• Title/Summary/Keyword: 압착공정

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A study on the Thermal Filter Press for the Reduction of Pigment Sludge (안료 슬러지 감량화(減量化)를 위한 열필터프레스 기술(技術)에 관한 연구(硏究))

  • Lee, Jung-Eun;Lee, Jae-Keun
    • Resources Recycling
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    • v.18 no.3
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    • pp.55-61
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    • 2009
  • Dewatering process to remove water from pigment sludge was important in the diverse aspects of the improvement of product quality, curtailment of the drying cost and the transportation. It was difficult to dewater pigment particles with the mechanical forces because the size was fine under $5{\mu}m$. Thermal filter press dewatering equipment composed of squeezing plate and a fixed heating plate was developed to improve the dewaterability of pigment the sludge as supplying the heat from the fixed heating plate to the cake. Several tests that estimate the dewaterability for pigment sludge as with or without squeezing process and the difference of dewatering time was conducted with this equipment. Dewaterability of thermal dewatering under squeezing process was increased about 20% compared with non squeezing process. Under squeezing process, thermal dewatering tests changing dewatering time with 70 and 80 minute were conducted respectively. The water content of cake was more reduced at dewatering time of 80 minute compared with 70 minute, and dewatering velocity was also decreased, which caused the productivity of thermal filter press to drop. It was observed that clogging of filter cloth didn't almost occur because the liquid was discharged from cake layer easily. In this research, it was resulted that the squeezing process and long dewatering time were effective to improve the dewaterability of pigment sludge. So, this thermal filter press equipment was useful for dewatering the fine particle sludge like pigment.

대형 강괴의 업셋팅공정시 기공압착에 관한 연구

  • Park, Chi-Yong;Jo, Jong-Rae;Yang, Dong-Yeol;Kim, Dong-Jin;Park, Il-Su
    • Transactions of Materials Processing
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    • v.1 no.2
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    • pp.20-31
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    • 1992
  • 대형 강괴의 업셋팅 공정은 주조 조직의 방향성을 없애고, 코깅작업의 효율을 향상시키기 위한 충분한 단조비를 확보하기 위하여 필요한 공정이다. 공정에 영향을 주는 인자로써 상부 금형의 형상을 변화시켜 가면서 해석을 수행하였다. 극단적인 긴 파이프성 기공의 변형거동과 중심부에서 높이에 따른 원형기공의 닫힘거동 및 압하율과 기공폐쇄 정도를 관찰하였다. 충분한 단조비를 얻고 기공의 닫힘 및 압착을 이루기 위한 적절한 압셋팅 다이의 선택 및 업셋팅 공정을 예측하여 공정개선에 기여하고자 한다.

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Study on Characteristics of Cold-pressed Sesame Oil and Virgin Sesame Oil (냉 압착 참기름과 볶음 압착 참기름의 품질 특성)

  • Kim, Bum-Keun;Lim, Jeong-Ho;Cho, Young-Sim;Park, Kee-Jai;Kim, Jong-Chan;Jeon, Jin-Woong;Jeong, Seong-Weon
    • Journal of the East Asian Society of Dietary Life
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    • v.18 no.5
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    • pp.812-821
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    • 2008
  • The characteristics of cold-pressed sesame oil (CPSO), virgin sesame oil (VSO), commercial heat-press extracted sesame oil (CHPESO) and commercial supercritical fluid extracted sesame oil (CSFESO) were investigated. The total phenolics of CPSO, VSO, CHPESO and CSFESO were 31.27, 68.33, 60.65 and 31.44 mg/100 g, respectively. Their $\gamma$-tocopherol contents were 32.82, 31.66, 29.26 and 26.87 mg/100g, respectively. The sesamol, sesamin, and sesamolin contents of VSO were the highest. The oxidation induction period (4.53 hr) of CPSO was lower than that of VSO, CHPESO and CSFESO (19.90, 16.50, and 12.23 hr, respectively). CPSO was rapidly oxidized during storage at $60^{\circ}C$ in the dark, and its peroxide value (POV) was increased about 14 times. Although there were few differences in electron-donating abilities at low concentrations (below 100 mg%), VSO showed the highest electron-donating abilities at higher concentrations (77.76% at 10,000 mg%). Contents of linolenic acid and oleic acid were $40.35{\sim}43.98$ and $31.59{\sim}33.46\;g$/100 g, respectively. CPSO contained the highest amount of oleic and linoleic acid among the variously extracted sesame oil.

