• Title/Summary/Keyword: 에폭시수지 경화도

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Investigation of Compressive Strength and Foaming Characteristics of Acid Anhydride Epoxy Foam by Foaming Agent (발포제에 따른 산무수물계 에폭시 폼의 압축강도 및 포밍특성 분석)

  • Kwon, Dong-Jun;Kim, Jong-Hyun;Park, Sung-Min;Kwon, Il-Jun;Park, Joung-Man
    • Composites Research
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    • v.31 no.4
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    • pp.133-138
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    • 2018
  • Polymer foams were used to fill the void in the structure in addition to flame retardant and heat insulation. Polymer foams such as polyurethane, polyisocyanurate, poly(vinyl chloride), polyethylene terephthalate were used to weight lighting materials. In this study, epoxy foam was used to improve mechanical properties of polymer foam. Acid anhydride type hardener reacts with polyol. Using this phenomenon, if blowing agent was added into epoxy resin using acid anhydride type hardener, formation and compressive properties of epoxy foam was studied. Formation of polymer foam was compared with type of blowing agent and concentration of blowing agent via compressive test. As these results, optimized condition of epoxy foam was found and epoxy foam had better compressive property than other polymer foam.

Cure Behaviors and Fracture Toughness of PEl/Difunctional Epoxy Blends (PEI/DGEBA 블랜드계의 열적특성 및 파괴인성)

  • Park, Soo-Jin;Jin, Sung-Yeol;Kaang, Shinyoung
    • Journal of Adhesion and Interface
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    • v.4 no.3
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    • pp.33-40
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    • 2003
  • In this work, diglycidyl ether of bisphenol A (DGEBA)/polyetherimide (PEI) blends were cured using 4,4-diaminodiphenyl methane (DDM). And the effects of addition of different PEI contents to neat DGEBA were investigated in the thermal properties and fracture toughness of the blends. The contents of contents of containing PEI were varied in 0, 2.5, 5, 7.5, and 10 phr. The cure activation energies ($E_a$) of the cured specimens were determined by Kissinger equation and the mechanical interfacial properties of the specimens were performed by critical stress intensity factor ($K_{IC}$). Also their surfaces were examined by using a scanning electron microscope (SEM) and the surface energetics of blends was determined by contact angles. As a result, $E_a$ and $K_{IC}$ showed maximum values in the 7.5 phr PEI. This result was interpreted in the increment of the network structure of DGEBA/PEI blends. Also, the surface energetics of the DGEBA/PEI blends showed a similar behavior with the results of $K_{IC}$. This was probably due to the improving of specific or polor component of the surface free energy of DGEBA/PEI blends, resulting in increasing the hydrogen bonding of the hydroxyl and imide groups of the blends.

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Cure Konetics and Mechanism of DGEBA-MDA-Malononitrile System (Malononitrile로 개질된 DGEBA-MDA계의 경화반응 속도론 및 반응 메카니즘)

  • Im, Seong-Su;Jo, Seong-U;Yu, Hui-Yeol;Sim, Mi-Ja;Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.3 no.3
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    • pp.215-222
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    • 1993
  • Malononitrile(MN) as a reactive additive was added to Diglycidyl ether of bisphenol A (DGEBA)/Methylene dianiline (MDA) system in order to modify a thermosetting epoxy resin. Cure ki. netics and cure mechanism of this modified system were investigated by using DSC(differential scanning calorimetry) and FT-IR(fourier transform infrared spectrometry). Cure kinetics gave an information that the DGEBA/MDA system modified with MN should cure at over $110^{\circ}C$ after curing at about $80^{\circ}C$ for the complete curing. The activation energy of the first cure was nearly constant and that of the second cure was increased as the MN content was increased. Cure mechanism for the system was investigated with the samples cured every $30^{\circ}C$, from $80^{\circ}C$ to $170^{\circ}C$, for Ihr. It was known that the cure reactions of the epoxy-diamine system were composed of PA -E, SA - E and E-OH reactions. Beside these three reactions, in the DGEBA/MDA/MN system PA-CN and CN-OH reaction was found.

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Cure Kinetics and chemorology of silica filled DGEBA/Polyxoypropylenediamine epoxy system (무기물이 충진된 에폭시수지의 경화반응과 유변학적 거동에 관한 연구)

  • 윤은상;이기윤;김대수
    • Proceedings of the Materials Research Society of Korea Conference
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    • 1994.11a
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    • pp.125-126
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    • 1994
  • The chemorheological changes and kinetics during curing reaction of an silica filled epoxy system (DGEBA with curing agent Polyxoypropylenediamine) were investigated. This study concentrates on the influence of silica on the reaction kinetics and rheological behavior of the eopxy system. The concentration of the filler was varied 0~200phr. Curing behavior of the silica filled epoxy system was measured at various heating rates with DSC. Conversion was also measured by integrating the obtained DSC curve and Kinetic parameters measured by using the nonlinear regression method. DSC experiments showed that the presence of silica was found to accelerate the progress of the curing reaction and of reduce the heat of reaction compared with that of unfilled epoxy systems . Rheological experiments were conducted on a Physica by using a disposable parallel plate fixture. Material properites were measured such as the elastic modulus(G′), the loss modulus(G"), the loss tangent(tan $\delta$), and the viscosity was at the initial stahe, and the more the silica filler was added, and the lower the gel temperature was in the epoxy system. In this study it is concluded that the curing of the silica filled epoxy system was found to be accelerated, as silica was added to the epoxy compound.

