Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Vibration Electrochemical Polishing for Localized Surface Leveling

미세표면 평활화를 위한 진동 전기화학 폴리싱

  • Kim, Uksu (Department of Advanced Parts and Materials Engineering, Chosun Univ.) ;
  • Kim, Youngbin (Department of Advanced Parts and Materials Engineering, Chosun Univ.) ;
  • Park, Jeongwoo (Department of Mechanical Design Engineering, Chosun Univ.)
  • 김욱수 (조선대학교 첨단부품소재공학과) ;
  • 김영빈 (조선대학교 첨단부품소재공학과) ;
  • 박정우 (조선대학교 기계설계공학과)
  • Received : 2012.12.15
  • Accepted : 2012.12.21
  • Published : 2013.02.01
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Abstract

This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

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References

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