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Numerical Analysis of Warpage Induced by Thermo-Compression Bonding Process of Cu Pillar Bump Flip Chip Package (수치해석을 이용한 구리기둥 범프 플립칩 패키지의 열압착 접합 공정 시 발생하는 휨 연구)

  • Kwon, Oh Young;Jung, Hoon Sun;Lee, Jung Hoon;Choa, Sung-Hoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.41 no.6
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    • pp.443-453
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    • 2017
  • In flip chip technology, the conventional solder bump has been replaced with a copper (Cu) pillar bump owing to its higher input/output (I/O) density, finer pitch, and higher reliability. However, Cu pillar bump technology faces several issues, such as interconnect shorting and higher low-k stress due to stiffer Cu pillar structure when the conventional reflow process is used. Therefore, the thermal compression bonding (TCB) process has been adopted in the flip chip attachment process in order to reduce the package warpage and stress. In this study, we investigated the package warpage induced during the TCB process using a numerical analysis. The warpage of the TCB process was compared with that of the reflow process.

열압착 공정을 통해 형성된 나노와이어와 금속전극간의 기계적/전기적 접촉특성 분석

  • Lee, Won-Seok;Park, In-Gyu;Lee, Ji-Hye
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.536-536
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    • 2012
  • 나노와이어는 센서, 메모리소자, 태양전지등과 같은 다양한 소자로 응용이 되고 있다. Bottom-up 방법으로 길러진 나노와이어들을 금속전극 위에 정렬 및 접합시킬 때, 나노와이어와 금속전극간의 기계적 접합강도와 안정적인 전기적 특성이 매우 중요하다. 본 연구에서는 열압착 공정과 솔더전극(Cr/Au/In/Au, Cr/Cu/In/Au)을 사용함으로써, 나노와이어를 금속전극에 압입시켜 강한 기계적 접합강도와 안정적인 전기적 특성을 얻을 수 있는 공정을 제안하였다. 나노와이어와 금속 전극간의 접합부 분석을 위해 scanning electron microscopy (SEM)와 transmission electron microscopy (TEM)을 이용하였으며, 기계적 특성은 lateral force microscopy (LFM), 전기적 특성은 semiconductor analyzer (Keithley 4200-SCS)를 사용하여 측정하였다. 접합강도 측정결과 lateral force가 나노와이어에 가해질 때 나노와이어가 파괴되는 힘에서도 나노와이어와 금속전극간의 접합부파괴가 일어나지 않았다. 또한 나노와이어와 금속전극간의 전기적 접촉특성은 안정적인 ohmic contact을 이루었다.

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Fabrication of edible gelatin-based films by heat pressing (열 압착을 이용한 가식성 젤라틴 필름 제조)

  • Kim, Eui Hyun;Song, Ah Young;Min, Sea Cheol
    • Korean Journal of Food Science and Technology
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    • v.54 no.2
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    • pp.179-184
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    • 2022
  • In this study, edible films made of fish and mammalian gelatins were produced using heat pressing, and their physical properties were investigated. Transparent and smooth films were formed continuously and uniformly using a mixture of fish skin gelatin (FG) or mammalian gelatin (MG), glycerol, and water under the process of heat pressing at 90℃ and 20 MPa for 5 min. Heat-pressed FG films possessed lower light transmittance and tensile strength than heat-pressed MG films; however, their appearance, surface morphology, water vapor permeability, lightness, and redness were not different from those of heat-pressed MG films. Although heat-pressed FG films had lower tensile strength, they had a flatter and more uniform surfaces and demonstrated higher transparency and moisture barrier properties compared to the casted FG films. These results demonstrate the potential utility of heat pressing for the large-scale production of edible films using both FG and MG.