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DGEBA-MDA-SN-Hydroxyl Group System and Composites -Cure Kinetics and Mechanism in DGEBA/MDA/SN/HQ System- (DGEBA-MDA-SN-Hydroxyl계 복합재료의 제조 -DGEBA-MDA-SN-HQ계의 경화반응 속도론 및 메카니즘-)

  • Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.5 no.3
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    • pp.517-523
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    • 1994
  • The effects of cure kinetics and mechanism of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline) with SN(succinonitrile) and HQ(hydroquinone) as an additive and accelerator were investigated. Cure kinetics was evaluated by Kissinger equation and fractional-life method through DSC analysis. The activation energy has hydroxyl group as an accelerator, the activation energy and the starting cure-temperature were lower than those of DGEBA/MDA/SN system. Cure mechanism of those systems was investigated through FT-IR according to the various SN contents. The ratio was SN : HQ = 4 : 1. It has been known that the cure reactions of an epoxy-diamine system are composed of primary amine-epoxy reaction, secondary amino-epoxy reaction and epoxy-hydroxyl group reaction. But in DGEBA/MDA/SN system, primary amino-CN group reaction and CN group-hydroxyl group reaction were added to the above mentioned reactions. These reactions attributed to the long main chain and the low crossliking density. And in DGEBA/MDA/SN/HQ system, hydroxyl group of HQ formed a transition state with epoxide group and amime group and also opened the ring of the epoxide group rapidly, then amino-epoxy reaction took place easily.

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Cure Kinetics of Natural Zeolite/Epoxy Composites (천연 제올라이트/에폭시 복합재료의 경화반응 속도론)

  • Lee, Jae-Young;Chun, In-Sook;Shim, Mi-Ja;Kim, Sang-Wook
    • Applied Chemistry for Engineering
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    • v.7 no.2
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    • pp.387-392
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    • 1996
  • Natural zeolite/epoxy resin composites were prepared and the cure kinetics was studied by dynamic DSC analysis. With the increments of natural zeolite content, the reaction starting temperature and the exothermic peak temperature were decreased. When diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/malononitrile(MN, 10phr) was filled with 20phr of zeolite, DSC thermogram had one peak and when it was filled with 30phr of zeolite, a shoulder appeared on the DSC thermogram. With the filling of 40phr of zeolite, DSC thermogram was separated into two peaks and the activation energy of the first peak, $Ea_1$ was 12.30 kJ/mol and that of the second peak, $Ea_2$ was 12.70 kJ/mol.

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Analysis of Insulating Reliability in Epoxy Composites (Epoxy 복합체의 절연 신뢰도 해석)

  • 임중관;천민우;박용필
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2001.10a
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    • pp.724-728
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    • 2001
  • In this study, the dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. The dielectric breakdown characteristics origin in epoxy composites were examined and various effects of dielectric breakdown on epoxy composites were also discussed. As a result, first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. And the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since this suggests that silane coupling agent improves interfacial combination and relaxs electric field concentration. Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1%, the applied field value needed to be under 21.5㎹/cm.

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Evaluation of Electrical Degradation in Epoxy Composites by DC Dielectric Breakdown Properties (DC 절연파괴 특성을 이용한 Epoxy 복합체의 전기적 열화 평가)

  • 임중관;박용필
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.11a
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    • pp.779-783
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    • 2002
  • The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. As a result, first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. And the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since this suggests that silane coupling agent improves interfacial combination and relaxs electric field concentration. Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1%, the applied field value needed to be under 21.5MVcm.

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Kinetics of Anhydride Curing of Epoxy : Effect of Chain Length of Anhydride (에폭시 무수화물 경화의 동력학적 연구: 무수화물의 사슬 길이 효과)

  • Chung, I.;Lee, J.
    • Elastomers and Composites
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    • v.40 no.1
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    • pp.3-11
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    • 2005
  • The ruling kinetics of epoxy resins with 3 different kinds or alkenylsuccinic anhydride (ASA) having C-8, C-12, and C-16 pendant side chain length with two different catalysts was studied by using differential scanning calorimetry (DSC). Nonisothermal and isoconversional method has been used for characterizing the effect of the pendant side chain length in the curing process. Results or nonisothermal method showed that there was no significant difference in the effect of the pendant side chain length of ASA. But isoconversional analysis showed that the value of the activation energy for the initiation reaction or C-8, C-12, and C-16 were $61.7{\sim}57.7kJ/mol$, $63.0{\sim}57.3 kJ/mol$, and $130.4{\sim}94.2 kJ/mol$, respectively, depending on the catalyst used. The values of activation energy for the initiation is different as reported value of 20 kJ/mol which indicating the difference in the effect of the pendant side chain length of ASA in the initial stage of the reaction.

Development of Surface Improvement Technique of Japanese Larch flooring Board(I) (낙엽송 마루판재의 표면강화처리기술개발(I))

  • Park, Sang-Bum
    • Journal of the Korean Wood Science and Technology
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    • v.27 no.3
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    • pp.31-38
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    • 1999
  • This paper deals with a coating technique of hardening surface layer of softwood{Larix leptolepis) flooring board to improve its surface properties such as hardness and abrasion resisitance without spoiling its exellent qualities such as beautiful color tones and great strength. For surface hardening of the wood, polyurethane wood sealer was used as under coat, polyurethane sanding sealer as intermediate coat, and UV-curing epoxy acrylate and urethane acrylate varnishes as top coat. The hardness of the wood was improved by the coating treatment and it was similar to that of high density hardwood such as oak, keruing. The abrasion resistance of the coated wood was greatly improved by UV curing epoxy acrylate or urethane acrylate varnishes. Adhesion properties and impact resisitance of the coated wood surface were also good. It was suggested that the well-coated larch wood could be used as interior flooring board as substitute for hardwood such as keruing.

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