp.287-293
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• 2010

Purpose: This study evaluated the effect of polishing techniques on surface roughness of polymethyl methacrylate (PMMA), as well as the influence of light-cured surface glaze and subsequent brushing on surface roughness. Materials and methods: A total of 60 PMMA specimens ($10{\times}10{\times}5\;mm$) were made and then divided into 6 groups of 10 each according to the polymerization methods (under pressure or atmosphere) and the surface polishing methods (mechanical or chemical polishing) including 2 control groups. The mechanical polishing was performed with the carbide denture bur, rubber points and then pumice and lathe wheel. The chemical polishing was performed by applying a light-cured surface glaze ($Plaquit^{(R)}$; Dreve-Dentamid GmbH). Accura $2000^{(R)}$, a non-contact, non-destructive, optical 3-dimensional surface analysis system, was used to measure the surface roughness (Ra) and 3-dimensional images were acquired. The surface roughness was again measured after ultrasonic tooth brushing in order to evaluate the influence of brushing on the surface roughness. The statistical analysis was performed with Mann-Whitney test and t-test using a 95% level of confidence. Results: The chemically polished group showed a statistically lower mean surface roughness in comparison to the mechanically polished group (P = .0045) and the specimens polymerized under the atmospheric pressure presented a more significant difference (P = .0138). After brushing, all of the groups, except the mechanically polished group, presented rougher surfaces and showed no statistically significant differences between groups. Conclusion: Although the surface roughness increased after brushing, the chemical polishing technique presented an improved surface condition in comparison to the mechanical polishing technique.