Benzo(a)pyrene Reduction in Sesame Oil Using Microwaving Method (Microwaving을 이용한 참기름의 Benzo(a)pyrene 저감화)

  • Oh, Sung-Cheon
    • Journal of the Korean Applied Science and Technology
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    • v.29 no.2
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    • pp.323-329
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    • 2012
  • Sesame oil has superior oxidation stability and unique roasting flavor. Accordingly, this has been used for edible oil as well as a seasoning material for a long time in Korea. But sesame oil is a simple pressed oil, unrefined. During manufacturing process of roasting-expression, benzo(a)pyrene[B(a)P] formed as a strong carcinogenic substance causes a social problem. Detection of B(a)P in sesame oil was due to residual content in raw-sesame seeds and formation in roasting-expressing process. Especially, maximal forming process was roasting. Accordingly, in this study applied the traditional roasting method by roaster and microwaving method as a new type. Best roasting time by microwaving was for 5~10 min, B(a)P content in sesame oil was 0.53~0.79 ${\mu}g/kg$. These B(a)P contents showed 1/2 level than direct roasting method by roaster. As a result, B(a)P contents in sesame oil appeared the difference of more than 2 times according to roasting condition of sesame seed. For minimizing of B(a)P content in sesame oil is demanded roasting of sesame by microwaving than direct roasting by roaster.

The Purification of Korean Traditional Soybean Sauce by Ultrafiltration Membrane (한외여과막을 이용한 재래식 간장의 정제)

  • 신재균;장재영;김정학;황기호
    • Proceedings of the Membrane Society of Korea Conference
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    • 1994.04a
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    • pp.24-25
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    • 1994
  • 한식간장은 콩을 주원료로 하여 콩속의 성분을 수용성단백질 및 아미노산으로 변화시켜만든 조미료로서, 콩으로 메주를 만든다음 20일 동안 배양해서 만든 종국(Seed)과 혼합후 발효시킴으로써 제조되며 발효공정을 통해 Total Nitrogen이 증가되게 된다. 이러한 한식간장은 탈지대두를 사용하는 양조간장과는 달리 메주를 쑤어서 만들기 때문에 탈지가 되지 않은 제조과정으로 인하여 여과 및 공정중 발생하는 잡물질의 제거가 어렵게 된다. 제조공정중 여과공정을 거치게 되는데 여과포를 사용한 압착공정으로 이루어지며 여과된 간장에는 발효에 사용된 균$\cdot$효모등이 $10^7$개/ml 수준으로 존재하여 저장안정성 및 품질보전을 위해 열처리 과정을 거치게 된다. 이 열처리가 끝난 간장은 방치$\cdot$냉각시켜 첨가제를 혼합한 후 포장된다. 냉각과정중 2차 침전물이 생성되기도 하며 멸균이 확실치 않거나 2차 오염등으로 인한 발효로 인해 $CO_2$ Gas가 발생하기도 하여 품질이 나빠지는 원인이 된다. 이러한 열살균방식은 에너지를 많이 소비하고 열살균시 간장성분으로 인한 Scale 형성등 문제점을 안고 있다. 또한 열살균을 통해 살균은 할 수 있지만 사균, 분해물질, 간장에 함유된 고약한 냄새를 풍기는 잡성분의 제거는 불가능하다.

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Benzo(a)pyrene Contents in Commercial Vegetable Oils and Changes during Processing of Vegetable Oils (국내 유통 식용유지 및 식용유지 종류별 제조 공정에 따른 벤조피렌 함량)

  • Sung, Tae-Kyung;Lee, Ji-Soo;Lee, Hyeon-Gyu
    • Korean Journal of Food Science and Technology
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    • v.44 no.3
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    • pp.269-273
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    • 2012
  • The principal objective of this study was to estimate the benzo(a)pyrene contents in commercial vegetable oils available in the Korean market and to assess the effects of various processing steps for vegetable oils on the contents of benzo(a)pyrene. Benzo(a)pyrene content in the studied commercial vegetable oils, crude oils, and raw materials were found to be lower than the maximum levels of 2 ppb. In both refined and pressed oil, the benzo(a)pyrene contents can be reduced through refining steps. However, an evident increase of benzo(a)pyrene contents during both the expeller process for corn oil and the roasting process for sesame oil was observed. This result indicates that the processing procedure, particularly heat treatment and refining steps would be critical in managing the benzo(a)pyrene contents in vegetable oils.