• Composites Research
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• v.19 no.4
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• pp.7-14
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• 2006

Interfacial shear strength between epoxy and carbon fiber has been analyzed utilizing the microbond specimen with an epoxy micro-droplet adhered onto single carbon fiber. The interfacial shear stress distributions along the fiber/matrix interface were calculated by finite element analysis using three kinds of finite element models such as droplet model, circular-crosssection model and pull-out model. Conclusions were obtained as follows. (1) Interfacial shear stress distribution showed that larger stresses were concentrated in the fiber/matrix interface for microbond test than for pull-out test. Thus, debonding at the fiber/matrix interface during microbond test was liable to occur at low load level. (2) Microbond test showed higher interfacial strength which was caused by various effects of micro-droplet geometry and size as well as stress concentration in the region contacting with the micro-vise tip.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.64.1-64.1
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• 2011

LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

• Journal of the Korea Concrete Institute
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• v.23 no.2
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• pp.235-244
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• 2011

Failures of segmental bridges have been attributed to the inadequate joint connection techniques, which led to corrosion of the post-tensioned tendons connecting the segmental joints. The principal objective of this study is to evaluate the performances of the in-situ cast joint and epoxy applied shear key joints as a function of shear and ultimate strengths. Furthermore, shear behavior and strength of shear key joints in ultra high performance precasted concrete segmental bridges are experimentally evaluated to understand its shear failure behavior. The test parameters of shear key shape and type, load-displacement relations, cracking behavior, concrete strength, and fracture modes are considered in the study. Also, several parameters which influence the mechanical behavior of the shear key joint are analyzed. Based on the study results, the optimal shear key shape and joint type are proposed for the joint design and analysis guidelines.

• Composites Research
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• v.21 no.2
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• pp.25-30
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• 2008

A hemispherical microbond specimen adhered onto single carbon fiber has been proposed for evaluating the interfacial shear strength between epoxy and carbon fiber. Hemispherical microbond specimens showed low interfacial shear strength data and its small standard deviation as compared with the droplet one, which seemed to be caused by the reduction of the meniscus effects and of the stress concentration in the region contacting with the tip of pin hole. In comparison with the droplet specimen the hemispherical specimen showed the shear stress distribution similar to the cylindrical one in that low stress concentration arose around the contacting region. Average interfacial shear strength obtained by the hemispherical ones represented a good correlation with the hardness of the epoxy matrix.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.30 no.3A
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• pp.221-228
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• 2010

External bonding of carbon fiber reinforced polymer (CFRP) sheets has been widely accepted as a popular method for strengthening of deteriorated RC structures. The long-term behavior of CFRP-strengthened RC structure is often affected by that of the interface between CFRP sheets and concrete. This study aims at applying a viscoelastic model to describe the creep behaviour of the adhesive layer bonding CFRP sheet to concrete, the CFRP-concrete interface. Reviews of available models on concrete creep behavior have been first carried out and then new FE analysis model is proposed. The proposed FE analysis model based on the maxwell model has been verified by previous experimental results. It is shown that the creep effect of interfacial adhesive layer is very important on the long-term behavior of concrete structures strengthened with CFRP.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.64-68
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• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.

• Journal of Korean Society of Steel Construction
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• v.18 no.2
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• pp.251-259
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• 2006

In some cases, wooden structures are used for medium-rise buildings. It is therefore necessary to develop and test a new structural system for medium-rise buildings using wooden structures. This study deals with high-performance, laminated, timber-based composite members, which consist of structural laminated timber and H-beam. Simple beam tests were performed to determine the strength, stress distributions, and failure patterns of laminated timber. The main parameters are the insertinglength (1, 1.5, and 2 times the H-beam height) and the epoxy between the top/bottom flange of the H-beam and the top/bottom flange of the laminated timber. The results of the test show that the specimen with an inserting length that is 2 times the H-beam height was characterized by fairly god strength and stiffness.

• Journal of Conservation Science
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• v.26 no.1
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• pp.61-67
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• 2010

After selecting five types of adhesive epoxy resin for metallic cultural assets such as $Araldite^{(R)}$ rapid type, $Devcon^{(R)}$, $Araldite^{(R)}$ SV427+HV427, $CDK^{(R)}$520, $Araldite^{(R)}$ AW106+HV953 which had already been studied, this paper approached more closely the problem of yellowing and the signal of aging with time passing by connecting the problems with the safety of metallic cultural assets. The change of physical properties according to the change of state of epoxy adhesives was investigated through the change of flexural strength and the change of surface hardness by artificially providing the possible environmental change factors such as ultra-violet ray, and acid base, and how the epoxy chemically changes in its ingredients by the environment was analyzed through FT-IR. As a result of the experiment, for the most part of adhesives brought about the physical change of flexural strength, the change of surface hardness, and the chemical change of chemical ingredients as the product of alcohol, which were respectively different according to the time of ultraviolet irradiation, and acid base change. Under most of the conditions, SV427+HV427 and $CDK^{(R)}$520 were fairly stabilized under each condition of weatherability, but it seems that they should be refrained from being applied in case that the area to restore is thin and wide because the degree of flexural strength of themselves is low. Also, it is found that the preservation environment is very important not only for artifacts but also for the preservation of resins sused for preservation treatment.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.97-103
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• 2014

Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.