• Title/Summary/Keyword: 에폭시수지 경화도

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Effect of Cationic Initiator Content on Electron-beam Curing of Difunctional Epoxy Resin (양이온 개시제 함량이 2관능성 에폭시 수지의 Electron-beam 경화에 미치는 효과)

  • Soo-Jin Park;Gun-Young Heo;Jae-Rock Lee;Dong Hack Suh
    • Journal of the Korean Chemical Society
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    • v.47 no.3
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    • pp.250-256
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    • 2003
  • In this work, the effect of cationic initiator content on the electron-beam (EB) curing process of diglycidylether of bisphenol-A (DGEBA) resin was studied using near-infrared spectroscopy (NIRS), thermogravimetric analysis (TGA), and critical stress intensity factor $(K_{IC})$. Benzylquinoxalinium hexafluoroantimonate (BQH) were used as an initiator and its content was varied from 0.5 to 3 phr. NIRS measurements showed that the hydroxyl group of EB-cured epoxy resin was increased with increasing the BQH content. Thermal stability and $K_{IC}$ value of EB-cured epoxy resin were increased with increasing the BQH content but were decreased above 2 phr content. These results could be attributed to the decrease of the conversion and degree of crosslinking. In another word, the conversion and degree of crosslinking were restricted by the incomplete network structure from high reactivity at the BQH content above 2 phr, resulting in decreasings of thermal stability and $K_{IC}$.

The Properties of Rheology of Underwater-Hardening Epoxy Resin According to the Temperature (온도에 따른 수중경화형 에폭시수지의 레올로지 특성)

  • Jung Eun-Hye;Kang Cheol;Kawg Eun-Gu;Bae Kee-Sun;Lee Dae-Kyung;Kim Jin-Man
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2006.05a
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    • pp.49-52
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    • 2006
  • Epoxy resin has less reaction shrinkage, has better water proofing and thermal resistance than other repairing materials, to it has been applied broadly to repair and finish buildings and infrastructures. Although the ambient temperature constructed is varied with the seasons and epoxy resin has to mix with appropriate hardener due to the non self-hardening, as the real construction of it, the ambient temperature is ignored and the blending ration of epoxy resin and hardener is fixed. Also, because of the hardening time is aimed to temperature condition and the tolerance of blending ratio, we investigated the variation of viscosity according to ambient temperatures and hardener ratios. As a results of study, we can select the economical blending ratio of the epoxy resin and hardener according to site situation.

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Synthesis and Cure Behaviors of Diglycidylether of Bisphenol-S Epoxy Resins (Diglycidylether of Bisphenol-S 에폭시 수지의 합성 및 경화거동에 관한 연구)

  • 박수진;김범용;이재락;신재섭
    • Polymer(Korea)
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    • v.26 no.4
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    • pp.501-507
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    • 2002
  • In this work, diglycidylether of bisphenol-S (DGEBS) epoxy resin was prepared by alkaline condensation of bisphenol-S (BPS) with epichlorohydrin (ECH) in the presence of NaOH catalyst. The structure of the synthesized DGEBS epoxy resin was confirmed by IR, NMR spectra, and elemental analysis. The curing reaction and glass transition temperature ($T_g$) of DGEBS epoxy resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) at curing agents were studied by dynamic differential scanning calorimetry (DSC). The thermal stability of the cured specimen was investigated by thermogravimetric analysis (TGA). As a result, the activation energy ($E_a$) of DGEBS/PA system was higher than that of DGEBS/THPA system, whereas $T_g$, initial decomposed temperature (IDT), and decomposition activation energy ($E_t$) of DGEBS/PA were lower than those of DGEBS/THPA. This was probably due to the fact that the crosslinking density of DGEBS/THPA was increased by ring strain of curing agent.

Recent Trend for Performance Improvement of Epoxy Resin (에폭시 수지의 물성 향상을 위한 최근 동향)

  • Jang, Jyong-Sik
    • Applied Chemistry for Engineering
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    • v.2 no.4
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    • pp.301-310
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    • 1991
  • Epoxy resins have been widely used for many applications along with good processibility. However, epoxy resin systems have poor hot/wet performance properties and brittleness after resin curing and have limited to apply for environmental resistant materials. In order to improve the toughness of epoxy resin, this review article deals with incorporation method of rubber and high performance thermoplastics into the matrix resin. In addition, molecular design of epoxy resin and modification of thermoplastic have been introduced for improving hot/wet properties of epoxy resin.

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Mechanical Properties of Epoxy-Modified Mortars and Concretes without Hardener (경화제 무첨가 에폭시 시멘트 모르터 및 콘크리트의 역학적 성질)

  • 조영국;소양섭
    • Magazine of the Korea Concrete Institute
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    • v.8 no.3
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    • pp.157-165
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    • 1996
  • The purpose of this study is to develop the epoxy-modified mortars and concretes without hardener having a good balance between performance and cost. In this study, the epoxy-modified and concretes without and with the hardener are prepared with various polymer-cement ratios, and tested for the mechanical properties of the epoxy-modified mortars and concretes without and with the hardener. From the test results, the epoxy-modified mortars and concretes without the hardener having an excellent mechanical properties are developed at low polymer-cement ratios of 10 to 20% compared with those of conventional epoxy-modified mortars and concretes with the hardener.

