• The KSFM Journal of Fluid Machinery
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• v.13 no.2
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• pp.24-29
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• 2010

This paper presents a study on the performance of NASA Rotor 37 with the casing grooves based on three-dimensional numerical analysis. Reynolds-averaged Navier-Stokes equations are solved on a hexahedral grid with the shear stress transport model as a turbulence closure model. The governing equations are discretized by a finite volume method. The validation of the numerical results is performed through experimental data for the total pressure ratio and the adiabatic efficiency. The investigation for an axial compressor with a smooth casing and the casing grooves is carried out to compare the performance parameters, for example, surge margin and efficiency, etc. The surge margin is improved in the case of the casing grooves while remarkable improvement of the efficiency is not produced. The result shows that the casing groove is beneficial to expand the operating range of NASA Rotor 37.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• 한국전산유체공학회:학술대회논문집
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• 2004.10a
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• pp.65-68
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• 2004

The design procedure for centrifugal blower with high inlet resistance is not presented yet. Overall fluid dynamic performance is estimated for comparison between the case of atmospheric inlet condition and the present model. Detail information between blades is prepared by using a commercial program, SCRYU-Tetra. A centrifugal blower with large inlet pressure is adopted in an air purifier having filtering devices. As the inlet residence increases the flow rate of the system is decreased. In parallel, outlet area of the system affects the performance of the system in the sense of flow balance. Consequently, the flow balance between the inlet and outlet becomes an important parameter for the design of the scroll casing for the centrifugal blower with high inlet pressure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1693-1696
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• 2003

In this paper, input-output velocity transmission characteristics of the Casing Oscillator, which is a constructional machine with 4 degree of freedom are examined. After the Jacobian matrix is decomposed into linear part and angular part, the linear and the angular velocity transmission characteristics are analyzed and visualized in easy way even in the case of 3 dimensional task space with 4 variables. Regarding the measure of dexterity of the Casing Oscillator, the kinematic isotropic index and the manipulability measures which are respectively represented the isotropy and the volume of the manipulability ellipsoid are combined. A performance of the Casing Oscillator is evaluated by the combined manipulability measure.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.585-588
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• 2002

Pump casing has blockage effects on Impeller flow in a centrifugal pump such that the flow field around volute tongue has quite large change when the impeller rotates. A double suction pump is widely used in industrial world because it has lower NPSH required than a single suction pump. Thus, in this study, the interaction between impeller and volute casing has been investigated by using CFD for a double-suction centrifugal pump. Quasi-steady method and full pump model has been employed for the numerical calculation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.7
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• pp.904-914
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• 2004

In this paper, input-output velocity and force transmission characteristics of the Casing Oscillator which is a construction machine with 4 degrees of freedom are examined. After the Jacobian matrix is decomposed into the linear part and angular part, the velocity and force transmission characteristics for the linear and angular workspace are easily analyzed and visualized even if the Casing Oscillator has the spatial dimensional workspace with 4 DOF. Regarding the manipulability measure of the Casing Oscillator, the kinematic isotropic index and the manipulability measure which represent the isotropy and volume of the manipulability ellipsoid, respectively, are combined to coincidently consider them with respect to equivalent ranges and fluctuations. A performance of the Casing Oscillator is evaluated by the newly proposed manipulability measures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1836-1839
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• 2003

This paper describes the surface polishing characteristics of a flat and free surface ferromagnetic substance(SM45C) that magnetic abrasive polishing processed. The effects of the various working factors on the surface roughness are clarified by experiments respectively, such as magnetic flux density. rotation speed of magnetic head. working gap, feed rate of workpiece. diameter of magnetic abrasives. and shape of workpiece. On the basis of these experiments, the polishing mechanism is discussed and the characteristics of the polishing process are described. In addition, it is found experimentally that die ＆ mold surfaces are also polished precisely by this process

• Journal of the Korean Society for Precision Engineering
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• v.30 no.2
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• pp.148-153
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• 2013

This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.21-28
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• 2008

The final polishing process is based on slurry, pad, conditioner, equipment. Therefore, the concept of wafer final polishing is also necessary for repeatability of results between polished wafers. In this study, the machining conditions have a pressure, table speed, machining time and slurry ratio. This research investigated the surface characteristics that apply variable machining conditions and response surface methodology was used to obtain more flexible and optimumal condition base on Taguchi method. On the base of estimated response surface curvature from the equation and results of Taguchi method, combined design of experiment was considered to lead to optimumal condition. Finally, polished wafer was obtained mirror like surface.