A Study of Relations of Chain Lengths and Properties for Bifunctional linear DGEBF/Linear Amino (EDA, HMDA) Cure Systems (선형 이관능성 DGEBF/선형아민(EDA, HMDA) 경화계의 경화제 사슬길이와 물성과의 관계에 대한 연구)

  • Myung In-Ho;Lee Jae-Rock
    • Composites Research
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    • v.17 no.6
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    • pp.37-43
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    • 2004
  • To determine the effect of chain length and chemical structure of linear amine curing agents on thermal and mechanical properties, a standard bifunctional linear DGEBF epoxy resin was cured with EDA and HMDA having amine group at the both ends of main chain in a stoichiometrically equivalent ratio in condition of preliminary and post cure. From this work, the effect of linear amine curing agents on the thermal and mechanical properties is significantly influenced by numbers of carbon atoms of main chain. In contrast, the results show that the DCEBF/EDA system having two carbons had higher values in the thermal stability, density, shrinkage (%), grass transition temperature, tensile modulus and strength, flexural modulus and strength than the DGEBF/HMDA system having six carbons, whereas the DGEBF/EDA cure system had relatively low values in maximum ekothermic temperature, maximum conversion of epoxide, thermal expansion coefficient than the DGEBF/HDMA cure system. These findings indicate that the packing capability (rigid property) in the EDA structure affects the thermal and mechanical properties predominantly. It shows that flexural fracture properties have a close relation to flexural modulus and strength.

The characteristics of thermal expansion and electrity on the epoxy hardening of $Sb_{2}O_{3}$ filler to use for electric lastallation (전기설비용 $Sb_{2}O_{3}$충전 에폭시 경화제의 열팽창 및 전기적 특성)

  • 이보호;박동화;송경화;황명환
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.5 no.2
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    • pp.58-66
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    • 1991
  • This paper measured the characteristic of the thermal expansion, dielectric and conductivity to use $Sb_2O_3$ Filler in epoxy resin.The results are summarized as follow : 1 ) In the [$155^{\circ}C$] 1, The coefficient of thermal expansion increasing temperature obtained 8.19 in the case of pure epoxy resin and $4.5{\times}10^{-5}$ in the case of the mixing 7[%].2) The peak point of $\varepsilon\iota, \varepsilon\rho$ increasing $Sb_2O_3$ mixing ratio moved on the part of the high temperature. 3) The conductivity value increasing temperature shows the corner on the part of the Tg and it's Value became low the sample material with mixing I[%] than in case of pure epoxy resin.

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Wettability Evaluation of Resin on the Glass Fabric (유리섬유직물에 대한 수지의 젖음성 평가)

  • Han, Seung-Wook;Choi, Nak-Sam;Lee, Min-Soo;Ahn, Hung-Kun
    • Composites Research
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    • v.24 no.2
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    • pp.30-37
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    • 2011
  • Analysis of wettability between epoxy resin and glass fabric was studied. The mixing ratios of epoxy resin and anhydride hardener were varied as 1:0.5, l:l and l:1.2. Catalyst content was fixed as 0.1wt% of the mixed resin. A curing analysis by differential scanning calorimeter(DSC) showed a possible impregnation of the mixed resin at the room temperature. An effective contact angle of the mixed epoxy resin drop onto the glass fabric being preset on a flat glass plate was measured as a function of time. The wet area of the epoxy resin drop was also measured. Behaviors of the contact angle, the droplet height, the neat wet area and the coefficient of wettability were used to evaluate the wettability of the epoxy resin onto the glass fabric. It was concluded that the equivalent ratio of 1: 1.2 was the most suitable for the wettability.

Study on the Preparation of the Phosphoric Flame retardent for the EMC (EMC용 반응형 인계 난연 수지 개발)

  • Ahn, Tae-Kwang;Kim, Han-Byung;Ryu, Kum-Sook
    • Proceedings of the KAIS Fall Conference
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    • 2009.05a
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    • pp.372-375
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    • 2009
  • 반도체 봉지재란 실리콘 칩, 골드와이어, 리드프레임 등의 반도체 소지를 열, 수분, 충격으로부터 보호하기 위해 밀봉하는 재료로서 EMC(Epoxy Moding Compound)가 가장 많이 쓰인다. EMC는 기계적, 전기적 성능향상을 위한 무기재료로 실리카(Silica), 열에 의해 경화되어 3차원 경화구조를 형성하는 에폭시수지, 빠른 경화특성을 부여하기 위한 경화제로서의 페놀수지, 유기재료와 무기재료 사이의 결합력을 높이기 위해 커플링제, 카본블랙, 이형성 확보를 위한 왁스(Wax), 착색제(Colorant), 난연제(Flame Retardant)등의 첨가제로 구성되는 복합소재로써 본 연구에서는 에폭시의 유형에 따른 용융 실리카를 주충진재로 하여 각각의 봉지재의 첨가제를 기준으로 할 때 다양한 형태의 친환경 비할로겐계 반응형 난연제를 합성하는 기술을 개발하고 비 할로겐계 및 Sb 계 첨가형 난연제의 혼용 배합을 통해 친환경 EMC용 난연제의 제조기술을 개발하였다. 이들 EMC의 요구특성은 요구특성은 외부환경으로부터 칩 보호, 칩을 전기적으로 절연특성 유지, 칩의 작동시 발생되는 열의 효과적인 방출 특성 유지, 실장(Board Mounting)의 간편성 특성을 확보해야 하는 특성을 지니고 있어 이들 요구특성에 적합한 특성조사가 함께 이루어졌다.

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